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diffusion bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

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Journal of Materials Science & Technology 2003年第z1期19卷 189-192页

作者： Guisheng ZOU Jun YANG Aaiping WU Genghua HUANG Deku ZHANG Jialie REN Qing WANG Department of Mechanical Engineering Tsinghua UniversityBeijing 100084China

Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr *** of processing conditions on the microstructures and shear strength of the joints were *** Tifoil is used for bonding of tungsten to pure copper but not transformed into liquid solution during the holding time,the strength of the joints is relatively low because of the multiple compound layers with brittleness formed in thebonding *** strength of the joints increases significantly if the Ti foil is transformed into liquid solution and ismostly extruded out of the bonding *** same phenomena are found in the case when Ti/Ni/Ti multi-interlayersare used for bonding tungsten to CuCrZr alloy.

关键词： Tungsten Copper Multiple interlayers diffusion bonding

diffusion bonding of AlCoCrFeNi2.1 eutectic high entropy alloy to TiAl alloy

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Journal of Materials Science & Technology 2020年第10期42卷 59-69页

作者： Peng Li Shuai Wang Yueqing Xia Xiaohu Hao Honggang Dong School of Materials Science and Engineering Dalian University of TechnologyDalian 116024China

High entropy alloys have special microstructure and remarkable *** explore their potential engineering application in high temperature structures,the microstructure evolution of bonding interface,the elemental diffusion behavior and mechanical property of the diffusion bonded joint between AlCoCrFeNi2.1eutectic high entropy alloy(EHEA)and TiAl alloy were *** reaction layers(rodlike B2 phase,Al(Co,Ni)2Ti,τ3-Al3NiTi2+TiAl,τ3-Al3NiTi2+TiAl+Ti3Al)formed in the diffusion zone near FCC phase of EHEA,but three layers(Al(Co,Ni)2Ti,τ3-Al3Ni Ti2+Ti Al,τ3-Al3Ni Ti2+Ti Al+Ti3Al)formed near B2 *** and Ni controlled the reaction diffusion of EHEA and TiAl alloy,coarsened the acicular precipitated B2 phase and turned Ti Al phase into Al(Co,Ni)2Ti andτ3-Al3NiTi2 *** these reaction layers grew in a parabolic manner as a function of bonding *** B2 phase has the lowest growth activation energy of 125.2 kJ/mol,and the growth activation energy ofτ3-Al3Ni Ti2+TiAl layer near B2 phase is much lower than that near FCC *** penetration phenomenon and convex structure formed in the diffusion zone,which resulted in interlocking effect and enhanced the strength of resultant *** highest shear strength of 449 MPa was achieved at 950℃.And the brittle fracture generally initiated at the interface between Al(Co,Ni)2Ti andτ3-Al3NiTi2+TiAl layers.

关键词： High entropy alloy TiAl alloy diffusion bonding Microstructure evolution Shear strength

diffusion bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu Interlayers

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Journal of Materials Science & Technology 2006年第6期22卷 817-820页

作者： Wei GUO Xihua ZHAO Minxia SONG Jicai FENG Biao YANG Key Laboratory of Automobile Materials （Jilin University） Ministry of Education Department of Materials Science and Engineering Jilin University Changchun 130025 China National Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China

Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and microhardness test. Intermetallic compounds at the interface zone are detected by X-ray diffraction （XRD）. Interracial microstructure of TiNi＋CuTi3＋α-Ti forms at the Ni/Ti-6Al-4V transition zone and Cu （ss. Ni） solid solution forms between Ni/Cu interlayers. The thickness of reaction layer （TiNi） increases with bonding time by a parabolic law： y^2=Koexp（-150000/RT）t, and K0=2.g×10^-7 m^2/s is figured out from the experiment data.

关键词： diffusion bonding Microstructure Interface Ni/Cu interlayers

diffusion bonding of Ti-6Al-4V to ZQSn10-10 in vacuum

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China Welding 2007年第1期16卷 1-5页

作者：宋敏霞赵熹华郭伟冯吉才黄达 College of Materials Science and Engineering Jilin UniversityChangchun130022.Feng JicaiHarbin Institute of Technology Harbin 150001 Harbin Institute of Technology Harbin 150001

The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.

