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Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects

Advanced photonics 2023年第3期5卷 118-126页

作者： Jue Wang Chengkun Cai Feng Cui Min Yang Yize Liang Jian Wang Huazhong University of Science and Technology Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic InformationWuhanChina Optics Valley Laboratory WuhanChina

Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of lightwaves, which provides a degree of freedom to expand data transmission capacity. Various techniques basedon bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, theirinherent large size, extra loss, and precise alignment requirements make these techniques relativelydifficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips withcompact size and low loss provide a promising miniaturized candidate for tailoring light in the spatialdimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnectsthat are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonicchips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on theplatform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing,and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnectsusing OAM modes are demonstrated in the experiment with favorable performance. This work paves the wayto flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile opticalinterconnects and other emerging applications with spatial modes.

关键词： orbital angular momentum three-dimensional photonic chips femtosecond laser writing spatial modes chip-chip chip-fiber-chip optical interconnects

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