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Laser projection proximity transfer for deterministic assembly of microchip arrays at scale

Science China(Technological Sciences) 2022年第9期65卷 2205-2214页

作者： HU JinLong CHEN FuRong BIAN Jing SUN NingNing WANG KaiXin LING Hong YU HaiYang GAI MengXin XU LiZhi HUANG YongAn State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and TechnologyWuhan 430074China Flexible Electronics Research Center Huazhong University of Science and TechnologyWuhan 430074China College of Electronic and Optical Engineering&College of microelectronics Nanjing University of Posts and TelecommunicationsNanjing 210023China Department of Mechanical Engineering The University of Hong KongHong Kong SAR 999077China

Deterministic assembly techniques that enable programmatic and massively parallel integration of chips are essential for the development of novel electronic systems such as micro led displays.However,large-area integration of ultrathin micro-chips with high yield and transfer accuracy remains a great challenge due to the difficulties in selective transfer,adhesion switchability,and transfer deviation.Here,a“laser projection proximity transfer(Laser PPT)”technique is presented for the deterministic assembly of microchip arrays at scale.One of the remarkable features is that the transfer status between the chip and the receiver substrate evolves from the original non-contact mode to contact mode for high-precision transfer,which overcomes the strict requirements of the flatness of stamp and substrate in contact-style transfer,and flight deviation of microchip array in noncontact-style transfer.Another feature is the rapid modulation of interfacial adhesion for reliable transfer via the use of thermally expandable microspheres to form microstructures and combining with a laser-induced blister.The adhesion regulation range is over 20 times without any damage to chip arrays.The results show that the transfer accuracy has been improved substantially with a minimum relative error of~0.5%.Combined with a laser beam projection system,demonstrations of Laser PPT for selective assembly of fragile objects onto challenging non-adhesive/cured surfaces in batch illustrate its potential in the highprecision integration of microscale chips at scale.

关键词： microtransfer printing micro led display laser lift-off interfacial adhesion

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