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Reduction of signal reflection along through silicon via channel in high-speed three-dimensional integration circuit

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Chinese Physics B 2014年第3期23卷 583-590页

作者：刘晓贤朱樟明杨银堂王凤娟丁瑞雪 Microelectronics School Xidian University

The through silicon via （TSV） technology has proven to be the critical enabler to realize a three-dimensional （3D） gigscale system with higher performance but shorter interconnect length. However, the received digital signal after trans- mission through a TSV channel, composed of redistribution layers （RDLs）, TSVs, and bumps, is degraded at a high data-rate due to the non-idealities of the channel. We propose the Chebyshev multisection transformers to reduce the signal reflec- tion of TSV channel when operating frequency goes up to 20 GHz, by which signal reflection coefficient （$11） and signal transmission coefficient （$21） are improved remarkably by 150% and 73.3%, respectively. Both the time delay and power dissipation are also reduced by 4% and 13.3%, respectively. The resistance-inductance-conductance-capacitance （RLGC） elements of the TSV channel are iterated from scattering （S）-parameters, and the proposed method of weakening the signal reflection is verified using high frequency simulator structure （HFSS） simulation software by Ansoft.

关键词： three-dimensional integrated circuit through silicon via channel signal reflection S-parameters

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Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips

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Journal of Semiconductors 2014年第1期35卷 121-128页

作者：刘晓贤朱樟明杨银堂王凤娟丁瑞雪 School of Microelectronics Xidian University Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices

In high speed three-dimensional integrated circuits （3D ICs）, through silicon via （TSV） insertion causes impedance discontinuities along the interconnect-TSV channel that results in signal reflection. As demonstrated for a two-plane interconnect structure connected by a TSV, we incorporate an appropriate capacitance at the junction to mitigate the signal reflection with gigascale frequencies. Based on 65 nm technology and S-parameter analysis, the decrease of signal reflection can be 189% at the tuned frequency of 5 GHz. Extending this method to the five-plane interconnect structure further, the reduction of signal reflection can achieve 400%. So we could broaden this method to any multilevel 3D interconnect structures. This method can also be applied to a circuit with tunable operating frequencies by digitally connecting the corresponding matching capacitance into the circuit through switches. There are remarkable improvements of the quality of the transmitting signals.

关键词： 3D integration TSV signal reflection impedance matching S-parameter

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维普期刊数据库

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Analysis of reflected signal of quad rotor UAV based on model fitting in mobile communication system

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Journal of Systems Engineering and Electronics 2022年第1期33卷 97-104页

作者： LI Xiaohui FANG Cong FAN Tao School of Telecommunication Engineering Xidian UniversityXi’an 710071China Guangzhou Institute of Technology Xidian UniversityGuangzhou 510555China

In view of the many scenes of unmanned aerial vehicle(UAV)detection,a third-party signal source is used to design a receiver to monitor the UAV.It is of great significance to understand the reflection of the signal illuminating the UAV.Taking the communication base station(BS)signal as the third-party signal source,and considering the complete transmission link,reflection changes and loss fading of the communication signal,this study conducts model fitting for irregular UAV targets,simplifying complex targets into a combination of simple targets.Furthermore,the influence of the dielectric constant of the target surface and the signal irradiation angle on the signal reflection is analyzed.The analysis shows that the simulation results of this model fitting method are consistent with the results of other literature,which provides theoretical support for the detection of low and slow small targets such as UAVs.

关键词： mobile communication signal quad rotor unmanned aerial vehicle(UAV) signal reflection model fitting

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维普期刊数据库

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Analysis of Impedance Characteristics for the Loop-cable Position And Speed Detection System

Analysis of Impedance Characteristics for the Loop-cable Pos...

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第36届中国控制会议

作者： Dai Chunhui Lei Tan Guibin Luo National University of Defense Technology Mechanical and Electrical Institute

ISBN: (纸本)9781538629185

The position and speed detection system based on the loop-cable is a non-contact method.It could fulfill the accuracy requirements of the position and speed for the mid-speed maglev train.This paper simply introduces its working principle and describes its basic structure.Considering the maglev train is one kind of traffic tool,the induction loop-cable has to adapt to the long-distance structure.The paper draws the theory about the lossless uniform transmission line and analyses the impedance characteristics of the loop-cable using Telegraphic equations（transmission line equation）.As the loop-cable has a special periodic structure,it could be equivalent to the cascade of unit rings.Meanwhile,there is impedance mismatch connection point between the loop-cable and the trackside transmission cable,so the impedance converter is designed to prevent the signal reflection.Finally,the non-uniform factor of the unit ring is analyzed and the coefficients of reflection are given.

关键词： Maglev train Position and speed detection Loop-cable Lossless uniform transmission line signal reflection

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