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A novel contact engineering method for transistors based on two-dimensional materials

Journal of Materials Science & Technology 2021年第10期69卷 15-19页

作者： Yaochen Sheng LuFang Zhang Feng Li Xinyu Chen Zhijian Xie Haiyan Nan Zihan Xu David Wei Zhan Jianhao Chen Yong Pu Shaoqing Xiao Wenzhong Bao State Key Laboratory of ASIC and System Shanghai Institute of Intelligent Electronics&SystemsSchool of MicroelectronicsFudan UniversityShanghai 200433China Engineering Research Center of IoT Technology Applications(Ministry of Education) Department of Electronic EngineeringJiangnan UniversityWuxi 214122China International Center for Quantum Materials School of PhysicsPeking UniversityBeijing 100871China New Energy Technology Engineering Laboratory of Jiangsu Province&School of Science Nanjing University of Posts and TelecommunicationsNanjing 210023China Six Carbon Tech ShenzhenShenzhen 518106China

contact engineering is of critical importance for two-dimensional(2D)transition metal dichalcogenide(TMD)-based devices.However,there are only a few solutions to overcome this obstacle because of the complexity of the TMD-contact interface.In this work,we propose a novel method using a soft plasma treatment followed by the seamless deposition of a metal electrode to reduce the contact resistance of MoS_(2)field effect transistors(FETs).The treated FETs exhibit three times higher mobility than the control FETs without plasma treatment.The soft plasma treatment can remove the facial sulfur atoms and expose the middle Mo atoms so that they come into direct contact with the metal electrode,thus greatly improving the contact behavior.First-principles calculation is also performed to support the experimental results.Our potentially scalable strategy can be extended to the whole family of TMD based FETs to provide a possible route of device processsing technology for 2D device application.

关键词： electrical contact resistance MoS_(2) Plasma

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Influence of Surface Condition on Expulsion in Spot Welding AZ31B Magnesium Alloy

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Journal of Materials Science & Technology 2005年第5期21卷 749-752页

作者： Yarong WANG, Jicai FENG and Zhongdian ZHANGState Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China

Experiments were carried out to study the influence of surface condition on expulsion during the spot welding of AZ31B Mg alloy. A general electrical contact resistance theory for conductive rough surfaces and the relation between maximum temperature Tm in the contact and voltage-drop V across interface of two surfaces were employed to understand the reason of expulsion in Mg alloy spot welding. The main reason of expulsion is that the high electrical contact resistance induced by large roughness of the surface and oxide film covered on the surface leads to local melting of metal in the interface of two surfaces, and liquid metal of the local area ejected from the specimen under electrode force forms expulsion.

关键词： Expulsion Magnesium alloy Spot-welding electrical contact resistance

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Effect of assembly pressure on the performance of proton exchange membrane fuel cell

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Energy Storage and Saving 2023年第1期2卷 359-369页

作者： Zhuo Zhang Wen-Quan Tao Key Laboratory of Thermo-Fluid Science&Engineering of MOE Xi’an Jiaotong UniversityXi’an710049China

The assembly force is a crucial factor in the process of proton exchange membrane fuel cell(PEMFC)stacking,and has significant effects on the fluid flow,mass transfer,and water and thermal management,which affect the fuel cell performance.In this study,from the most deformable component,the gas diffusion layer(GDL),combining with a finite-element analysis,and computational fluid dynamic method,the impact of the assembly force on a single-channel PEMFC is analyzed.A nonlinear stress-strain curve obtained from a microanalysis is creatively introduced into the two-dimensional compression model.The gas diffusion coefficient in the three-dimensional model is also obtained from the microscopic simulation.The simulated effective oxygen diffusion coefficient of the compressed GDL is approximately 0.86 times the Bruggemann estimated value.When the contact resistance is ignored,the output voltage at 2.5 MPa is decreased by approximately 15.4%at 1.7 A·cm^(−2)compared with that at 0.5 MPa.After the contact resistance is considered,the effects of the assembly pressure on the cell performance(V-I curve)are qualitatively different.The pressure drop of the 2.5 MPa case is 20%higher than that of the 1.4 MPa case at 1.7 A cm^(−2).O_(2)is hard to flow into the region under the rib where the porosity and permeability are lower.The results indicate that both liquid water and membrane water contents increase when the assembly force increases.The effect of the assembly force on the temperature is also analyzed.

关键词： Assembly force electrical contact resistance Compression Gas diffusivity Proton exchange membrane fuel cell

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Spatial evolution of friction of a textured wafer surface

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Friction 2013年第1期1卷 92-97页

作者： Huaping XIAO Ke WANG Grant FOX Michel BELIN Julien FONTAINE Hong LIANG Mechanical Engineering Texas A&M UniversityCollege StationTexas 77843USA Materials Science and Engineering Texas A&M UniversityCollege StationTexas 77843USA Ecole Centrale de Lyon/CNRS-UMR 5513 France

Mechanical failure of integrated circuits and micro-electro-mechanical systems(MEMS)demands new understanding of friction in small devices.In present research,we demonstrated an in situ approach to measure sliding friction of a patterned surface composing multi-materials and structures.The effects of materials and surface morphology on friction and electrical contact resistance were investigated.The material transfer at the interface of dissimilar materials was found to play dominating roles in friction.The current work provides important insights from the fundamentals of friction that benefit the design of new micro-devices.

关键词： micro-electro-mechanical systems(MEMS) patterned wafers friction transfer wear electrical contact resistance

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contact Spot Temperature and the Temperature of External Surfaces in an electrical Connection

Contact Spot Temperature and the Temperature of External Sur...

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The 26th International Conference on electrical contacts and the 4th International Conference on Reliability of electrical Products & electrical contacts

作者： C.Wilson G.Mclntosh Roland S.Timsit Design Resource Group Richmond HillONCanada L4B 3A9 Snell Infrared Canadian Training Center Richmond HillONCanada L4C 9Y5 Timron Advanced Connector Technologies TorontoONCanada M5M 1L6

Infrared thermography is widely used to monitor the health of electrical power connections in live electrical lines.Although thermal imaging is helpful in locating faulty connections,surface temper

ISBN: (纸本)9781622763139;1622763130

Infrared thermography is widely used to monitor the health of electrical power connections in live electrical lines.Although thermal imaging is helpful in locating faulty connections,surface temper

关键词： infrared thermography electrical interface electrical contacts contact spots temperature electrical contact resistance Temperature interface electronics contact pattern surface temperature electrical connection Computer Simulation Thermography Vital Signs Infrared imaging Electricity Societies Connections temperature gradients Power connection ELECTRIC WIRE

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