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interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering

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Transactions of Nonferrous Metals Society of China 2017年第4期27卷 962-970页

作者： Wei-bing GUO Tian-min LUAN Xue-song LENG Jing-shan HE Jiu-chun YAN State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin 150001 China

Soldering aluminum alloys at low temperature have great potential to avoid softening of base *** Al was solderedwith pure tin assisted by *** influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas *** is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth *** ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn *** interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical *** bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.

关键词： aluminum alloy tin ultrasonic soldering interfacial microstructure mechanical properties

Combined effects of ultrasonic vibration and FeCoNiCrCu coating on interfacial microstructure and mechanical properties of Al/Mg bimetal by compound casting

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China Foundry 2024年第5期21卷 588-598页

作者： Yuan-cai Xu Wen-ming Jiang Qing-qing Li Ling-hui Yu Xiao-peng Yu Zi-tian Fan State Key Laboratory of Materials Processing and Die&Mould Technology School of Materials Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China

In this work,a new treatment method combining ultrasonic vibration with FeCoNiCrCu high entropy alloy(HEA)coating was used to prepared Al/Mg bimetal through the lost foam compound *** effects of composite treatment involving ultrasonic vibration and HEA coating on interfacial microstructure and mechanical properties of Al/Mg bimetal were *** demonstrate that the interface thickness of the Al/Mg bimetal with composite treatment significantly decreases to only 26.99%of the thickness observed in the untreated Al/Mg *** HEA coating hinders the diffusion between Al and Mg,resulting the significant reduction in Al/Mg intermetallic compounds in the *** Al/Mg bimetal interface with composite treatment is composed of Al_(3)Mg_(2)and Mg_(2)Si/AlxFeCoNiCrCu+FeCoNiCrCu/δ-Mg+Al_(12)Mg_(17)eutectic *** interface resulting from the composite treatment has a lower hardness than that without *** acoustic cavitation and acoustic streaming effects generated by ultrasonic vibration promote the diffusion of Al elements within the HEA coating,resulting in a significant improvement in the metallurgical bonding quality on the Mg *** fracture position shifts from the Mg side of the Al/Mg bimetal only with HEA coating to the Al side with composite *** shear strength of the Al/Mg bimetal increases from 32.16 MPa without treatment to 63.44 MPa with ultrasonic vibration and HEA coating,increasing by 97.26%.

关键词： ultrasonic vibration FeCoNiCrCu HEA coating Al/Mg bimetal interfacial microstructure shear strength compound casting

Effect of interfacial microstructure on Mechanical and Tribological Properties of Cu/WS_(2) Self-Iubricating Composites Sintered by Spark Plasma Sintering

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Acta Metallurgica Sinica(English Letters) 2021年第7期34卷 913-924页

作者： Zhitao Yu Minghui Chen Qunchang Wang Xiaolan Wang Fuhui Wang Shenyang National Laboratory for Materials Science Northeastern UniversityShenyang 110819China Institute of Metal Research Chinese Academy of SciencesShenyang 110016China

In this study,Cu/WS_(2) self-lubricating composites are fabricated by spark plasma *** microstructure and its effect on mechanical and tribological properties are *** sintering temperature at 850℃promotes decomposition of WS_(2) and its following interfacial reaction with Cu to form Cu_(0.4)W_(0.6) nanoparticles and Cu_(2)S,enhancing mechanical properties as well as wear resistance of the *** the destruction of WS_(2) leads to a high friction *** the contrary,for the composites sintered at 750℃,a nanoscale diffusion zone forms at the Cu/WS_(2) ***_(2) lubricant retains its lamellar *** composite shows excellent self-lubrication performance,with a low friction coefficient of ***,its mechanical properties are low,and the wear rate is one magnitude higher.

