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Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

Journal of Materials Science & Technology 2006年第3期22卷 392-396页

作者： Fuquan LI Chunqing WANG Yanhong TIAN microjoining lab. School of Materials Science and Engineering Harbin Institute of Technology Harbin 150001 China

The interracial phenomena of the Sn-Pb solder droplet on and needle-like AuSn4 are formed at the interface after Au/Ni/Cu pad are investigated. A continuous AuSn2 the liquid state reaction （soldering）. The interracial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface. The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.

关键词： Sn-Pb solder droplet Intermetallic Aging Dissolution

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Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during aging process

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Rare Metals 2007年第S1期26卷 331-337页

作者： TIAN Yanhong,WANG Chunqing,and LIU Wei microjoining lab.ratory,State Key lab.ratory of Advanced Welding Production Technology,Harbin Institute of Technology,Harbin 15000,China Harbin Inst Technol Microjoining Lab State Key Lab Adv Welding Prod Technol Harbin 15000 Peoples R China

The growth of Au-Sn intermetallic compounds(IMCs) is a major concern to the reliability of solder joints in microelectronic,optoelectronic and micro-electronic-mechanical system(MEMS) which has a layer of Au metallization on the surface of components or *** paper presented the growth behavior of Au-Sn IMCs at interfaces of Au metallization and Sn-based solder joints with the addition of Cu alloying element during aging process,and growth coefficients of the Au-Sn IMCs were *** on the interfacial reaction between Sn-xCu solders and Au metallization during aging process show that three layers of Au-Sn IMCs including AuSn,AuSn2 and AuSn4 formed at the interface *** thickness of each Au-Sn IMC layer vs square root of aging time follows linear *** of the IMC growth coefficients shows that the diffusion coefficients decrease with the addition Cu elements,which indicates that Cu addition suppresses the growth of Au-Sn IMCs layer.

关键词： Sn-based solder alloys Cu alloying element Au-Sn intermetallic compounds

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Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding

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Journal of Materials Science & Technology 2006年第4期22卷 483-486页

作者： Mingyu LI Hongjun JI Chunqing WANG Au Tai KUNG Han Sur BANG Hee Seon BANG Shenzhen Graduate School of Harbin Institute of Technology Shenzhen 518055 China microjoining lab School of Materials Science and Engineering Harbin Institute of Technology Harbin 150001 China Sun East Technology （Holdings） Ltd. Shenzhen 518103 China Department of Naval Architecture and Ocean Engineering Chosun University 375 Seosek Dong Donggu Guangju 501-759 Korea

The mechanism of ultrasonic wire wedge bonding, one of the die/chip interconnection methods, was investigated based on the characteristics of the ultrasonic wire bonding joints. The Al-1%Si wire of 25 μm in diameter was bonded on Au/Ni/Cu pad and the joint cross-section was analyzed by scanning electron microscopy （SEM） and energy-dispersive X-ray spectroscopy （EDX）. The results indicated that it is irregular for the ultrasonic bond formation, non-welded at the centre but joining well at the periphery, especially at the heel and toe of the joint. Furthermore, the diffusion and/or reaction at the cross-section interface are not clear at C-zone, while there exists a strip layer microstructure at P-zone, and the composition is 78.96 at. pct Al and 14.88 at. pct Ni, close to the Al3Ni intermetallic compound. All these observations are tentatively ascribed to the plastic flow enhanced by ultrasonic vibration and repeated cold deformation driving interdiffusion between AI and Ni at bond interface.

关键词： Ultrasonic bonding Irregular joint Interface diffusion Repeated cold deformation

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Sagging phenomenon observed in micro-solder joints fabricated by laser reflow soldering process

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材料科学与工程（中英文版） 2008年第4期2卷 37-42页

作者： LIU Wei WANG Chun-qing TIAN Yan-hong KONG Ling-chao State Key lab.of Advanced Welding Production Technology Department of Electronics Packaging Technology Harbin Institute of Technology Harbin 150001 China

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