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Steady state electrical–thermal coupling analysis of TSV

Journal of Semiconductors 2018年第9期39卷 82-87页

作者： Jingrui Chai Gang Dong Zheng Mei Weijun Zhu School of Microelectronics Xidian University

This paper presents a blended analytical electrical–thermal model for steady state thermal analysis of through-silicon-via（TSV） in three-dimensional（3 D） integrated circuits. The proposed analytical model is validated by the commercial FEM tool—COMSOL. The comparison between the results of the proposed analytical formulas and COMSOL shows that the proposed formulas have very high accuracy with a maximum error of 0.1%.Based on the analytical model, the temperature performance of TSV is studied. Design guide lines of TSV are also given as：（1） the radius of the TSV increases, the resistance decreases and the temperature can be increased;（2） the thicker the dielectric layer, the higher the temperature;（3） compared with carbon nanotube, the Cu enlarges the temperature by 34 K, and the W case enlarges the temperature by 41 K.

关键词： through-silicon-via (TSV) electrical-thermal coupling temperature iterative

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A MULTI-COUPLED FINITE ELEMENT ANALYSIS OF RESISTANCE SPOT WELDING PROCESS

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Acta Mechanica Solida Sinica 2006年第1期19卷 86-94页

作者： Hou Zhigang Wang Yuanxun Li Chunzhi Chert Chuanyao School of Civil Engineering and Mechanics Huazhong University of Science and Technology Wuhan 430074 China School of Mechtronic and Automobile Engineering Yantai University Yantai 264005 China

A two-dimensional axisymmetric finite element model is developed to analyze the transient thermal and mechanical behaviors of the Resistance Spot Welding （RSW） process using commercial software ANSYS. Firstly a direct-coupled electrical-thermal Finite Element Analysis （FEA） is performed to analyze the transient thermal characteristics of the RSW process. Then based on the thermal results a sequential coupled thermo-elastic-plastic analysis is conducted to determine the mechanical features of the RSW process. The thermal history of the whole process and the temperature distribution of the weldment are obtained through the analysis. The mechanical features, including the distributions of the contact pressure at both the faying surface and the electrode-workpiece interface, the stress and strain distributions in the weldment and their changes during the RSW process, the deformation of the weldment and the electrode displacement are also calculated.

关键词： Finite Element Analysis (FEA) Resistance Spot Welding (RSW) electrical-thermal coupling thermo-elastic-plastic analysis thermal behavior mechanical feature

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维普期刊数据库

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Finite element analysis of resistance spot welding process

Finite element analysis of resistance spot welding process

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2009中国控制与决策会议

作者： Guo Zhong School of Mechtronics & Automobile Engineering Yantai University Yantai,264005,China

＜正＞A coupled finite element model is developed to analyze the transient thermal and mechanical behaviors of Resistance Spot Welding（RSW） process using commercial software ANSYS.A direct-coupled electrical-thermal Finite Element Analysis（FEA） is firstly performed to simulate the transient thermal characteristics of RSW *** thermal history of the whole process and the temperature distribution of the weldment are obtained through the *** based on the thermal results a sequential coupled thermo-elastic-plastic analysis is conducted to determine the mechanical features of RSW *** mechanical features,including the distributions of the contact pressure at both the faying surface and the electrode-workpiece interface,the stress and strain distributions in the weldment and their changes during the RSW process and the deformation of the weldment are also calculated.

关键词： Index Terms-Finite Element Analysis(FEA) Resistance Spot Welding(RSW) electrical-thermal coupling thermo-elastic-plastic analysis

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