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Ceramics grinding Under the Condition of Constant Pressure

厦门大学学报（自然科学版） 2002年第S1期41卷 124-125页

作者： SHEN Jian-yun 1,2, LUO Can-bin 1, XU Xi-peng 1, XU Yan-sheng 2 (1. College of Mechanical Engineering and Automation, Huaqiao Univers ity, Quanzhou 362011, China 2. College of Mechanical Engineering, Tianjin University, Tianjin 300072, China )

To meet the increasing demand on the quality and co st of precision components for the semiconductor industries, extensive studies on high efficiency and precision machining of ceramic materials have been conducted over the past several years. It is found that the effects of grinding pressure and rotational speed of spindle in the machining for the ceramic materials are v ery significant on the quality of the grinding process. In order to achieve stab le grinding conditions for improved performance, a new grinding control scheme i n which the grinding pressure is maintained constant throughout the grinding pro cess was carried out in the present study. The surface quality of ground ceramics depends on the mechanism of material remo val in the vertical grinding process. For grinding of Si 3N 4 and glass under the condition of constant pressure, increasing pressure enhances material remova l rate, and at the same time causes more machining-induced microcracks on the g round surfaces. Along with the analysis of tangential forces, specific grinding energy, and the micro observations on ground surfaces, it can be found that low pressure and high wheel speed should be selected to high efficiently remove cera mics in ductile mode in the vertical grinding. From the theoretically analytical and measured grinding temperatures in the vert ical grinding of ceramics, it is found that the analytical temperature profile w ithε= 55% has the same trend with the measured one. The measured temperature is higher that the analytical one at the beginning stage of grinding process, whic h might be contributed to the unstable grinding condition of this stage. The gri nding temperatures in the vertical grinding of ceramics under a constant are not high enough for glassy phase formation, and may not reduce surface fracture as expected. However, the temperature in dry grinding may cause thermal damage to t he resin bond diamond wheel, thereby resulting in low quality workpiece surface.

关键词： ceramic vertical grinding grinding force gr inding energy grinding temperature

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