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Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints

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Rare Metals 2007年第1期26卷 51-55页

作者： YAN Yanfu YAN Hongxing CHEN Fuxiao ZHANG Keke ZHU Jinhong School of Materials Science and Engineering Henan University of Science and Technology Luoyang 471003 China

Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.

关键词： composite solder stress creep rupture life particle-enhancement 63Sn37Pb

Influence of Temperature on creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder

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Tsinghua Science and Technology 2007年第3期12卷 296-301页

作者：闫焉服冯丽芳张柯柯文九巴 School of Materials Science and Engineering Henan University of Science and Technology

The creep properties of solder alloys are an important factor affecting the reliability of soldered joints in surface mount technologies. Particle-enhancement is one way to improve the properties of solder alloys. The temperature of the solder joint is one of the primary factors affecting the solder joint creep properties. Single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Ag particle enhancement 99.3Sn0.7Cu based composite solder and 99.3Sn0.7Cu eutectic solder to examine the influence of temperature on the creep behavior of solder joints. The results show that the solder joint creep resistance of the composite solder joint was generally superior to that of the 99.3Sn0.7Cu solder joint. The creep rupture life of the composite solder joint was reduced by increasing temperatures at a faster rate than that of the 99.3Sn0.7Cu eutectic solder joint.

关键词： creep rupture life composite solder particle-enhancement 99.3Sn0.7Cu

The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints

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China Welding 2007年第1期16卷 41-46页

作者：闫焉服闫红星陈拂晓张柯柯朱锦洪 Hennan University of Science and Technology

creep property of solder alloys is one of the important factors to affect the reliabdity of soldered joints in SMT （surface mount technology）. Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37 Pb based composite soldered joints and 63Sn37 Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37 Pb eutectic soldered joint.

关键词： creep rupture life composite soldered joints particle-enhancement 63Sn37Pb temperature