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Micron-gap spacers with ultrahigh thermal resistance and mechanical robustness for direct energy conversion Samuel

Microsystems & Nanoengineering 2019年第1期5卷 344-355页

作者： M.Nicaise Chen Lin Mohsen Azadi Tara Bozorg-Grayeli Promise Adebayo-Ige Drew E.Lilley Yann Pfitzer Wujoon Cha Kyana Van Houten Nicholas A.Melosh Roger T.Howe Jared W.Schwede Igor Bargatin Mechanical Engineering and Applied Mechanics University of PennsylvaniaPhiladelphiaPA 19104USA Materials Science&Engineering Stanford UniversityStanford 94305 CAUSA Chemical and Biomolecular Engineering University of PennsylvaniaPhiladelphiaPAUSA spark thermionics BerkeleyCA 94720USA Electrical Engineering Stanford UniversityStanfordCA 94305USA

In thermionic energy converters,the absolute efficiency can be increased up to 40%if space-charge losses are eliminated by using a sub-10-μm gap between the *** practical way to achieve such small gaps over large device areas is to use a stiff and thermally insulating spacer between the two *** report on the design,fabrication and characterization of thin-film alumina-based spacers that provided robust 3–8μm gaps between planar substrates and had effective thermal conductivities less than those of *** spacers were fabricated on silicon molds and,after release,could be manually transferred onto any *** large-scale compression testing,they sustained compressive stresses of 0.4–4 MPa without ***,the thermal conductance was 10–30 mWcm^(−2)K^(−1)and,surprisingly,independent of film thickness(100–800 nm)and spacer *** explain this independence,we developed a model that includes the pressure-dependent conductance of locally distributed asperities and sparse contact points throughout the spacer structure,indicating that only 0.1–0.5%of the spacerelectrode interface was conducting *** spacers show remarkable functionality over multiple length scales,providing insulating micrometer gaps over centimeter areas using nanoscale *** innovations can be applied to other technologies requiring high thermal resistance in small spaces,such as thermophotovoltaic converters,insulation for spacecraft and cryogenic devices.

关键词： thermal resistance film

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