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FUNDAMENTAL STUDY ON A SECURE PRINTING PROCESS USING nanowork STENCILS FOR 01005 COMPONENTS

FUNDAMENTAL STUDY ON A SECURE PRINTING PROCESS USING NANOWOR...

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2016中国高端SMT学术会议

作者： Stefan Hrter Jrg Franke Carmina Lntzsch Institute for Factory Automation and Production Systems (FAPS) Friedrich-Alexander University Erlangen-Nürnberg (FAU)

The ongoing trend of miniaturization has induced many developments towards size reduction of electronic components for highly integrated electronic *** meet the increasing requirements on the surface mount technology each step of the process chain has to be considered as well as cross-process *** process of solder paste printing occupies a key position in electronics production and will be focused in this *** on literature,about 50%to80%of all process defects originate in the stencil printing process[1–5].Despite the exact percentage of failures the process of stencil printing needs to be characterized for miniaturized printed structures as the complexity of this process step increases using materials for high integration like fine-grained solder paste materials and stencils with small openings of the *** this study,a double-sided FR4 printed circuit board was developed that allows numerous variations within the entire process chain of assembly and interconnection *** previous investigations on the printing process,the solder paste types were identified as a major effect,therefore different solder paste materials will be *** stencil foil thicknesses and aperture geometries are employed and *** alloy of the solder paste is a lead-free tin/silver/copper（SAC305）of type 4 as well as type *** stencils for the study are laser-cutted,nano-coated and optimized for small aperture geometries and aspect *** of the experiments are findings on process windows for components of the size 01005 for a secure printing *** give an outlook the results will be adapted for even smaller passive components as the component size of 03015mm and 008004,respectively.

关键词： stencil printing nano-coating nanowork transfer efficiency area ratio 01005 03015mm solder paste inspection SPI

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