关键词： Self-lubricating composites interfacial microstructure Wear Fracture

interfacial microstructure and mechanical behavior of Mg/Cu bimetal composites fabricated by compound casting process

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Transactions of Nonferrous Metals Society of China 2019年第6期29卷 1233-1241页

作者： De-xing XU Chang-lin YANG Kang-ning ZHAO Hong-xiang LI Ji-shan ZHANG State Key Laboratory for Advanced Metals and Materials University of Science and Technology Beijing Beijing 100083 China State Key Laboratory of Solidification Processing Northwestern Polytechnical University Xi’an 710072 China

Mg/Cu bimetal composites were prepared by compound casting method, and the microstructure evolution, phase constitution and bonding strength at the interface were *** is found that a good metallurgical bonding can be achieved at the interface of Mg and Cu,which consists of two sub-layers,i.e.,layer I with 30μm on the copper side composed of Mg2Cu matrix phase, on which a small amount of dendritic MgCu2 phase was randomly distributed;layerⅡ with 140μm on the magnesium side made up of the lamellar nano-eutectic network Mg2Cu+(Mg) and a small amount of detached Mg2Cu phase. The average interfacial shear strength of the bimetal composite is measured to be 13 *** study provides a new fabrication process for the application of Mg/Cu bimetal composites as the hydrogen storage materials.

关键词： Mg/Cu bimetal composites compound casting interfacial bonding mechanism interfacial microstructure interfacial mechanical behavior

Effect of vibration on interfacial microstructure and mechanical properties of Mg/Al bimetal prepared by a novel compound casting

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Journal of Magnesium and Alloys 2022年第8期10卷 2296-2309页

作者： Feng Guan Wenming Jiang Guangyu Li Junwen Zhu Junlong Wang Guoliang Jie Zitian Fan State Key Laboratory of Materials Processing and Die&Mould Technology School of Materials Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China State Key Laboratory for Advanced Metals and Materials University of Science and Technology BeijingBeijing 100083China

In this work,a vibration was applied in the preparation of the Mg/Al bimetal by a novel compound casting in order to improve the mechanical properties of the Mg/Al bimetal,and the effect of the vibration on the interfacial microstructure and mechanical properties of the Mg/Al bimetal was *** results indicated that the vibration had a significant effect on the interfacial microstructure and mechanical properties of the Mg/Al bimetal,but it did not change the phase compositions of the interface,which was composed of layerⅠ(Al3Mg2+Mg2Si),layerⅡ(Al_(12)Mg_(17)+Mg_(2)Si)and layerⅢ(Al_(12)Mg_(17)/δ-Mg).Without vibration,the Mg_(2)Si phase with a needle-like morphology mainly aggregated in the layerⅡof the *** the application of the vibration,the SEM and EBSD analysis results showed that the Mg_(2)Si and Al3Mg2phases in the interface were obviously refined,and the distribution of the Mg_(2)Si became more uniform,due to the strong forced convection of the molten metal resulting from the *** TEM analysis indicated that the interface between the A_(l3)Mg_(2) and Mg_(2)Si phases was non-coherent,suggesting the Mg_(2)Si particles cannot act as a heterogeneous nucleation base during the solidification process of the *** to the Mg/Al bimetal without vibration,the shear strength of the Mg/Al bimetal with vibration increased by about 50%from 31.7 MPa on average to 47.5 MPa,and the hardness of the layer I of the interface increased,and the hardness of the layerⅢ*** fracture surface transformed from a flat fracture morphology without vibration to an irregular zigzag fracture morphology.

关键词： Mg/Al bimetal Vibration Compound casting interfacial microstructure Bonding properties

Influence of TiX (X=B_2 or N) Addition on the interfacial microstructure Features of CBN Grains and AgCuTi Composite Filler

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Journal of Wuhan University of Technology(Materials Science) 2010年第4期25卷 579-582页

作者：丁文锋 College of Mechanical and Electrical Engineering Nanjing University of Aeronautics and Astronautics

Joining experiments of CBN grains to AISI 1045 steel were conducted using Ag-Cu-Ti composite fillers containing TiX （X=B2 or N） particles at 920 ℃ for 5 min. The influences of TiB2 and TiN particles on the interfacial microstructure features between CBN and filler were investigated comparatively. The experimental results show that TiN particles are more effective than TiB2 ones to control the interfacial reaction and particularly the resultants. Thermodynamic analysis reveals that the varied interfacial reaction induced by the addition of TiB2 and TiN particles is mainly atttributed to the activity change of the B and Ti elements in the brazing reaction system.

