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Microsphere-assisted hyperspectral imaging:super-resolution,non-destructive metrology for semiconductor devices

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Light(Science & Applications) 2024年第6期13卷 1098-1111页

作者： Jangryul Park Youngsun Choi Soonyang Kwono Youngjun Lee Jiwoong Kim Jae-joon Kim Jihye Lee Jeongho Ahn Hidong Kwak Yusin Yang Taeyong Jo Myungjun Lee Kwangrak Kim Metrology and Inspection Equipment R&D Team Mechatronics ResearchSamsung Electronics Co.Ltd.1-1 Samsungjeonja-rohwaseong-siGyeonggi-do18848Republic of Korea Process Development Department DRAM Process Development TeamSemiconductor R&D CenterSamsung Electronics Co.Ltd.1-1 Samsungjeonja-rohwaseong-siGyeonggi-do18848Republic of Korea Process Development Department Semiconductor R&D CenterSamsung Electronics Co.Ltd.1-1 Samsungjeonja-rohwaseong-siGyeonggi-do18848Republic of Korea

As semiconductor devices shrink and their manufacturing processes advance,accurately measuring in-cell critical dimensions(CD)becomes increasingly *** test element group(TEG)measurements are becoming inadequate for representing the fine,repetitive patterns in cell *** non-destructive metrology technologies like optical critical dimension(OCD)are limited due to their large spot diameter of approximately 25μm,which impedes their efficacy for detailed in-cell structural ***,there is a pressing need for small-spot and non-destructive metrology *** address this limitation,we demonstrate a microsphere-assisted hyperspectral imaging(MAHSI)system,specifically designed for small spot optical metrology with *** microsphere-assisted super-resolution imaging,this system achieves an optical resolution of 66 nm within a field of view of 5.6μm×5.6μ*** approach effectively breaks the diffraction limit,significantly enhancing the magnification of the *** MAHSI system incorporating hyperspectral imaging with a wavelength range of 400–790 nm,enables the capture of the reflection spectrum at each camera *** achieved pixel resolution,which is equivalent to the measuring spot size,is 14.4 nm/pixel and the magnification is *** MAHSI system enables measurement of local uniformity in critical areas like corners and edges of DRAM cell blocks,areas previously challenging to inspect with conventional OCD *** our knowledge,this approach represents the first global implementation of microsphere-assisted hyperspectral imaging to address the metrology challenges in complex 3D structures of semiconductor devices.

关键词： metrology resolution enable

Applying heteroatom co-doped carbon nanotube for manifesting high performance in the electrochemical reduction of aqueous nitrogen oxide by gold nanoparticles

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Nano Research 2024年第3期17卷 1151-1164页

作者： Jane Chung Haibo Yin Rong Wang Yunlong Wang Junyang Zhang Yue Peng Joung Woo Han Seongyun Ryu Junhua Li State Key Joint Laboratory of Environment Simulation and Pollution Control School of EnvironmentTsinghua UniversityBeijing 100084China EHS Research Center Samsung Electronics Co.Ltd.Gyeonggi-do 18448Republic of Korea

Electrochemical NO-to-NH_(3) under ambient conditions could be a viable alternative having advantages in terms of energy consumption and exhaust gas recycling of NO,replacing a traditional ammonia synthesis method of the Haber–Bosch *** synthesizing boron(B-)and nitrogen(N-)co-doped carbon nanotube(CNT)based gold(Au)catalysts,B-dopants elevate the conductivity of carbon nanotube by sp2 hybridization on graphene and implant B–N domains within the graphene layer,and result in facilitating the embedding amount of Au accompanied by high dispersibility with low particle *** density functional theory(DFT)calculations elucidate that the electron cloud transmitted from B-dopant to the active site of Au induces the Lewis acidic site,and the O-distal pathway occurs following a spontaneous *** of the electron-deficient B-doping area accompanied by N-defects and B–O edges retains the major valence state of Au as Au^(δ+),and suppresses hydrogen evolution reaction(HER)by repulsing the hindrance of H*.This record exhibits the highest faradaic efficiency(FE)of 94.7%,and NH_(3) yield rate of 1877.4μg·h^(-1)·mg_(cat)^(-1),which is the optimal yield over energy consumption in the field of the ambient reduction of aqueous NO.

