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Combined anisotropic and cyclic constitutive model for laser powder bed fusion fabricated aluminum alloy

Chinese Journal of Aeronautics 2025年第1期38卷 165-184页

作者： Fei-Fan LI Jihong ZHU Weihong ZHANG Shifeng WEN Jingwen SONG Jun MA Gang FANG state IJR center of Aerospace Design and Additive manufacturing School of Mechanical EngineeringNorthwestern Polytechnical UniversityXi’an 710072China research&Development Institute of Northwestern Polytechnical University in Shenzhen Shenzhen 518063China School of Materials Science and engineering Northwestern Polytechnical UniversityXi'an 710072China Department of Mechanical and Industrial engineering Norwegian University of Science and TechnologyTrondheim 7491Norway state Key Laboratory of Tribology in Advanced equipment Department of Mechanical EngineeringTsinghua UniversityBeijing 100084China

This study presents new methods to effectively model the anisotropic yielding and hardening behavior of laser powder bed fusion fabricated aluminum alloy under both monotonic and cyclic loading *** proposed model combines the yield surface-interpolation method to accurately describe the anisotropic hardening rates in various directions,with the Chaboche kinematic hardening rule to precisely reflect the cyclic *** numerical implementation of the combined anisotropic and cyclic constitutive model,a fully implicit stress integration algorithm based on return mapping method is ***,the multiple parameters associated with the model are categorized and identified in an uncoupled *** isotropic and cyclic hardening parameters are determined by an inverse method,and the stability of the optimization outcomes is validated by applying different starting points for the ***,the back-stress effect on the identification of anisotropic parameters associated with the stress invariant-based Hill48 yield function is considered for the first *** consideration leads to an improved prediction accuracy compared to the identification of anisotropic parameters without considering back-stress *** combined anisotropic and cyclic constitutive model,along with the calibrated parameters,are proven capable of accurately reproducing the intricate deformation behavior of laser powder bed fusion fabricated AlSi10Mg.

关键词： Constitutive models Anisotropy Kinematic hardening Laser powder bed fusion Aluminum alloys

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Beyond Performance of Learning Control Subject to Uncertainties and Noise: A Frequency-Domain Approach Applied to Wafer Stages

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IEEE/CAA Journal of Automatica Sinica 2025年第1期12卷 198-214页

作者： Fazhi Song Ning Cui Shuaiqi Chen Kai Zhang Yang Liu Xinkai Chen Jiubin Tan IEEE the center of Ultra-precision Optoelectronic Instrument engineering Harbin Institute of Technology the Key Laboratory of Ultra-Precision Intelligent Instrumentation Ministry of Industry and Information Technology the state Key Laboratory of Precision Electronic manufacturing Technology and equipment Guangdong University of Technology the center of Ultraprecision Optoelectronic Instrument engineering Harbin Institute of Technology the Key Laboratory of UltraPrecision Intelligent Instrumentation Ministry of Industry and Information Technology the Department of Electronic and Information Systems Shibaura Institute of Technology

The increasingly stringent performance requirement in integrated circuit manufacturing, characterized by smaller feature sizes and higher productivity, necessitates the wafer stage executing a extreme motion with the accuracy in terms of nanometers. This demanding requirement witnesses a widespread application of iterative learning control(ILC), given the repetitive nature of wafer scanning. ILC enables substantial performance improvement by using past measurement data in combination with the system model knowledge. However, challenges arise in cases where the data is contaminated by the stochastic noise, or when the system model exhibits significant uncertainties, constraining the achievable performance. In response to this issue, an extended state observer(ESO) based adaptive ILC approach is proposed in the frequency *** being model-based, it utilizes only a rough system model and then compensates for the resulting model uncertainties using an ESO, thereby achieving high robustness against uncertainties with minimal modeling effort. Additionally, an adaptive learning law is developed to mitigate the limited performance in the presence of stochastic noise, yielding high convergence accuracy yet without compromising convergence speed. Simulation and experimental comparisons with existing model-based and data-driven inversion-based ILC validate the effectiveness as well as the superiority of the proposed method.

