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npj Flexible Electronics 2020年第1期4卷 185-192页

作者： Albert JJMvan Breemen Matthias Simon Olivier Tousignant Santhosh Shanmugam Jan-Laurens van der Steen Hylke B.Akkerman Auke Kronemeijer Walter Ruetten Rob Raaijmakers Lex Alving Jan Jacobs Pawel E.Malinowski Florian De Roose Gerwin H.Gelinck holst centre/tno EindhovenThe Netherlands Philips Research EindhovenThe Netherlands Philips Healthcare BestThe Netherlands imec LeuvenBelgium Department of Applied Physics Technical University EindhovenEindhovenThe Netherlands Teledyne Dalsa EindhovenThe Netherlands

A curved image sensor on plastic foil has been developed for cone beam computed tomography(CBCT)X-ray *** image sensor of about 6×8 cm^(2) size has been built on a thin polyimide foil with an indium gallium zinc oxide(IGZO)backplane and an organic photodetectors(OPD)frontplane.A flexible cesium iodide(CsI)scintillator has been attached to the optical sensor with 480×640 pixels of 126µm *** current density of the OPD was low with less than 10^(−7) mA/cm^(2) at−2 V,while an external quantum efficiency(EQE)of about 50%was reached in the visible wavelength range matched to the scintillator *** image quality of the digital X-ray detector allowed for 3D reconstruction images of a bone phantom on a rotating stage with a lab *** curved detector with 32 cm curvature radius opens up the path for very compact CBCT gantries with largely reduced footprint.

关键词： curved curvature allowed

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Precision in harsh environments

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Microsystems & Nanoengineering 2016年第1期2卷 61-72页

作者： Paddy French Gijs Krijnen Fred Roozeboom Faculty of Electrical Engineering Mathematics and Computer ScienceTU DelftDelftThe Netherlands Faculty of Electrical Engineering Mathematics and Computer ScienceTwente UniversityEnschedeThe Netherlands Eindhoven University of Technology Department of Applied PhysicsPO Box 5135600 MBEindhovenThe Netherlands tno holst centre High Tech Campus 215656 AEEindhovenThe Netherlands

Microsystems are increasingly being applied in harsh and/or inaccessible environments,but many markets expect the same level of functionality for long periods of *** environments cover areas that can be subjected to high temperature,(bio)-chemical and mechanical disturbances,electromagnetic noise,radiation,or high *** the field of actuators,the devices must maintain stringent accuracy specifications for displacement,force,and response times,among *** new requirements present additional challenges in the compensation for or elimination of *** state-of-the-art precision devices lose their precision and reliability when exposed to harsh *** is also important that advanced sensor and actuator systems maintain maximum autonomy such that the devices can operate independently with low *** next-generation microsystems will be deployed in remote and/or inaccessible and harsh environments that present many challenges to sensor design,materials,device functionality,and *** of these aspects of integrated sensors and actuator microsystems require a multidisciplinary approach to overcome these *** main areas of importance are in the fields of materials science,micro/nano-fabrication technology,device design,circuitry and systems,(first-level)packaging,and measurement *** study examines the challenges presented by harsh environments and investigates the required *** of successful devices are also given.

关键词： atomic layer deposition harsh environments micro/nano-fabrication technology packaging sensors

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