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Hierarchical Ni-plated melamine sponge and MXene film synergistically supported phase change materials towards integrated shape stability,thermal management and electromagnetic interference shielding

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Journal of Materials Science & Technology 2023年第1期132卷 132-143页

作者： Ziling Cheng Guojun Chang Bai Xue Lan Xie Qiang Zheng State Key Laboratory of Public Big Data Guizhou UniversityGuiyang 550025China Department of Polymer Materials and Engineering College of Materials and MetallurgyGuizhou UniversityGuiyang 550025China National Engineering Research Center for Compounding and Modification of Polymer Materials National and Local Joint Engineering Research Center for Functional Polymer Membrane Materials and Membrane ProcessesGuiyang 550014China College of Polymer Science and Engineering Zhejiang UniversityHangzhou 310000China

Along with the integrated and miniaturized development of advanced electronic devices,phase change materials(PCMs)simultaneously with efficient thermal management and high electromag-netic interference(EMI)shielding effectiveness(SE)are ungently ***,the shape-stabilized MXene/Ni-platted melamine sponge/Regenerated cellulose/Graphene nanoplate/Polyethylene glycol(MX/Ni@MS/RCG/PEG)composite PCMs comprising hierarchical Ni@MS/RCG and MXene film were fabricated via a facile encapsulation *** Ni@MS/RCG hybrid aerogel was prepared by electroless plating and sol-gel methods,and MXene film was obtained using vacuum-assisted filtra-tion *** synergistic effect of conductive Ni@MS/RCG networks and tight MXene film endows MX/Ni@MS/RCG/PEG composite PCMs with good shape stability,high cyclic reliability,large latent heat of phase change(154.3 J g^(–1)),excellent thermal conductivity(TC,0.47 W m^(–1)K^(–1))and favorable EMI shield-ing performance(32.7 dB).The TC of acceptable 0.47 W m^(–1)K^(–1)is observed for MX/Ni@MS/RCG-5/PEG at a rather low GNP content of merely 0.39 wt%.In addition,the temperature variation of MX/Ni@MS/RCG-5/PEG is a lot faster than that of pure PEG in the heating/cooling process,revealing the remarkable energy storage and release efficiency for the composite *** investigation has taken an important step to-wards shape-stabilized composite PCMs with both effective thermal management and high EMI SE for promising applications in electronic packaging and advanced energy.

关键词： Phase change material Thermal management Electromagnetic interference shielding Shape stability encapsulation

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