检索结果-南通市图书馆

Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Devices

Chinese Journal of Mechanical Engineering 2011年第4期24卷 561-566页

作者： ZHANG Liang XUE Songbai GAO Lili ZENG Guang YU Shenglin SHENG Zhong College of Materials Science and Technology Nanjing University of Aeronautics and Astronautics Nanjing 210016 China School of Mechanical ＆ Electrical Engineering Xuzhou Normal University Xuzhou 221116 China The 14th Research Institute China Electronics Technology Group Corporation Nanjing 210013 China

Increasing global concern about the environment is bringing regulatory （European directives） and consumer （＂green products＂） pressure on the electronics industry in Europe and Japan to reduce or completely eliminate the use of lead （Pb） in products. Among all lead-free solder alloys, SnAgCu solder system, which has better thermo-mechanical properties compared with those of SnPb solder, is proven to be one of the promising candidates for electronic assembly. Previous work also revealed that adding a small amount of rare earth Ce into SnAgCu solder can visibly improve the properties and inhibit the excessive growth of the intermetallic compound layer. Thermal fatigue properties of SnAgCuCe soldered joints in QFP devices under thermal conditions have been investigated by finite element method and experiments. Based on creep model of low stress and high stress, corresponding creep subroutine was established for simulating the stress and strain response of SnAgCuCe soldered joint from -55 ℃ to 125 ℃, and fatigue life was calculated using creep fatigue life prediction equation. Moreover, thermal cycling experiments were conducted, the experimental results were found to be close to the simulated results. In addition, the tensile force of SnAgCuCe soldered joints decreased with increasing number of thermal cycles, and the fracture mechanism transformed from toughness fracture to brittle intergranular fracture. Moreover the tensile force changes and fracture microstructure evolution could benefit the quantitative evaluations of the mechanical performances of lead-free soldered joints under thermal cycling loadings.

关键词： finite element method creep equation thermal cycling fatigue life

来源：

维普期刊数据库

同方期刊数据库评论

在线全文

学校读者我要写书评

暂无评论

APPLICABILITY OF creep CONSTITUTIVE equationS TOcreep CURVES UNDER CONSTANT LOAD

引用

Acta Metallurgica Sinica(English Letters) 1998年第6期11卷 397-404页

作者： Y.Kurata H.Utsumi Japan Atomic Energy Research Inst Ibaraki-ken Japan

Applicability of the following creep constitutive equations was investigated for normal type creep curves of Ni-18.5Cr alloy and tertiary creep dominant curves of Ni-18.5Cr16W alloy under constant load: the θ projection method describing a creep curse by a sum of two exponential terms, modified θ method describing a primary creep stage by an exponential term and a tertiary creep stage by a logarithmic term, modified Ω method describing a creep curve by a sum of two logarithmic term, 2θ method with only a tertiary creep component and Ω method. The θ, modified θ and modified Ω methods can describe normal type and tertiary creep dominant curves. Tertiary creep dominant curves of Ni-18.5Cr-16W alloy at 900℃ are also described using 2θ and Ω methods. Applicability of the modified θ and modified Ω methods is superior for constant load creep curves because they can predict creep curves up to rupture and rupture life accurately and conservatively.

关键词： creep equation θ projection method Ω method Ni-18.5Cr alloy,Ni-18.5Cr-16W alloy

来源：

维普期刊数据库

同方期刊数据库评论

在线全文

学校读者我要写书评

暂无评论

欢迎您,

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

在线全文

在线全文

请选择保存的检索档案：

请选择收藏分类：

通借通还

欢迎您,

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

在线全文

在线全文

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：