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Probing particle removal in brush scrubber cleaning with fluorescence technique

Science China(Technological Sciences) 2013年第12期56卷 2994-3000页

作者： HUANG YaTing LI Yang GUO Dan MENG ChunLing School of Material and Mechanical Engineering Beijing Technology and Business University State Key Laboratory of Tribology Tsinghua University

brush scrubber cleaning is widely used for post chemical mechanical polishing(CMP)cleaning in semiconductor *** this study,an experimental system based on fluorescence technique and particle-tracking velocimetry(PTV)technique was employed to characterize the particle removal displacement and velocity in the interface between a transparent copper film and a porous polyvinyl alcohol(PVA)brush during the cleaning *** different cleaning conditions including rotation speeds,loading pressure and cleaning agent were examined and the particle removal rate was *** and friction removal,hydrodynamic removal and mixed-type removal are the three types of particle *** with an arc trace and uniform velocity curves were removed by friction and elastic force which were related to the brush *** with a random trace and fluctuant velocity curves were removed by hydrodynamic force which was determined by the brush rotation *** increase of particle removal rate(PRR)with brush rotation speed is a logistic *** is easier to improve PRR by increasing the brush load or by adding surfactant than by increasing the brush rotation speed.

关键词： brush-scrub post CMP(chemical mechanical polishing) cleaning particle removal fluorescence technique

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