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electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films

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Transactions of Nonferrous Metals Society of China 2015年第7期25卷 2446-2457页

作者：丁康康李晓刚肖葵董超芳张凯赵瑞涛北京科技大学腐蚀与防护中心北京100083

The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid films with different thicknesses were investigated using stereo microscopy and scanning electron microscopy（SEM）.Meanwhile,the corrosion tendency and kinetics rule of metal plates after bias application were analyzed with the aid of electrochemical impedance spectroscopy（EIS）and scanning Kelvin probe（SKP）.Results showed that under different humidity conditions,the amount of migrating corrosion products of silver for PCB-ImAg was limited,while on PCB-HASL both copper dendrites and precipitates such as sulfate and metal oxides of copper/tin were found under a high humidity condition（exceeding 85%）.SKP results indicated that the cathode plate of two kinds of PCB materials had a higher corrosion tendency after bias *** ECM model involving multi-metal reactions was proposed and the differences of ECM behaviors for two kinds of PCB materials were compared.

关键词： immersion silver processing circuit board(PCB-ImAg) hot air solder leveling circuit board(PCB-HASL) electrochemical migration electrical bias absorbed thin liquid film

electrochemical migration Behaviors of Lead-Free 64Sn-35Bi-1Ag Solder on FR-4 PCB Board Plated with Cu

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Wuhan University Journal of Natural Sciences 2012年第1期17卷 79-85页

作者： HUA Li HOU Hanna School of Chemistry and Life Science Hubei University ofEducation Wuhan 430205 Htlbei China School of Chemistry and Chemical Engineering HuazhongUniversity of Science and Technology Wuhan 430074 HubeiChina

electrochemical migration （ECM） characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope （SEM）, energy dispersive X-ray analysis （EDAX）, and X-ray Diffraction （XRD） technologies is designed to research ECM behavior of 64Sn-35BilAg （SBA） solder in 3.5 g/L NaCl solution and compare to that of Sn37Pb and Sn-3.0Ag-O.5Cu （SAC） solders. Results show that SBA solder is more susceptible to ECM failure than Sn37Pb solder, which is more difficult than SAC solder. The affected factors of ECM are given as follows： the solder compositions, the loaded electric field, ECM time, etc. The electrochemical reaction mechanism of ECM process is achieved. EDAX and XRD analyses show that the main contents on dendrites of SBA solder after ECM test are Sn, hardly any Bi, a little Ag, which illustrates that the order of ion migration capacity is shown as follows： Sn 〉 Ag 〉Bi.

关键词： 64Sn-35Bi-lAg (SBA) solder electrochemical migration dendrites growth fractal regulation

Progress on Soldering Failure Analysis During the Period of Enlistment in Micro-Nanoelectronic Packaging

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Wuhan University Journal of Natural Sciences 2012年第3期17卷 268-276页

作者： HUA Li HOU Hanna School of Chemistry and Life Science Hubei University of Education Wuhan 430205 Hubei China School of Chemistry and Chemical Engineering Huazhong University of Science and Technology Wuhan 430074 Hubei China

With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technology,a higher requirement for soldering material and its enlistment property is *** is easily subjected to reliability failure for electronic products or components packaged with micro/nanoelectronic packaging *** this paper,research process and some typical failure mechanisms on interconnect solder point reliability are discussed,including electro-migration （EM）,thermal migration （TM）,K-cavity,corrosion,electrochemical migration （ECM） and whisker growth,*** provides the basic data for the new generation of micro/nano-packaging technique to improve the fine-pitch jointing reliability.

关键词： electromigration (EM) and thermal migration (TM) corrosion electrochemical migration whisker growth