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检索条件"主题词=TLP bonding joint"
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New insights into microstructural changes during transient liquid phase bonding of GTD-111 superalloy
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Transactions of Nonferrous Metals Society of China 2021年 第9期31卷 2703-2715页
作者: Javad ASADI Seyed Abdolkarim SAJJADI Hamid OMIDVAR Materials and Metallurgical Engineering Department Faculty of EngineeringFerdowsi University of MashhadMashhadIran Department of Materials and Metallurgical Engineering Amirkabir University of Technology(Tehran Polytechnic)TehranIran
The effects of joining temperature(TJ)and time(tJ)on microstructure of the transient liquid phase(tlp)bonding of GTD-111 superalloy were *** bonding process was applied using BNi-3 filler at temperatures of 1080,1120,... 详细信息
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