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Method to remove wafer surface particles

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Journal of semiconductors 2017年第9期38卷 95-98页

作者： Bo Peng Deguang Zheng Yue Yu Wafer Test Department in nxp semiconductor(China)Ltd. Tianjin 300385China

A big yield drop has been observed during the automatic inspection （AO1） after the saw stage. A step by step AOl inspection check and defect review is made to see which step made a big yield drop and which kind of defect contributed most to the yield drop. Scanning electron microscope （SEM） and energy dispersive spectrometer （EDS） analysis showed the shape and chemical element of the particle. From the EDS result, particles can be separated into two categories. One was the inorganic related materials, mainly including silicon （Si） element, which came from the saw stage. A design of experiment （DOE） is used to find some reasonable saw relative parameter and optimize it in order to remove the particle from the saw stage. But the quantity of this kind of particle was small. Yield was only improved by less than 5%. Our main effort was to remove another kind of particle which was organic related materials, mainly including carbon （C） and oxygen （O） elernent. This kind of particle was from tape residue. In order to remove the tape residual, one step was added before the saw stage. Almost all of the tape residual was removed. Finally, the final yield was improved by more than 15%.

关键词： yield defect wafer

A bootstrapped switch employing a new clock feed-through compensation technique

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Journal of semiconductors 2009年第12期30卷 93-102页

作者：吴笑峰刘红侠苏立郝跃李迪胡仕刚 School of Microelectronics Xidian UniversityKey Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices School of Information and Electrical Engineering Hunan University of Science and Technology nxp semiconductors (Shanghai) Ltd

Nonlinearity caused by the clock feed-through of a bootstrapped switch and its compensation techniques are analyzed. All kinds of clock feed-through compensation configurations and their drawbacks are also investigated. It is pointed out that the delay path match of the clock boosting circuit is the critical factor that affects the effectiveness of clock feed-through compensation. Based on that, a new clock feed-through compensation configuration and corresponding bootstrapped switch are presented and designed optimally with the UMC mixed-mode/RF 0.18 μm 1P6M P-sub twin-well CMOS process by orientating and elaborately designing the switch MOSFETs that influence the delay path match of the clock boosting circuit. HSPICE simulation results show that the proposed clock feedthrough compensation configuration can not only enhance the sampling accuracy under variations of process, power supply voltage, temperature and capacitors but also decrease the even harmonic, high-order odd harmonic and THD on the whole effectively.

关键词： bootstrapped switch clock feed-through compensation delay path match

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元器件损伤以及失效风险评估

集成电路应用 2008年第9期25卷 44-45,52页

作者： Ray Thomas Paul Melville Sonoscan Elk Grove Village Ill nxp semiconductor EindhovenNetherlands

为了确定塑封微电路（PEM）在使用过程中是否会失效,首先在nxp实验室中采用声学成像方法检测封装内部像裂痕这样的缺陷。随后,元器件先后经历烘烤、浸湿、三次回流、电学测试、第二次声学成像以及物理检测。

关键词：风险评估器件损伤失效物理检测声学成像塑封微电路成像方法实验室

IC Innovations in Automotive

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IC Innovations in Automotive

2008 9th International Conference on Solid-State and Integrated-Circuit Technology

作者： René Penning de Vries SVP ＆ CTO NXP Semiconductors High Tech Campus 605656 AG EindhovenThe Netherlands

＜正＞The fierce competition in the car industry drives the evolution of cars in terms of performance and price more than ever. Continuous improvement of car comfort and performance,at competitive price levels,poses a wealth of innovation challenges to the manufacturers of the ICs that are omnipresent in today’s cars. Moreover,the growing awareness on sustainability drives semiconductor developments like power solutions and sensors for engine management,solid-state lighting, tire pressure monitoring and drive/steer-by-wire via In-Vehicle Networking,aimed at weight reduction.

关键词： [IEEE Keyword]Standards Anisotropic magnetoresistance Mechanical sensors Transceivers Sensor systems Magnetic sensors Sensors

来源： cnki会议评论

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MPC5675微控制器测试研究

中小企业管理与科技 2017年第34期1卷 172-173页

作者：何灏王爽彭文刘诗琪恩智浦(nxp)半导体公司天津300385 天津职业技术师范大学电子工程学院天津300222

恩智浦(nxp)半导体公司设计生产的32位MPC5675芯片广泛用于汽车助力转向系统、先进驾驶辅助系统以及其他与汽车安全相关的设备中,为汽车安全提供了有力保障。芯片电路的高集成度给芯片测试带来更多的挑战。针对MPC5675芯片在温度测量模... 详细信息

恩智浦(nxp)半导体公司设计生产的32位MPC5675芯片广泛用于汽车助力转向系统、先进驾驶辅助系统以及其他与汽车安全相关的设备中,为汽车安全提供了有力保障。芯片电路的高集成度给芯片测试带来更多的挑战。针对MPC5675芯片在温度测量模块测试和数模转换测试过程中出现的问题,分别采用温度测量值和室温参考值比对的方法和动态接触电阻测试的方法,优化测试程序,提高芯片良品率。该测试方案可用于MPC5675系列芯片测试中。

关键词： MPC5675芯片温度测量模块测试数模转换测试