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A general White–Box strategy for designing thermoelectric cooling system

InfoMat 2022年第11期4卷 132-150页

作者： Kang Zhu Biao Deng Xin Qian Yupeng Wang Huan Li Peng Jiang Ronggui Yang Weishu Liu Department of Materials Science and Engineering Southern University of Science and TechnologyShenzhenGuangdongChina Key Laboratory of Energy Conversion and Storage Technologies Ministry of EducationSouthern University of Science and TechnologyShenzhenGuangdongChina School of Energy and Power Engineering Huazhong University of Science and TechnologyWuhanHubeiChina State Key Laboratory of Catalysis CAS Center for Excellence in NanoscienceDalian Institute of Chemical PhysicsChinese Academy of SciencesDalianLiaoningChina

thermoelectric cooling(TEC)is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation.The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions,that is,fixed terminal temperatures,but are unable to deal with a real TEC system where heat transfer at its interfaces with the heat source and sink are finite and with thermal resistances.Here,we define the TEC system-level performance indices,that is,the maximum cooling power,temperature difference,and coefficient of performance,by introducing a set of explicit formulae.The external heat transfer conditions are taken into account as dimensionless thermal resistance parameters.With these formulae,the TEC system performances are evaluated elegantly with errors well within±5%over broad operating conditions.We further optimize the cooling power and the coefficient of performance in practical scenarios and establish a general White–Box design procedure for TEC systems,which enables a transparent design process and straightforward analysis of performance bottlenecks.A set of cooling experiments are performed to validate the analytical model and to illustrate the dependence of system design on realistic thermal conditions.By choosing the suitable TEC module parameter under given external heat transfer conditions,the cooling power can be improved by more than 100%.This work sheds some light on the integral design of TEC systems for broad applications to take full advantage of the advanced thermoelectric materials in the cooling field.

关键词： system-level performance thermoelectric cooling White–Box design

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Comprehensive energy, economic, environmental assessment of a building integrated photovoltaic-thermoelectric system with battery storage for net zero energy building

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Building Simulation 2022年第11期15卷 1923-1941页

作者： Yongqiang Luo Nan Cheng Shicong Zhang Zhiyong Tian Guozhi Xu Xinyan Yang Jianhua Fan School of Environmental Science and Engineering Huazhong University of Science and TechnologyWuhan 430074China Institute of Building Environment and Energy China Academy of Building ResearchBeijing 100013China Department of Civil Engineering Technical University of DenmarkLyngbyDK2800Denmark

To realize the goal of net zero energy building(NZEB),the integration of renewable energy and novel design of buildings is needed.The paths of energy demand reduction and additional energy supply with renewables are separated.In this study,those two are merged into one integration.The concept is based on the combination of photovoltaic,thermoelectric modules,energy storage and control algorithms.Five types of building envelope systems,namely PV+TE(S1),Grid+TE(S2),PV+Grid+TE(S3),PV+Battery+TE(S4)and PV+Grid+Battery+TE(S5)are studied,from aspects of energy,economic and environmental(E3)performance.The new envelope systems can achieve thermal load reduction while providing additional cooling/heating supply,which can promote advance of NZEBs.It is found that there is a typical optimum setting of thermal energy load for each one of them with minimum annual power consumption.Except for the S1 system,the rest can realize negative accumulated power consumption in a year-round operation,which means the thermal load of building envelope could be zero.The uniform annual cost for S1 to S5 under interest rate of 0.04 are 19.78,14.77,23.83,60.53,64.94$/m2,respectively.The S5 system has the highest environmental effect with 3.04 t/m2 reduction of CO_(2) over 30 years of operation.

关键词： net zero energy building photovoltaic thermoelectric cooling building envelope energetic-economic-environmental analysis

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System-level Pareto frontiers for on-chip thermoelectric coolers

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Frontiers in Energy 2018年第1期12卷 109-120页

作者： Sevket U. YURUKER Michael C. FISH Zhi YANG Nicholas BALDASARO Philip BARLETTA Avram BAR-COHEN Bao YANG Department of Mechanical Engineering University of MarylandCollege Park MD 20742 USA Research Triangle Institute Research Triangle Park NC 27709 USA Micross Components Research Triangle Park NC 27709 USA

The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot spots. This study focuses on establishing a holistic optimization methodol- ogy for such thermoelectric coolers, in which a thermo- electric element＇s thickness and the electrical current are optimized to minimize source temperature with respect to ambient, when the thermal and electrical parasitic effects are considered. It is found that when element thickness and electrical current are optimized for a given system architecture, a ＂heat flux vs. temperature difference＂ Pareto frontier curve is obtained, indicating that there is an optimum thickness and a corresponding optimum current that maximize the achievable temperature reduc- tion while removing a particular heat flux. This methodol- ogy also provides the possible system level AT＇s that can be achieved for a range of heat fluxes, defining the upper limits of thermoelectric cooling for that architecture. In this study, use was made of an extensive analytical model, which was verified using commercially available finite element analysis software. Through the optimization process, 3 pairs of master curves were generated, which were then used to compose the Pareto frontier for any given system architecture. Finally, a case study wasperformed to provide an in-depth demonstration of the optimization procedure for an example application.

关键词： thermoelectric cooling thermal management,optimization high flux electronics

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STUDY ON SYNTHESIS PROPERTIES STRUCTURES AND APPLICATIONS OF CERAMIC SEMICONDUCTOR cooling MATERIALS (CFCC)

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Journal of Wuhan University of Technology(Materials Science) 1995年第4期10卷 31-36页

作者：崔万秋龚定农刘维华刘舒墁 Wuhan Univ of Techn. Wuhan China

Pseudoternary system (Bi2Te3-Sb2Te3-Sb2Se3) ceramic smeiconductor cooling materials were prepared in solid stare reaction with conventional techniques of sintering ceramics. The effect of doping on the properties of the material was studied. X-ray diffraction analysis showed that n-p-type materials were solid solutions based on Bi2Te3 and Sb2Te3 respectively. SEM photographs proved that the both types of materials were inhomogeneous and layer structure. The values of fingure of merit for n-type and p-type materials were 3.4 X 10(-3) K-1, respectively. The fabricated thermoelectric modules made of the materials provided excellent cooling effect.

关键词： ceramic semiconductor thermoelectric cooling

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