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Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under shock loading

Computer Modeling in Engineering & Sciences 2020年第2期122卷 661-674页

作者： Kuan-Ting Liu Chun-Lin Lu Nyan-Hwa Tai Meng-Kao Yeh Department of Power Mechanical Engineering National Tsing Hua UniversityHsinchu30013Taiwan. Department of Materials Science and Engineering National Tsing Hua UniversityHsinchu30013Taiwan.

In this study,the deformation and stress distribution of printed circuit board(PCB)with different thickness and composite materials under a shock loading.were analyzed by the finite element *** standard 8-layer PCB subjected to a shock loading.1500 g was evaluated ***,the finite element models of the PCB with different thickness by stacking various number of layers were *** addition to changing thickness,the core material of PCB was replaced from woven E-glass/epoxy to woven carbon fiber/epoxy for structural *** non-linear material property of copper foil was considered in the *** results indicated that a thicker PCB has lower stress in the copper foil in PCBs under the shock *** stress difference between the thicker PCB(2.6 mm)and thinner PCB(0.6 mm)is around 5%.Using woven carbon fiber/epoxy as core material could lower the stress of copper foil around 6.6%under the shock loading.1500 g for the PCB with 0.6 mm *** the other hand,the stress level is under the failure strength of PCBs with carbon fiber/epoxy core layers and thickness 2.6 mm when the peak acceleration changes from 1500 g to 5000 *** study could provide a reference for the design and proper applications of the PCB with different thickness and composite materials.

关键词： Stress analysis printed circuit board composite material finite element analysis shock loading.

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