关键词： Extended state observer learning control model uncertainties motion control stochastic noise

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Flexible Strain Sensors with Ultra‑High Sensitivity and Wide Range Enabled by Crack‑Modulated Electrical Pathways

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Nano-Micro Letters 2025年第3期17卷 246-264页

作者： Yunzhao Bai Yunlei Zhou Xuanyu Wu Mengfei Yin Liting Yin Shiyuan Qu Fan Zhang Kan Li YongAn Huang state Key Laboratory of Intelligent manufacturing equipment and Technology Huazhong University of Science and TechnologyWuhan 430074People’s Republic of China Flexible Electronics research center Huazhong University of Science and TechnologyWuhan 430074People’s Republic of China Hangzhou Institute of Technology Xidian UniversityHangzhou 311200People’s Republic of China School of Mechano‑Electronic engineering Xidian UniversityXi’an 710071People’s Republic of China Department of Aerospace and Mechanical engineering University of Southern CaliforniaLos AngelesCA 90089USA

This study presents a breakthrough in flexible strain sensor technology with the development of an ultrahigh sensitivity and wide-range sensor,addressing the critical challenge of reconciling sensitivity with measurement *** by the structure of bamboo slips,we introduce a novel approach that utilises liquid metal to modulate the electrical pathways within a cracked platinum fabric *** resulting sensor demonstrates a gauge factor greater than 108 and a strain measurement capability exceeding 100%.The integration of patterned liquid metal enables customisable tuning of the sensor’s response,while the porous fabric structure ensures superior comfort and air permeability for the *** design not only optimises the sensor’s performance but also enhances the electrical stability that is essential for practical *** systematic investigation,we reveal the intrinsic mechanisms governing the sensor’s response,offering valuable insights for the design of wearable strain *** sensor’s exceptional performance across a spectrum of applications,from micro-strain to large-strain detection,highlights its potential for a wide range of real-world uses,demonstrating a significant advancement in the field of flexible electronics.

关键词： Flexible strain sensor Fabric Crack Response regulation Epidermal device

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Optimization-based conformal path planning for in situ bioprinting during complex skin defect repair

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Bio-Design and manufacturing 2025年第1期8卷 1-19,I0001页

作者： Wenxiang Zhao Chuxiong Hu Yunan Wang Shize Lin Ze Wang Tao Xu state Key Laboratory of Tribology in Advanced equipment Department of Mechanical EngineeringTsinghua UniversityBeijing 100084China Beijing Key Laboratory of Precision and Ultra-Precision manufacturing equipment and Control Tsinghua UniversityBeijing 100084China center for Bio-intelligent manufacturing and Living Matter Bioprinting Research Institute of Tsinghua University in ShenzhenTsinghua UniversityShenzhen 518057China

The global demand for effective skin injury treatments has prompted the exploration of tissue engineering *** three-dimensional(3D)bioprinting has shown promise,challenges persist with respect to achieving timely and compatible solutions to treat diverse skin *** situ bioprinting has emerged as a key new technology,since it reduces risks during the implantation of printed scaffolds and demonstrates superior therapeutic ***,maintaining printing fidelity during in situ bioprinting remains a critical challenge,particularly with respect to model layering and path *** study proposes a novel optimization-based conformal path planning strategy for in situ bioprinting-based repair of complex skin *** strategy employs constrained optimization to identify optimal waypoints on a point cloud-approximated curved surface,thereby ensuring a high degree of similarity between predesigned planar and surface-mapped 3D ***,this method is applicable for skin wound treatments,since it generates 3D-equidistant zigzag curves along surface tangents and enables multi-layer conformal path planning to facilitate the treatment of volumetric ***,the proposed algorithm was found to be a feasible and effective treatment in a murine back injury model as well as in other complex models,thereby showcasing its potential to guide in situ bioprinting,enhance bioprinting fidelity,and facilitate improvement of clinical outcomes.

