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Application of atmospheric pressure plasma polishing method in machining of silicon ultra-smooth surfaces

Frontiers of Electrical and Electronic Engineering in China 2008年第4期3卷 480-487页

作者： Jufan ZHANG Bo WANG Shen DONG School of Mechanical Engineering Harbin Institute of TechnologyHarbin 150001China

The modern optics industry demands rigorous surface quality with minimum defects,which presents challenges to optics machining *** are always certain defects on the final surfaces of the compo-nents formed in conventional contacting machining proc-esses,such as micro-cracks,lattice disturbances,*** is especially serious for hard-brittle functional materials,such as crystals,glass and ceramics because of their special *** solve these problems,the atmospheric pressure plasma polishing(APPP)method is *** utilizes chemical reactions between reactive plasma and surface atoms to perform atom-scale material *** the machining process is chemical in nature,APPP avoids the surface/subsurface defects mentioned *** the key component,a capacitance coupled radio-fre-quency plasma torch is first *** initial opera-tions,silicon wafers were machined as *** applying operations,both the temperature distribution on the work-piece surface and the spatial gas diffusion in the machining process were studied qualitatively by finite element *** the following temperature measurement experiments demonstrate the formation of the temperature gradient on the wafer surface predicted by the theoretical analysis and indicated a peak temper-ature about 90uC in the *** using commercialized form talysurf,the machined surface was detected and the result shows regular removal profile that corresponds well to the flow field ***,the removal profile also indicates a 32 mm^(3)/min removal *** using atomic force microscopy(AFM),the surface roughness was also measured and the result demonstrates an Ra 0.6 nm surface *** the element composition of the machined surface was detected and analyzed by X-ray photoelectron spectroscopy(XPS)*** results also demonstrate the occurrence of the anticipated main *** the experiments have proved that this atmospheric pressure plasma pol

关键词： atmospheric pressure plasma ultra-smooth surface single crystal silicon capacitance coupled polish-ing

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Numerical simulation of materials-oriented ultra-precision diamond cutting:review and outlook

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International Journal of Extreme Manufacturing 2023年第2期5卷 1-21页

作者： Liang Zhao Junjie Zhang Jianguo Zhang Houfu Dai Alexander Hartmaier Tao Sun Center for Precision Engineering Harbin Institute of TechnologyHarbin 150001People’s Republic of China State Key Laboratory of Digital Manufacturing Equipment and Technology School of Mechanical Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074People’s Republic of China School of Mechanical and Engineering Guizhou UniversityGuizhou 550025People’s Republic of China Interdisciplinary Centre for Advanced Materials Simulation Ruhr-University BochumBochum 44801Germany

ultra-precision diamond cutting is a promising machining technique for realizing ultra-smooth surface of different kinds of *** fundamental understanding of the impact of workpiece material properties on cutting mechanisms is crucial for promoting the capability of the machining technique,numerical simulation methods at different length and time scales act as important supplements to experimental *** this work,we present a compact review on recent advancements in the numerical simulations of material-oriented diamond cutting,in which representative machining phenomena are systematically summarized and discussed by multiscale simulations such as molecular dynamics simulation and finite element simulation:the anisotropy cutting behavior of polycrystalline material,the thermo-mechanical coupling tool-chip friction states,the synergetic cutting responses of individual phase in composite materials,and the impact of various external energetic fields on cutting *** particular,the novel physics-based numerical models,which involve the high precision constitutive law associated with heterogeneous deformation behavior,the thermo-mechanical coupling algorithm associated with tool-chip friction,the configurations of individual phases in line with real microstructural characteristics of composite materials,and the integration of external energetic fields into cutting models,are ***,insights into the future development of advanced numerical simulation techniques for diamond cutting of advanced structured materials are also *** aspects reported in this review present guidelines for the numerical simulations of ultra-precision mechanical machining responses for a variety of materials.

关键词： diamond cutting ultra-smooth surface material-oriented physics-based simulation model molecular dynamics finite element

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Polishing and planarization of single crystal diamonds: state-of-the-art and perspectives

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International Journal of Extreme Manufacturing 2021年第2期3卷 45-87页

作者： Hu Luo Khan Muhammad Ajmal Wang Liu Kazuya Yamamura Hui Deng Department of Mechanical and Energy Engineering Southern University of Science and TechnologyNo.1088Xueyuan RoadShenzhenGuangdong 518055People’s Republic of China 2 Graduate School of EngineeringOsaka University2-1 YamadaokaSuitaOsakaJapan

Diamond is a promising material for the modern industry. It is widely used in different applications, such as cutting tools, optical windows, heat dissipation, and ***, these application areas require exceptionally flattened and polished diamond ***, due to the extreme hardness and chemical inertness of diamond, the polishing of diamond is challenging. Since the 1920s, various conventional and modern mechanical,chemical, and thermal polishing techniques have been proposed and developed for finishing diamond surfaces. Therefore, to impart proper guidance on selecting a good polishing technique for production practice, this paper presents an in-depth and informative literature survey of the current research and engineering developments regarding diamond polishing. At first, a brief review of the general developments and basic material removal principles is discussed. This review concludes with a detailed analysis of each techniques' polishing performance and critical challenges, and a discussion of the new insights and future applications of diamond polishing.

关键词： diamond polishing material removal anisotropy ultra-smooth surface chemical reaction surface quality

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