关键词： boron heteroatom nitrogen defect gold nanoparticles valence states of gold electrochemical NO-to-NH3

Transparent high-performance piezoceramics through pressureless sintering

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Journal of Advanced Ceramics 2024年第5期13卷 561-567页

作者： Hye-Lim Yu Woo-Seok Kang Ju-Hyeon Lee Temesgen Tadeyos Zate Young-Jin Lee Bo-Kun Koo Dong-Jin Shin Min-Soo Kim Soon-Jong Jeong Young Ghyu Ahn Wook Jo Department of Material Science and Engineering Ulsan National Institute of Science and TechnologyUlsan 44919Republic of Korea Energy Conversion Research Center Korea Electrotechnology Research InstituteChangwon 51543Republic of Korea MLCC Development Team Component Biz.UnitSamsung Electro-Mechanics Co.Ltd.Suwon 16674Republic of Korea

Piezoelectricity offers an electromechanical coupling that is widely utilized in transducer *** has been a consistent demand for transparent piezoelectric materials for optoelectrical ***,despite the inherent tradeoff between the transparency and the piezoelectricity,numerous strategies have been explored to develop the transparent piezoelectric ***,the most transparent piezoelectric materials developed to date is either a single crystal or materials that achieve transparency via hot-press sintering,limiting its industrial ***,we introduce a novel piezoelectric material that ensures transparency through co-doping and pressureless sintering of polycrystalline *** this study,we employed a compositional optimization approach to enhance the synergistic effect between the transparency and the piezoelectric properties of 0.71Pb(Mg_(1/3)Nb_(2/3))O_(3)–0.29PbTiO_(3)(PMN–0.29PT)*** utilizing the tape casting process for mass production and large-area manufacturing,our Pb_(0.913)La_(0.0145)Sm_(0.0145)(Mg_(1/3)Nb_(2/3))_(0.71)Ti_(0.29)O_(3)(TP2.9)ceramics exhibited over 60%transparency and large piezoelectric coefficient(d33)of 1104 pC/*** material holds considerable promise for a wide range of industrial applications in both the optical and electronic domains.

关键词： piezoelectric ceramics transparency pressureless sintering co-doping tape casting

Chosen-Ciphertext Attack Secure Public-Key Encryption with Keyword Search

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Computers, Materials & Continua 2022年第10期73卷 69-85页

作者： Hyun Sook Rhee samsung Electronics Co.ltd. Suwon-si16677Korea

As the use of cloud storage for various services increases,the amount of private personal information along with data stored in the cloud storage is also *** remotely use the data stored on the cloud storage,the data to be stored needs to be encrypted for this ***“searchable encryption”is enable to search on the encrypted data without any decryption,it is one of convenient solutions for secure data management.A public key encryption with keyword search(for short,PEKS)is one of searchable *** et *** defined IND-CCA security for PEKS to enhance it’s security and proposed consistent IND-CCA secure PEKS based on the“robust”ANO-CCA secure identity-based encryption(IBE).In this paper,we propose two generic constructions of consistent IND-CCA secure PEKS combining(1)a hierarchical identity based encryption(for short,HIBE)and a signature scheme or(2)a HIBE,an encapsulation,and a message authentication code(for short,MAC)*** generic constructions identify that HIBE requires the security of a signature or a MAC as well as the weaker“ANO-CPA security(resp.,IND-CPA security)”of HIBE than“ANOCCA security(resp.,IND-CCA security)”of IBE required in for achieving IND-CCA secure(resp.,consistent)***,we prove that our generic constructions satisfy IND-CCA security and consistency under the security models.

关键词： Searchable encryption public-key encryption with keyword search chosen ciphertext security data privacy

Highly Elastic,Bioresorbable Polymeric Materials for Stretchable,Transient Electronic Systems

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Nano-Micro Letters 2024年第6期16卷 1-13页

作者： Jeong‑Woong Shin Dong‑Je Kim Tae‑Min Jang Won Bae Han Joong Hoon Lee Gwan‑Jin Ko Seung Min Yang Kaveti Rajaram Sungkeun Han Heeseok Kang Jun Hyeon Lim Chan‑Hwi Eom Amay J.Bandodkar Hanul Min Suk‑Won Hwang KU‑KIST Graduate School of Converging Science and Technology Korea University145 Anam‑roSeongbuk‑guSeoul 02841Republic of Korea SK Hynix 2091Gyeongchung‑daeroBubal‑eupIcheon‑siGyeonggi‑do 17336Republic of Korea Hanwha Systems Co. Ltd.188Pangyoyeok‑roBundang‑guSeongnam‑siGyeonggi‑do 13524Republic of Korea Department of Electrical and Computer Engineering North Carolina State UniversityRaleighNC 27606USA Center for Advanced Self‑Powered Systems of Integrated Sensors and Technologies(ASSIST) North Carolina State UniversityRaleighNC 27606USA Department of Integrative Energy Engineering Korea University145 Anam‑roSeongbuk‑guSeoul 02841Republic of Korea Biomaterials Research Center Korea Institute of Science and Technology(KIST)5 Hwarang‑ro 14‑gilSeongbuk‑guSeoul 02792Republic of Korea Semiconductor R&D Center Samsung Electronics Co.Ltd.Hwaseong‑siGyeonggi‑do 18448Republic of Korea Center for Advanced Biomolecular Recognition Biomedical Research DivisionKorea Institute of Science and Technology(KIST)Seoul 02792Republic of Korea