关键词： In situ bioprinting Path planning Robot control Skin injury repair

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Over 200 times current enhancement via buckling triboelectric nanogenerator at ultra-low speed for monitoring the swelling of lithium ion batteries

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Science Bulletin 2025年第2期70卷 148-152页

作者： Maoyi Zhang Chaosheng Hu Tongtong Zhang Chris R.Bowen Rui Li YongAn Huang Yewang Su Zhong Lin Wang Ya Yang Beijing Key Laboratory of Micro-Nano Energy and Sensor Center for High-Entropy Energy and SystemsBeijing Institute of Nanoenergy and NanosystemsChinese Academy of SciencesBeijing 101400China state Key Laboratory of Nonlinear Mechanics Institute of MechanicsChinese Academy of SciencesBeijing 100190China School of engineering Science University of Chinese Academy of SciencesBeijing 100049China School of Nanoscience and Technology University of Chinese Academy of SciencesBeijing 100049China Department of Mechanical engineering University of BathBath BA27AKUK state Key Laboratory of Structural Analysis for Industrial equipment Dalian University of TechnologyDalian 116024China state Key Laboratory of Intelligent manufacturing equipment and Technology Huazhong University of Science and TechnologyWuhan 430074China School of Material Science and engineering Georgia Institute of TechnologyAtlantaGA 30332-0245USA

Sensors deployed within the Internet of Things(Io T)require a stable and continuous electrical energy supply[1].The traditional approach to provide an energy supply relies primarily on battery power,which has specific shortcomings;these include integration difficulties,the need for frequent charging or replacement,and environmental pollution associated with battery production and *** solve the challenge of delivering an energy supply to sensors,researchers have designed self-powered sensors or have produced power for sensors by scavenging mechanical energy from the surrounding *** generators[2],piezoelectric generators[3]and triboelectric nanogenerators(TENGs)[4,5]are common approaches to scavenge mechanical *** have been widely used in the development of self-powered sensors and the supply of electrical energy to sensors due to their high performance,low cost,and wide range of potential materials[6].

关键词： battery buckling swelling

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Advances in CRISPR-based gene editing technology and its application in nucleic acid detection

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BIOCELL 2025年第1期49卷 21-43页

作者： LIUJIE CHEN LILI DUAN JIA LI JUN CHEN DUANFANG LIAO NONGYUE HE KAI LI ZHENG HU Translational Medicine Institute the First People’s Hospital of ChenzhouHengyang Medical SchoolUniversity of South ChinaChenzhou423000China The First Clinical College of Xiangnan University The First Affiliated Hospital of Xiangnan UniversityChenzhou423000China National engineering research center of Personalized Diagnostic and Therapeutic Technology Hunan University of Chinese MedicineChangsha410208China state Key Laboratory of digital Medical engineering School of Biological Science and Medical EngineeringSoutheast UniversityNanjing210096China

Nucleic acid analysis is a key technique that enables accurate detection of various *** nucleic acid testing typically requires access to specialized laboratories,equipment,and trained personnel,which hinders the widespread use of on-site testing for DNA and RNA ***,integrating gene editing technology with traditional nucleic acid detection methods,especially isothermal amplification technology,can help overcome the limitations associated with on-site *** combination can accomplish precise and swift detection of nucleic acid sequences,offering a robust tool for on-site *** Clustered Regularly Interspaced Short Palindromic Repeats/CRISPR-associated proteins(CRISPR/Cas)technology,which comprises the CRISPR system and Cas effector proteins,is a powerful tool that is advancing the field of nucleic acid ***,Cas12,Cas13,and Cas14 proteins have emerged as straightforward,effective,precise,sensitive,and cost-effective methods for in vitro nucleic acid detection because of their“collateral cleavage”*** combined with the“collateral cleavage”ability of Cas protein and isothermal amplification,CRISPR/Cas systems have great potential to advance nucleic acid *** article summarizes the research progress of different CRISPR/Cas systems and their applications in nucleic acid detection and future perspectives.

关键词： CRISPR/Cas Pathogen Clinical application

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Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex(UTCOF) assembly

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Science China(Technological Sciences) 2016年第11期59卷 1646-1655页

作者： CHEN JianKui XU ZhouLong HUANG YongAn DUAN YongQing YIN ZhouPing state Key Laboratory of digital manufacturing equipment and Technology Flexible Electronics Research Center Huazhong University of Science and Technology

The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.

