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检索条件"机构=Department of Power Engineering and Mechanics"
25583 条 记 录,以下是1-10 订阅
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A physics-informed neural network for simulation of finite deformation in hyperelastic-magnetic coupling problems
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Applied Mathematics and mechanics(English Edition) 2024年 第10期45卷 1717-1732页
作者: Lei WANG Zikun LUO Mengkai LU Minghai TANG department of engineering mechanics College of Mechanics and Engineering SciencesHohai University School of Mechanical engineering and mechanics Ningbo University
Recently, numerous studies have demonstrated that the physics-informed neural network(PINN) can effectively and accurately resolve hyperelastic finite deformation problems. In this paper, a PINN framework for tackling... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
Observation of ballistic-diffusive thermal transport in GaN transistors using thermoreflectance thermal imaging
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Rare Metals 2024年 第1期43卷 389-394页
作者: Zhi-Ke Liu Yang Shen Han-Ling Li Bing-Yang Cao Key Laboratory for Thermal Science and power engineering of Ministry of Education Department of Engineering MechanicsTsinghua UniversityBeijing 100084China
To develop effective thermal management strategies for gallium-nitride (GaN) transistors, it is essential to accurately predict the device junction temperature. Since the width of the heat generation in the devices is... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
A brief review on the recent development of phonon engineering and manipulation at nanoscales
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International Journal of Extreme Manufacturing 2024年 第1期6卷 177-206页
作者: Siqi Xie Hongxin Zhu Xing Zhang Haidong Wang Key Laboratory for Thermal Science and power engineering of Ministry of Education Department of Engineering MechanicsTsinghua UniversityBeijing 100084People’s Republic of China
Phonons are the quantum mechanical descriptions of vibrational modes that manifest themselves in many physical properties of condensed matter systems. As the size of electronic devices continues to decrease below mean... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
A comprehensive review on microchannel heat sinks for electronics cooling
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International Journal of Extreme Manufacturing 2024年 第2期6卷 133-162页
作者: Zhi-Qiang Yu Mo-Tong Li Bing-Yang Cao Key Laboratory for Thermal Science and power engineering of Ministry of Education Department of Engineering MechanicsTsinghua UniversityBeijing 100084People’s Republic of China
The heat generation of electronic devices is increasing dramatically,which causes a serious bottleneck in the thermal management of electronics,and overheating will result in performance deterioration and even device ... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
Velocity transformation for compressible wall-bounded turbulence——An approach through the mixing length hypothesis
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Science China(Physics,mechanics & Astronomy) 2024年 第9期67卷 108-125页
作者: Xuke Zhu Yubin Song Xiaoshuo Yang Zhenhua Xia State Key Laboratory of Fluid power and Mechatronic Systems and department of engineering mechanics Zhejiang UniversityHangzhou 310027China
In an endeavor to establish a connection between the mean velocity profile in compressible wall-bounded turbulence and its incompressible analogue,a refined version of the Trettel and Larsson's(TL)transformation is sy... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
A robust implicit high-order discontinuous Galerkin method for solving compressible Navier-Stokes equations on arbitrary grids
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Acta Mechanica Sinica 2024年 第8期40卷 96-119页
作者: Jia Yan Xiaoquan Yang Peifen Weng Shanghai Institute of Applied Mathematics and mechanics Shanghai Key Laboratory of Mechanics in Energy EngineeringSchool of Mechanics and Engineering ScienceShanghai UniversityShanghai200072China College of Energy and Mechanical engineering Shanghai University of Electric PowerShanghai200090China
The primary impediments impeding the implementation of high-order methods in simulating viscous flow over complex configurations are robustness and *** challenges impose significant constraints on computational effici... 详细信息
来源: 维普期刊数据库 维普期刊数据库 评论
Formation adaptation in obstacle-cluttered environments via MPC-based trajectory planning
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Science China(Information Sciences) 2024年 第7期67卷 321-323页
作者: Yuda CHEN Zhongkui LI department of mechanics and engineering Science College of Engineering Peking University
Formation is a typical collective behavior in multiagent systems utilized in areas such as inspection, surveillance, and transportation. Commonly-used approaches to achieve formation include virtual structure [1], con...
来源: 同方期刊数据库 同方期刊数据库 评论
Experimental investigation of closed-loop active control to modulate coherent structures by mu-level method
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Chinese Physics B 2024年 第7期33卷 408-417页
作者: 白建侠 范子椰 姜楠 李秋营 郑小波 department of Mathematics Tianjin Renai CollegeTianjin 301636China Institute of mechanics Department of MechanicsSchool of Mechanical EngineeringTianjin UniversityTianjin 300354China College of Energy and power engineering Lanzhou University of TechnologyLanzhou 730050China Tianjin Key Laboratory of Modern engineering mechanics Tianjin 300354China
The experimental research on zero-net-mass-flux jet closed-loop active control was conducted in the wind *** mu-level method successfully detected burst events of the coherent structures. The streamwise velocity signa... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
A design and manufacturing methodology for encoded soft-textile robots
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Science China(Physics,mechanics & Astronomy) 2024年 第5期67卷 212-213页
作者: Yihui Zhang Applied mechanics Laboratory Department of Engineering MechanicsTsinghua UniversityBeijing 100084China
The development of programmable soft robots with bioinspired morphing capabilities has attracted considerable *** mode and complexity of morphing capabilities are essential to the manipulation and movement abilities o... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
A Detailed Thermal Resistance Network Analysis of FCBGA Package
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Journal of Thermal Science 2024年 第1期33卷 18-28页
作者: DANG Hao LU Yang DU Yanzheng ZHANG Xiu ZHANG Qian MA Weigang ZHANG Xing Key Laboratory for Thermal Science and power engineering of Ministry of Education Department of Engineering MechanicsTsinghua UniversityBeijing 100084China Zhongxing Telecom Equipment Corporation Shanghai 201203China
Using thermal models to describe the heat dissipation process of FCBGA is a significant topic in the field of ***,the thermal resistance model considering the structure of each part of the chip is still ambiguous and ... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论