关键词： CBN brazing interfacial microstructure chemical reaction TiX addition

Effect of a direct magnetic field on the interfacial microstructure between molten aluminium and solid iron

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China Foundry 2006年第2期3卷 121-124页

作者： HAN Yi BAN Chun-yan BA Qi-xian GUO Shi-jie WANG Shu-han CUI Jian-zhong The key Laboratory of Electromagnetic Processing Materials of Ministry of EducationNortheastern UniversityShenyang 110004LiaoningP.R.China

Effect of a direct magnetic field on the interfacial microstructure between molten aluminium and solid iron was studied. The intermetallic phases formed in the intermetallic layers were investigated by means of electron probe microanalysis (EPMA) and X-ray diffraction (XRD). It was found that the DC magnetic field can reduce the average thickness of the intermetallic layer and the average aluminium content in the intermetallic layer. Moreover, the intermetallic phases formed in the intermetallic layers are identified as Al3Fe and Al5Fe2 in the absence of the DC magnetic field, while only Al5Fe2 phase present in the presence of the DC magnetic field.

关键词： Magnetic field interfacial microstructure Diffusion Intermetallic phase

Quasi-in-situ Observation of interfacial Behaviours:Recrystallization and Grain Recombination during Micro-deformed Diffusion Bonding Process

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Acta Metallurgica Sinica(English Letters) 2023年第12期36卷 2031-2044页

作者： Yu Peng Shiwei Li Feng Jin Yipeng Chen Wei Guo Jiangtao Xiong Jinglong Li State Key Laboratory of Solidification Processing Northwestern Polytechnical UniversityXi'an 710072China Shaanxi Key Laboratory of Friction Welding Technologies Northwestern Polytechnical UniversityXi'an 710072China

The interfacial behaviours of micro-deformed diffusion bonded joints were systematically *** were two typical bonding interfacial characteristics:“bond line”and migrated grain boundaries.“Bond line”was featured as fine grains and phases on the *** critical temperature of joint characterized by“bond line”was 950℃.The increased temperature 1000℃was a critical temperature which interfacial characteristic“bond line”*** second type was characterized by interfacial migration over 1000℃,in which the bonding interfaces were composed of straight grain boundaries,triple junctions,and protruding and expanding interfacial migrated ***,two different interface migration and joint forming mechanisms were observed with elevated bonding temperature:recrystallization and grain *** first one was the discontinuous dynamic recrystallization mechanism,which was observed in the joints bonded at 950℃and 1000℃.The second mechanism was the grain boundary migration mechanism based on the grain growth mechanism,of which the typical bonding temperature was 1050℃.The joint was bonded under two kinds of grain boundary migration,including strain-induced interface grain boundary migration and interface grain boundary migration at triple junction.

关键词： Diffusion bonding Critical bonding temperature interfacial microstructure Dynamic recrystallization Grain recombination

Synergistically enhanced Si_(3)N_(4)/Cu heterostructure bonding by laser surface modification

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Journal of Materials Science & Technology 2024年第15期182卷 187-197页

作者： Yanyu Song Haitao Zhu Duo Liu Xiaoguo Song Hong Bian Wei Fu Danyang Lin Caiwang Tan Jian Cao State Key Laboratory of Advanced Welding and Joining Harbin Institute of TechnologyHarbin 150001China Shandong Provincial Key Lab of Special Welding Technology Harbin Institute of Technology at WeihaiWeihai 264209China Shandong Institute of Shipbuilding Technology Harbin Institute of Technology at WeihaiWeihai 264209China

A bonding approach based on laser surface modification was developed to address the poor bonding be-tween Si_(3)N_(4) ceramic and *** bonding mechanism in Si_(3)N_(4)/Cu heterogeneous composite structure fabricated by laser modification-assisted bonding is examined by means of scanning/transmission elec-tron microscopy and thermodynamic *** the bonding process under laser modification,atomic intermixing at the interface is confirmed,as a result of the enhanced diffusion assisted by the dissocia-tion of Si_(3)N_(4) ceramic by *** dissociating Si precipitations on the surface,as well as the formation of micro-pores interfacial structure,would be the key concept of the bonding,by which the seamless and robust heterointerfaces were *** controlling the laser-modifying conditions,we can obtain a reli-able heterostructure via the optimization of the trade-off of the surface structure and bonding strength,as determined by the laser-modified surface prior to *** maximum structure depth and S ratio at the Si_(3)N_(4) surface were produced at a laser power of 56 W,corresponding to the maximal shear strength of 15.26 *** is believed that the further development of this bonding technology will advance power electronic substrate fabrication applied in high-power devices.

关键词： Silicon nitride Laser surface modification interfacial microstructure Analytical modeling Mechanical properties