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Microstructure evolution of single crystal copper wires in cold drawing

Science China(Technological Sciences) 2007年第6期50卷 736-748页

作者： CHEN Jian1,2, YAN Wen1,2, WANG XueYan2 & FAN XinHui2 1 Department of Applied Physics, Northwestern Polytechnical University, Xi’an 710072, China 2 School of Material Science and Chemical Engineering, Xi’an Technological University, Xi’an 710032, China Department of Applied Physics Northwestern Polytechnical University Xi’an China School of Material Science and Chemical Engineering Xi’an Technological University Xi’an China

The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the undeformed single crystal copper wires. However, it is difficult to observe these dendrites in deformed single crystal copper wires. The structure evolution of deformed single crystal copper wires during drawing process can be divided into three stages. When the true strain is lower than 0.94, macroscopic subdivision of grains is not evident,; the microscopic evolution of deformed structure is that the cells are formed; elongated in drawn direction. When the true strain is between 0.94; 1.96, macroscopic subdivision of grains takes place,; the number of microbands located on {111}; cell blocks is much more than that with the true strain lower than 0.94. When the true strain is larger than 1.96, the macroscopic subdivision of grains becomes more evident than that with the true strain between 0.94; 1.96,; S-bands structure; lamellar boundaries will be formed. From EBSD analysis, it is found that part of 100 texture resulting from solidifying is transformed into 111; 112 due to shear deformation, but 100 texture component is still kept in majority. When the true strain is 0.94, the misorientation angle of dislocation boundaries resulting from deformation is lower than 14°. However, when the true strain arrives at 1.96, the misorientation angle of some boundaries will be greater than 50°,; the peak of misorientation angle distribution produced by texture evolution is located in the range between 25°; 30°.

关键词： single crystal copper wires, deformation structure, electron backscattering diffraction, transmission electron microscopy

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Fabrication of Ni-decorated helical ribbon composite microstructure from self-assembled lipid tubule by electroless metallization

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Science China Chemistry 2006年第3期49卷 238-245页

作者： FU Yubin1,2, ZHANG Lide1 & ZHENG Jiyong2 1. Institute of Solid State Physics, China Academy of Sciences, Hefei 230031, China 2. Luoyang Ship Material Research Institute, Luoyang 471039, China Institute of Solid State Physics China Academy of Sciences Hefei China Luoyang Ship Material Research Institute Luoyang China

Lipid molecules can self-assemble into a tubular structure, which is formed by tightly wound helical ribbons. Lipid tubules are utilized as a precursor to fabricate a novel Ni-decorated helical ribbon composite microstructure in a high yield by electroless deposition. The microstructure carries Ni nanoparticles on the flat face and wires at the edge of helical ribbon, in which the average size of nanoparticles is about 40―60 nm, and the wires are of a layered structure strongly correlated with a multi-bilayer structure in the lipid membrane. Compared with the tubular precursor, the Ni-decorated composite microstructure becomes short and irregular shapes due to the breakage in the deposition, and its formation is largely bound up with the tubular helical structure and the different catalytic process. Finally, the helical composite microstructure would have a potential application in the development of electric active materials.

关键词： molecular self-assembly, lipid tubule, helical ribbon, electroless deposition, nanoparticles and wires, composite microstructure.

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