关键词： Ti-6Al-4V ZQSn10-10 diffusion bonding intermetallic compound

diffusion bonding between nickel－base superalloy K24 and heat－resisting steel 1Cr11Ni2W2MoV

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China Welding 1996年第2期5卷 89-95页

作者： ZHANG Jie ZHANG Jiuhai HAN Wenbo and LI Zhuoran(Measuring and Analysis Center,School of Materials Science and Engineering, Harbin Institute of Technology,Harbin,150080.China)

The Vacuum diffusion bonding between nickel-base superalloy K24 and heatresisting steel 1Cr11Ni2W2MoV was studied and the effects of welding parameters,including bonding temperature T,pressure P,time t,vacuum V and interlayer thickness h ,on the microstructure and properties of the joint were *** optimum parameters for the diffusion bonding were found to be:T=1100￣1200℃,t=5￣30 MPa,V≥1×10-2 *** the welded specimens are tensioned at room temperature,ductile fracture takes place at the nickel-base superalloy part or at the joint and the tensile strength reaches 850 MPa,When the tensile tests are carried out at 500℃ ,all the bonded specimens fractured at heat-resisting steel part,and tensile strength is 750 *** interlayer thickness greatly affects the joint properties,and the interlayer thickness depends on the size of the bonded *** impeller of nickel-base superalloy K24 and shaft of heat-resisting steel 1Cr11Ni2MoV,which are used in aerospace engine,has been successfully jointed jointed by means of high frequency induction diffusion bonding.

关键词： superalloy heat-resisting steel diffusion bonding

Influence of Al foil interlayer on performance of vacuum diffusion bonding joint of 6061 aluminium alloy

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Journal of Iron and Steel Research International 2024年第10期31卷 2404-2412页

作者： Da-shuang Liu Jian-hua Xu Xiong-hui Li Ping Wei Yun Liang Jian Qin Hua-wei Sun Tian-ran Ding Zong-ye Ding Su-juan Zhong Lei Zhang Wei-min Long School of Material Science and Engineering Hefei University of TechnologyHefei230009AnhuiChina School of Material Science and Engineering Jiangsu University of Science and TechnologyZhenjiang212003JiangsuChina Zhengzhou Research Institute of Mechanical Engineering Co. Ltd.Zhengzhou450001HenanChina Ningbo Intelligent Machine Tool Research Institute Co. Ltd.of China National Machinery Institute GroupNingbo315700ZhejiangChina

The vacuum diffusion bonding method was used to introduce Al foil as the middle layer,and 6061 aluminium alloy was vacuum diffusion bonding *** typical microstructure characteristics and mechanical properties of 6061/Al/6061 welded joints were studied in detail,the effects of process parameters and Al intermediate layer on the microstructure and mechanical properties were revealed,and the diffusion bonding mechanism of 6061/Al/6061 welded joints was *** foil middle layer welded joint had the best performance at the temperature of 540℃,the holding time of 120 min,and the welding pressure of 4 *** bonding ratio is 95.91%,the shear strength is 79 MPa,and the deformation rate is 8.05%,and the introduction of Al intermediate layer improves the element distribution and microstructure,so that the bonding ratio of the welded joint is increased by 10.86%,the shear strength is increased by 5.55 MPa,and the deformation rate is reduced by 1.58%.The fracture morphology has typical ductile fracture characteristics.

关键词： 6061 aluminium alloy diffusion bonding Interlayer Joint performance Elemental diffusion

High-strength diffusion bonding of oxide-dispersion-strengthened tungsten and CuCrZr alloy through surface nano-activation and Cu plating

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Journal of Materials Science & Technology 2021年第33期92卷 186-194页

作者： Yuanyuan Chen Yuan Huang Fei Li Lu Han Dongguang Liu Laima Luo Zongqing Ma Yongchang Liu Zumin Wang School of Materials Science and Engineering Tianjin UniversityTianjin 300350China School of Materials Science and Engineering Hefei University of TechnologyHefei 230009China

