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Numerical Study on Effect of Non-uniform CMAS Penetration on tgo growth and Interface Stress Behavior of APS TBCs

Chinese Journal of Mechanical Engineering 2021年第6期34卷 98-113页

作者： Zhenwei Cai Zifan Zhang Yingzheng Liu Xiaofeng Zhao Weizhe Wang Key Laboratory of Power Machinery and Engineering School of Mechanical EngineeringShanghai Jiao Tong UniversityShanghai200240China Gas Turbine Research Institute Shanghai Jiao Tong UniversityShanghai200240China School of Materials Science and Engineering Shanghai Jiao Tong UniversityShanghai200240China

The penetration of CaO-MgO-Al_(2)O_(3)-SiO_(2)(CMAS)is one of the most significant factors that induce the failure of air-plasma-sprayed thermal barrier coatings(APS TBCs).The direct penetration of CMAS changes the thermal/mechanical properties of the top coat(TC)layer,which affects the thermal mismatch stress behavior and the growth of thermally grown oxide(tgo)at the TC/bond coat(BC)interface,thereby resulting in a more complicated interface stress state.In the present study,a two-dimensional global model of APS TBCs with half of the TC layer penetrated by CMAS is established to investigate the effect of non-uniform CMAS penetration on the interface stress behavior.Subsequently,a local model extracted from the global model is established to investigate the effects of interface morphologies and CMAS penetration depth.The results show that non-uniform CMAS penetration causes non-uniform tgo growth in APS TBCs,which consequently causes the stress behavior to vary along the interface.Furthermore,the CMAS pen-etration depth imposes a significant effect on the TC/tgo interface stress behavior,whereas the interface roughness exerts a prominent effect on the stress level at the BC/tgo interface under CMAS penetration.This study reveals the mechanism associated with the effect of non-uniform CMAS penetration on the interface stress behavior in APS TBCSs.

关键词： CMAS non-uniform penetration tgo growth Interface stress CMAS penetration depth Interface roughness

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Numerical simulation of TBCs residual stresses by the growth of tgo on typical interface morphology

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China Welding 2012年第2期21卷 64-68页

作者：韩志勇张华王志平 Tianjin Key Laboratory For Civil Aircraft Airworthiness And Maintenance University of ChinaTianjin300300

The effect of tgo （ thermally grown oxide ） growth based on typical interface morphology on residual stresses distribution in thermal barrier coatings was analyzed by ABAQUS software. tgo oxidation kinetics, the relationship between tgo thickness and thermal cycles number, and typical morphology including sinusoid , cone and groove were considered in the calculation process. 13 FEM （finite element method） models with different tgo thickness based on uniform interface morphology were established for analysis. The calculation results show that TCC （ top ceramic coating ） /tgo and tgo/BC （bond coating） interface residual stresses are affected significantly by inter）hce morphology and tgo thickness, both of which increase significantly with tgo growth ; the stress level in TCC/tgo interface is greater than that of tgo/BC interface ; each morphology peak exhibits tensile stress while each valley exhibits compressive stress in TCC/tgo interface; stress concentrates in such locations as each morphology center with sharp angle and the stress reaches the maximal value at the tip of each angle.

关键词： thermal barrier coatings FEM residual stress interface morphology tgo growth

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Critical scale grain size for optimal lifetime of TBCs

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Journal of Materials Science & Technology 2022年第20期115卷 241-250页

作者： Lin Chen Guo-Hui Meng Chang-Jiu Li Guan-Jun Yang State Key Laboratory for Mechanical Behavior of Materials School of Materials Science and EngineeringXi’an Jiaotong UniversityXi’an 710049China

Thermal barrier coatings(TBCs)suffer from spalling failure resulting from the rapid growth of thermally grown oxides(tgo)on the metallic bond coat.In this study,to achieve the optimal lifetime of TBCs,a lifetime phase diagram was constructed for the entire service of TBCs.Herein,both the thermal mismatch stress during thermal cycling and the tgo growth stress during thermal exposure were considered.First,thickening behavior of the Al_(2)O_(3) scale related to grain size was investigated.Second,transverse delamination failure due to the thermal mismatch stress was analyzed.Third,vertical cracking failure related to early scale growth was explored.Finally,a critical scale grain size of~2.5μm was identified for achieving the optimal lifetime of TBCs.It was experimentally proved that vertical cracking of the Al_(2)O_(3) scale occurred during early oxidation as the scale grain size was larger than~4μm after pre-oxidation.The proposed lifetime phase diagram and critical scale grain size effect serve as novel criteria for the design of next-generation durable TBCs.

关键词： tgo growth Grain size Grain boundaries Channel cracking Service lifetime

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