关键词： microelectronic packaging warpage layerwise theory ultrathin chip

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Flexible hybrid electronics:Enabling integration techniques and applications

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Science China(Technological Sciences) 2022年第9期65卷 1995-2006页

作者： WU Hao HUANG YongAn YIN ZhouPing Flexible Electronics research center State Key Laboratory of Digital Manufacturing Equipment and TechnologySchool of Mechanical Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China

The conventional electronic systems enabled by rigid electronic are prone to malfunction under deformation,greatly limiting their application *** an emerging platform for applications in healthcare monitoring and human-machine interface(HMI),flexible electronics have attracted growing attention due to its remarkable advantages,such as stretchability,flexibility,conformability,and wearing ***,to realize the overall electronic systems,rigid components are also required for functions such as signal acquisition and ***,flexible hybrid electronics(FHE),which simultaneously possesses the desirable flexibility and enables the integration of rigid components for functionality,has been emerging as a promising *** paper reviews the enabling integration techniques for FHE,including technologies for two-dimensional/three-dimensional(2 D/3 D) interconnects,bonding of rigid integrated circuit(IC) chips to soft substrate,stress-isolation structures,and representative applications of *** addition,future challenges and opportunities involved in FHE-based systems are also discussed.

关键词： deformation electronics bonding

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Recent advances in photopolymerization 3D printing of alumina-ceramic

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Progress in Natural Science:Materials International 2025年第01期 1-30页

作者： M.Irfan Hussain Min Xia XiaoNa Ren Zhen Shen Muhammad Jamil Changchun Ge Institute of Powder Metallurgy and Advanced Ceramics School of Material Science and Engineering University of Science and Technology Beijing state Key Laboratory of Multimodal Artificial Intelligence Systems Beijing Engineering Research Center of Intelligent Systems and Technology Institute of AutomationChinese Academy of Sciences College of Mechanical and Electrical engineering Nanjing University of Aeronautics and Astronautics

digital light processing(DLP) 3D printing has a huge potential for manufacturing intricate and customized ceramic parts with high precision and cost-effectiveness. research in this field contributes to material innovation,opening the avenues for new process designs in both scientific and industrial sectors. However, the implementation of DLP 3D printing technology in ceramic research has not yet reached the maturity level as that in polymer and tissue engineering. Necessarily, a holistic in-depth literature reporting the successful integration of alumina ceramics within DLP 3D printing technology is urgently needed. This review, systematic examines recent progress in DLP technology, focusing on photopolymer resins that incorporate UV-sensitive monomers, photoinitiators, and dispersants, as well as their synergistic effects on achieving high-quality printing, desirable material properties, and enhanced performance. Further, the review discusses key factors including post-processing characteristics such as debinding and sintering, which influence microstructure, and defect formation including microcracks, porosity and voids. Finally, the challenges associated with printing and sintering are highlighted,aiming to identify focused focused development pathways and potential solution to optimize outcomes. This analysis clarifies existing challenges and also propsoes future applications for DLP technology in the aluminaceramic field.

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Experimental study of laser lift-off of ultra-thin polyimide film for flexible electronics

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Science China(Technological Sciences) 2019年第2期62卷 233-242页

作者： BIAN Jing ZHOU LaoBoYang WAN XiaoDong LIU MinXiao ZHU Chen HUANG YongAn YIN ZhouPing state Key Laboratory of digital manufacturing equipment and Technology Huazhong University of Science and Technology Flexible Electronics research center Huazhong University of Science and Technology

It is increasingly crucial for flexible electronics to efficiently and reliably peel large-area, ultra-thin flexible films off from rigid substrate serving as substrates of flexible electronics device, especially in industrial production. This paper experimentally investigated the mechanism and technologic characteristics of laser lift-off(LLO) process of ultra-thin(～ 2 μm) polyimide(PI)film. It was found increasingly difficult to obtain desirable ultra-thin PI film by LLO with the decrease of the film thickness. The optimal process parameters were achieved considering laser fluence and accumulated irradiation times(AIT), which were found to be strongly correlative to the thickness of PI film. The process mechanism of LLO of PI film was disclosed that laser ablation of interfacial PI will result in the formation of gas products between the PI and glass substrate, enabling the change of interface microstructures to reduce the interface bond strength. The amount of gas products mainly determines the result of LLO process for ultra-thin PI film, from residual adhesion to wrinkles or cracking. The strategy of multi-scanning based on multiple irradiations of low-energy laser pulses was presented to effectively achieve a reliable LLO process of ultra-thin PI film. This study provides an attractive route to optimize the LLO process for large-scale production of ultra-thin flexible electronics.

关键词： laser lift-off interfacial peeling delamination flexible electronics thin film

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