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Microstructure and texture of electroformed copper liners of shaped charges

Journal of University of Science and Technology Beijing 2002年第4期9卷 265-268页

作者： WenhuaiTian HongyeGao AilingFan XiaoouShan QiSun MaterialsScienceandEngineeringSchool UniversityofScienceandTechnologyBeijingBeijing100083China Beijing210Institute Beijing100081China

The microstructures of copper liners of shaped charges prepared byelectroforming technique were investigated by transmission electron microscopy (TEM). Meanwhile, theorientations distributing of the grains in the electroformed copper liners of shaped charges wasexamined by the electron backscattering kikuchi pattern (EBSP) technique. TEM observations haverevealed that these electroformed copper liners of shaped charges have the grain size of about 1-3mu m and the grains have a preferential orientation distribution along the growth direction. EBSPanalysis has demonstrated that the as-formed copper liners of shaped charges exhibit amicro-texture, i.e. one type of fiber texture, and the preferred growth direction is normal to thesurface of the liners.

关键词： electroformation microstructure micro-texture transmission electronmicroscopy electron backscattering kikuchi pattern

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PLASTIC DEFORMATION BEHAVIOR OF ELECTROFORMED COPPER LINER OF SHAPED CHARGE AT DIFFERENT STRAIN RATES

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Acta Metallurgica Sinica(English Letters) 2003年第1期16卷 72-77页

作者： H.Y.Gao W.H.Tian A.L.Fan Q.Sun Dept. of Mat. Phys. and Chem. Univ. of Sci. and Technol. Beijing Beijing 100083 China 210 Inst. Beijing 100081 China

The paper deals with different plastic deformation behavior of electroformed copper liner of shaped charge, deformed at high strain rate (about 1×107s-1) and normal strain rate (4×10-4s-1). The crystallographic orientation distribution of grains in recovered slugs which had undergone high-strain-rate plastic deformation during explosive detonation was investigated by electron backscattering kikuchi pattern technique. Cellular structures formed by tangled dislocations and sub-grain boundaries consisting of dislocation arrays were detected in the recovered slugs. Some twins and slip dislocations were observed in specimen deformed at normal strain rate. It was found that dynamic recovery and recrystallization take place during high-strain-rate deformation due to the temperature rising, whereas the conventional slip mechanism operates during deformation at normal strain rate.

关键词： electroformation electron backscattering kikuchi pattern cellular dislocation structure ultra-high-strain-rate deformation dynamic recovery and recrystallization

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