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Interfacial behavior of a thermoelectric film bonded to a graded substrate

Applied Mathematics and Mechanics(English Edition) 2023年第11期44卷 1853-1870页

作者： Juan PENG Dengke LI Zaixing HUANG Guangjian PENG Peijian CHEN Shaohua CHEN School of Materials Science and Physics State Key Laboratory for Geomechanics and Deep Underground EngineeringSchool of Mechanics and Civil EngineeringChina University of Mining and TechnologyXuzhou 221116Jiangsu ProvinceChina State Key Laboratory of Mechanics and Control of Mechanical Structures Nanjing University of Aeronautics and AstronauticsNanjing 210016China College of Mechanical Engineering Zhejiang University of TechnologyHangzhou 310014China State Key Laboratory of Solid Lubrication Lanzhou Institute of Chemical PhysicsChinese Academy of SciencesLanzhou 730000China Institute of Advanced Structure Technology Beijing Institute of TechnologyBeijing 100081China Beijing Key Laboratory of Lightweight Multi-functional Composite Materials and Structures Beijing Institute of TechnologyBeijing 100081China Collaborative Innovation Center of Electric Vehicles in Beijing Beijing Institute of TechnologyBeijing 100081China

To improve the thermoelectric converting performance in applications such as power generation,reutilization of heat energy,refrigeration,and ultrasensitive sensors in scramjet engines,a thermoelectric film/substrate system is widely designed and applied,whose interfacial behavior dominates the strength and service life of thermoelectric ***,a theoretical model of a thermoelectric film bonded to a graded substrate is *** interfacial shear stress,the normal stress in the thermoelectric film,and the stress intensity factors affected by various material and geometric parameters are comprehensively *** is found that adjusting the inhomogeneity parameter of the graded substrate,thermal conductivity,and current density of the thermoelectric film can reduce the risk of interfacial failure of the thermoelectric film/graded substrate *** a stiffer and thicker thermoelectric film is advantageous to the reliability of the thermoelectric film/graded substrate *** results should be of great guiding significance for the present and upcoming applications of thermoelectric materials in various fields.

关键词： thermoelectric film graded substrate interfacial behavior singular integral equation shear stress intensity factor

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Simultaneous increase in seebeck and thermal stability of polyaniline by preparing epitaxial crystalline polyaniline on reduced graphene Oxide

Simultaneous increase in seebeck and thermal stability of po...

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第八届中国功能材料及其应用学术会议

作者： YANG Yong-ning ZUO Fan-yu WANG Jia-yu CONG Qing TONG Zhong-qiu LI Yao Center for Composite Materials and Structures Harbin Institute of Technology

Flexible and free-standing graphene/polyaniline(PANI) composite thermoelectric film was prepared through epitaxially growing crystalline polyaniline on reduced graphene oxide(GO).TEM,XRD,FTIR,Raman,TGA and SEM showed that the single crystalline PANI film grew along the graphene *** with pristine PANI,the composite which has high-quality P/N junction between the graphene and the polyaniline film in microscale showed higher ZT value and higher thermal *** maximum thermoelectric figure of merit is up to2.84*10,2 orders of magnitude higher than that of pristine *** decomposition temperature is up to 743 K,100K higher than pristine *** compressionmolding pellets which made voltage of 0.2volts at 200 K temperature difference can be fabricated for various form and size by different mode.

关键词： thermoelectric film P/N junction Freestanding Higher ZT value

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