Oxide-dispersion-strengthened tungsten(ODS-W)and a Cu Cr Zr alloy were bonded by a three-step process:(i)surface nano-activation,(ii)copper plating followed by annealing,and(iii)diffusion *** morphological and structural evolutions of ODS-W and the interface of the ODS-W/CuCrZr joint during these processes have been thoroughly studied by X-ray diffraction,scanning electron microscopy,energy dispersive spectrometry,and high-resolution transmission electron *** surface nanoactivation,a nanoporous structure of ODS-W with an average pore size of~100 nm was obtained,and the Y_(2)O_(3)particles therein remained unchanged.A Cu coating was tightly bonded with the surface nanoactivated ODS-W after Cu plating and *** interaction layer embedded with nanosized W particles was formed at the interface between ODS-W and plated Cu after the three-step ***,well-cohesive ODS-W/Cu and ODS-W/Y_(2)O_(3)/Cu interfaces were *** ODS-W/Cu Cr Zr joint showed high shear strengths(up to 201 MPa)and effective bonded area ratios(>98%).The developed three-step bonding process between ODS-W and the Cu Cr Zr alloy provides an effective support for future plasma-facing components in nuclear fusion reactor applications.

关键词： Oxide-dispersion-strengthened W Surface nano-activation Cu plating CuCrZr diffusion bonding Plasma-facing components

Superplastic Tension Behavior of Dissimilar TC4/SP700 Laminate through diffusion bonding

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Acta Metallurgica Sinica(English Letters) 2024年第2期37卷 353-363页

作者： Qianwen Zhang Tianle Li Yanbin Han Wei Zheng Xifeng Li Jianjun Wu School of Mechanical Engineering Northwestern Polytechnical UniversityXi’an710072China AVIC Xi’an Aircraft Industry Group Company Ltd Xi’an710089China Institute of Forming Technology and Equipment School of Materials Science and EngineeringShanghai Jiao Tong UniversityShanghai200030China

Superplastic forming is a practical method to manufacture complex-shaped parts of titanium alloys with large *** parts of dissimilar titanium alloys fabricated by superplastic forming can achieve excellent performance by combining the advantages of *** work displays the superplastic tension behavior and microstructural evolution of dissimilar TC4/SP700 laminate prepared by the diffusion bonding *** titanium alloys can achieve metallurgical bonding at parameters of 800℃/1 h/5 *** for dynamic recrystallization and grain growth behaviors upon superplastic tension,stress-induced phase transformation plays an important role inαtoβphase transformation apart from the elevated *** superplastic deformation can be attributed to the grain boundary sliding accommodated multiplex motion of *** addition,the retained strengths of all dissimilar TC4/SP700 laminates after superplastic deformation with different strain rates and temperatures range from 807 to 890 MPa.

关键词： TC4/SP700 laminate diffusion bonding Microstructure Superplastic tension Strength

Quasi-in-situ Observation of Interfacial Behaviours:Recrystallization and Grain Recombination during Micro-deformed diffusion bonding Process

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Acta Metallurgica Sinica(English Letters) 2023年第12期36卷 2031-2044页

作者： Yu Peng Shiwei Li Feng Jin Yipeng Chen Wei Guo Jiangtao Xiong Jinglong Li State Key Laboratory of Solidification Processing Northwestern Polytechnical UniversityXi'an 710072China Shaanxi Key Laboratory of Friction Welding Technologies Northwestern Polytechnical UniversityXi'an 710072China

The interfacial behaviours of micro-deformed diffusion bonded joints were systematically *** were two typical bonding interfacial characteristics:“bond line”and migrated grain boundaries.“Bond line”was featured as fine grains and phases on the *** critical temperature of joint characterized by“bond line”was 950℃.The increased temperature 1000℃was a critical temperature which interfacial characteristic“bond line”*** second type was characterized by interfacial migration over 1000℃,in which the bonding interfaces were composed of straight grain boundaries,triple junctions,and protruding and expanding interfacial migrated ***,two different interface migration and joint forming mechanisms were observed with elevated bonding temperature:recrystallization and grain *** first one was the discontinuous dynamic recrystallization mechanism,which was observed in the joints bonded at 950℃and 1000℃.The second mechanism was the grain boundary migration mechanism based on the grain growth mechanism,of which the typical bonding temperature was 1050℃.The joint was bonded under two kinds of grain boundary migration,including strain-induced interface grain boundary migration and interface grain boundary migration at triple junction.

关键词： diffusion bonding Critical bonding temperature Interfacial microstructure Dynamic recrystallization Grain recombination