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Long-term storage life of light source modules by temperature cycling accelerated life test

Journal of Semiconductors 2014年第5期35卷 64-68页

作者：孙宁宁谭满清李平焦健郭小峰郭文涛 Institute of Semiconductors Chinese Academy of Sciences Institute of Microelectronics Chinese Academy of Sciences

Light source modules are the most crucial and fragile devices that affect the life and reliability of the interferometric fiber optic gyroscope （IFOG）. While the light emitting chips were stable in most cases, the module packaging proved to be less satisfactory. In long-term storage or the working environment, the ambient temperature changes constantly and thus the packaging and coupling performance of light source modules are more likely to degrade slowly due to different materials with different coefficients of thermal expansion in the bonding interface. A constant temperature accelerated life test cannot evaluate the impact of temperature variation on the performance of a module package, so the temperature cycling accelerated life test was studied. The main failure mechanism affecting light source modules is package failure due to solder fatigue failure including a fiber coupling shift, loss of cooling efficiency and thermal resistor degradation, so the Norris-Landzberg model was used to model solder fatigue life and determine the activation energy related to solder fatigue failure mechanism. By analyzing the test data, activation energy was determined and then the mean life of light source modules in different storage environments with a continuously changing temperature was simulated, which has provided direct reference data for the storage life prediction of IFOG.

关键词： light source modules temperature cycling storage life activation energy reliability

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EFFECT OF ARTIFICIAL WEATHERING AND temperature cycling ON THE ADHESION STRENGTH OF WATERBORNE ACRYLATE COATING SYSTEMS USED FOR WOODEN WINDOWS

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Journal of Green Building 2020年第1期15卷 3-14页

作者： Šimůnková Kristýna Hýsek Štěpán Oberhofnerová Eliška Pánek Miloš Fidan Hakan Faculty of Forestry and Wood Sciences Czech University of Life Sciences in PragueKamycka 129Prague 16500Czech Republic

The adhesion of coatings to wood is important for their long-term *** this study,the adhesion strength of water-based acrylate coatings used for wooden windows after exposure to artificial weathering(AW)and temperature cycling(TC)was *** analysis of the adhesion quality of coatings was performed via a pull-off test and failure *** 3-layered and 4-layered white and brown acrylate dispersions from six different producers were compared and the effect of coating thickness on adhesion strength was *** adhesion strength values proved to be very *** AW,the adhesion strength and its variability increased for all the *** had no statistically significant effect on the adhesion strength *** coating systems were initially characterized by lower adhesion strength,but after AW and TC,they reached higher adhesion strength values than brown *** overall highest adhesion after AW and TC was recorded for the coatings based on alkyd-acrylate hybrid basis(Producer 3),while the lowest adhesion variability after AW was measured for one type of tested acrylate coating(Producer 4).The effect of different layering on adhesion strength was not demonstrated in this study.

关键词： acrylate coatings adhesion strength artificial weathering coating thickness pull-off test temperature cycling

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Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe—Ni Solder Joints

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Journal of Materials Science & Technology 2014年第9期30卷 928-933页

作者： Hao Zhang Qing-Sheng Zhu Zhi-Quan Liu Li Zhang Hongyan Guo Chi-Ming Lai Institute of Metal Research Chinese Academy of Sciences Jiangyin Changdian Advanced Packaging Co. Ltd.

Fe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization （UBM） to evaluate the interracial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, and temperature cycling. The shear strengths for Fe-75Ni, Fe-5ONi, and Fe-3ONi solder joints after reflow were 42.57, 53.94 and 53.98 MPa, respectively, which were all satisfied the requirement of industrialization （〉34.3 MPa）. High temperature storage was conducted at 150, 175 and 200 ℃. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region below 150 ℃, and the growth speed of intermetallic compound （IMC） decreased with increasing Fe concentration. When stored at 200 ℃, the IMC thickness reached a limit for all three films after 4 days, and some cracks occurred at the interface between IMC and Fe-Ni layer. The activation energies for the growth of FeSn2 on Fe-30Ni, Fe-5ONi, and Fe-75Ni films were calculated as 246, 185, and 81 kJ/mol, respectively. temperature cycling tests revealed that SnAgCu/Fe-5ONi solder joint had the lowest failure rate （less than 10%）, and had the best interfacial reliability among three compositions.

关键词： Fe-Ni alloy Under bump metallization (UBM) Intermetallic compound (IMC) Reliability High temperature storage temperature cycling

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