Substrates or encapsulants in soft and stretchable formats are key components for transient,bioresorbable electronic systems;however,elastomeric polymers with desired mechanical and biochemical properties are very limited compared to nontransient ***,we introduce a bioresorbable elastomer,poly(glycolide-co-ε-caprolactone)(PGCL),that contains excellent material properties including high elongation-at-break(<1300%),resilience and toughness,and tunable dissolution *** of PGCLs as polymer matrices,in combination with conducing polymers,yields stretchable,conductive composites for degradable interconnects,sensors,and actuators,which can reliably function under external *** of device components with wireless modules demonstrates elastic,transient electronic suture system with on-demand drug delivery for rapid recovery of postsurgical wounds in soft,time-dynamic tissues.

关键词： Biodegradable elastomer Conductive polymer composites Biomedical device Transient electronics

Microsphere-assisted,nanospot,non-destructive metrology for semiconductor devices

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Light(Science & Applications) 2022年第2期11卷 262-275页

作者： Soonyang Kwon Jangryul Park Kwangrak Kim Yunje Cho Myungjun Lee Equipment R&D Team 4 Mechatronics ResearchSamsung Electronics Co.Ltd.1-1 Samsungjeonja-roHwaseong-siGyeonggi-do 18848Republic of Korea

As smaller structures are being increasingly adopted in the semiconductor industry,the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking and stacking *** to the increasing complexity of the design architectures,optical metrology techniques including spectroscopic ellipsometry(SE)and reflectometry have been widely used for efficient process development and yield ramp-up due to the capability of 3D structure ***,there has been an increasing demand for a significant reduction in the physical spot diameter used in the SE technique;the spot diameter should be at least 10 times smaller than the cell dimension(~30×40μm2)of typical dynamic random-access memory to be able to measure in-cell critical dimension(CD)*** this end,this study demonstrates a novel spectrum measurement system that utilizes the microsphere-assisted super-resolution effect,achieving extremely small spot spectral metrology by reducing the spot diameter to~210 nm,while maintaining a sufficiently high signal-to-noise *** addition,a geometric model is introduced for the microsphere-based spectral metrology system that can calculate the virtual image plane magnification and depth of focus,providing the optimal distance between the objective lens,microsphere,and sample to achieve the best possible imaging *** proof of concept was fully verified through both simulations and experiments for various ***,owing to its ultra-small spot metrology capability,this technique has great potential for solving the current metrology challenge of monitoring in-cell CD variations in advanced logic and memory devices.

关键词： metrology dimension utilize

Dynamic Channel Allocation by Using Allocation Function in PCS

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Dynamic Channel Allocation by Using Allocation Function in P...

Additional Polishing Process and the Pin-Up Speed Optimization for the Prevention of Linear Crack of BOC Chip

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作者： Kwang Moon Cho AIN(Advanced Intelligent Network)Software Lab. samsung Electronics Co. ltd.samsung plaza 18E.263 SeoHyun-Dong BunDang-Gu SeongNam KyungKi Korea 463-050

In this paper a dynamic channel allocation method applicable tothe microcell system like as PCS is *** factors for the quality of channels are *** function that consists of these factors has *** channel allocation for a call is processed by usingthe function *** a channel is being allocated to a call,the adequate quality channel is used instead of the best *** probability of call blocking is decreased even inthe cells having the high traffic load.

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上海交通大学学报 2007年第S2期41卷 45-47页

作者：朱家祺李群冯建青孟忠李祯森 samsung Electronics(Suzhou) Semiconductor Co.ltd.

The thin wafer(such as BOC) is often cracked easily after Die-Attach process and large numbers of products in some semiconductor company failed as a result of *** it is urgent to get the solution to assure the quality and increase the *** article explained the relation of crack,the chip strength,as well as Die-Attach pin-up speed and how to solve that *** example,additional polishing process can significantly decrease the grind mark damage;pin-up speed optimization can make pin-up force *** linear crack of thin chip can be avoided effectively.

关键词： chip crack chip strength fracture force pin-up speed

Reliability Analysis of Sn-Bi Plating Chips

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上海交通大学学报 2007年第S2期41卷 154-156页

作者：帅迪金星郭士达柳光洙 samsung Electronics(Suzhou) Semiconductor Co.ltd.

The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was *** research result shows that the Sn-Bi plating... 详细信息

关键词： Sn-Bi whisker solder ability thermal humidity bias(THB)