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V_2O_5/C catalyst for liquid phase oxidation of glyoxal to glyoxylic acid

Science China Chemistry 2009年第7期52卷 1057-1062页

作者： NIU YuLan1,2 & LI RuiFeng1 1 Key Laboratory of Coal Science and Technology, Ministry of Education, Institute of Special Chemicals, Taiyuan University of Technology, Taiyuan 030024, China 2 Department of Chemical Engineering, Taiyuan Institute of Technology, Taiyuan 030008, China Key Laboratory of Coal Science and Technology Ministry of Education Institute of Special Chemicals Taiyuan University of Technology Taiyuan China Department of Chemical Engineering Taiyuan Institute of Technology Taiyuan China

A study of the catalytic activity of V2O5/C catalyst for the oxygen oxidation of glyoxal has been made, showing that glyoxylic acid can be formed without control of pH value and there is little oxalic acid from the excessive oxidation of glyoxylic acid. The studies of XRD and TEM have shown that V2O5 diffraction peaks gradually strengthen with the increase of the content of V2O5. With the content of 3% V2O5 and the calcination temperature of 573 K, V2O5/C catalyst displayed the best activity and selectivity. The conversion of glyoxal and the selectivity of glyoxylic acid reached 18.76% and 77.70% after 5 h, respectively. Moreover, V2O5/C catalyst showed small deactivation after recycling three times, which indicates that V2O5/C has a higher stability than noble metal catalysts in the reaction medium.

关键词： glyoxal glyoxylic acid V2O5/C catalyst

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Fabrication of Copper Wire Using glyoxylic Acid Copper Complex and Laser Irradiation in Air

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Materials Sciences and Applications 2015年第9期6卷 799-808页

作者： Tomoji Ohishi Ryutaro Kimura Department of Applied Chemistry Faculty of Engineering Shibaura Institute of Technology Koto-ku Japan

Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.

关键词： glyoxylic Acid Copper Complex CO2 Laser Fine Copper Wire Laser Direct Patterning Printable Electronics

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Preparation and Properties of Copper Fine Wire on Polyimide Film in Air by Laser Irradiation and Mixed-Copper-Complex Solution Containing glyoxylic Acid Copper Complex and Methylamine Copper Complex

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Materials Sciences and Applications 2018年第11期9卷 859-872页

作者： Tomoji Ohishi Naoki Takahashi Department of Applied Chemistry Faculty of Engineering Shibaura Institute of Technology Tokyo Japan

Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable metallic copper on the polyimide film was precipitated even in air. Since this copper was generated only in the laser-irradiated parts, direct patterning of copper wiring was possible. It was also found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation. The resistivity of the copper wiring was almost the same as that of the bulk of metallic copper. The developed method—combining laser irradiation to a copper-complex-coated film and electroless copper plating—enables the high-speed deposition of fine copper wiring on a polyimide film in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring without high vacuum facility and heat-treatment under inert gas.

关键词： glyoxylic Acid Copper Complex CO2 Laser Fine Copper Wire Laser Direct Patterning Polyimide Film Printable Electronics

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Synthesis, Characterization and Antibacterial Activity of Mixed Ligand (HL) Complexes Mn(ll), Co(ll), Ni(ll), Zn(ll), Cd(ll) and Hg(ll) with Azide (N<sub>3</sub><sup style="margin-left:-6px;">-</sup>)

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Open Journal of Inorganic Chemistry 2015年第4期5卷 102-111页

作者： Jassim S. Sultan Sajed M. Lateaf Dhuha K. Rashid Department of Chemistry College of Education for pure Sciences Ibn Al-Hiatham University of Baghdad Baghdad Iraq

The complexes of mixed ligand (HL) as primary ligand with azide ion (N3-) as co-ligand with Mn(ll), Co(ll), Ni(ll), Zn(ll), Cd(ll) and Hg(ll) were prepared via reaction metal (ll) chloride salt with ligand (HL) and sodium azide (NaN3) using 1:2:2 mole ratio in ethanol solvent, respectively. The complexes of mixed ligand (HL) were characterized by elemental microanalysis (C.H.N), atomic absorption chloride content, molar conductance, magnetic susceptibility, melting point, FTIR and UV-Vis spectral data. The anti bacterial activity with four kinds of bacteria, Staphylococcus aureus, Bacillus, Escherichia coli and Pseudomonas aureus was studied.

关键词： 4-Aminoantipyrine glyoxylic Acid Sodium Azide Schiff Base Azido Mixed Ligand

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