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Ultrasensitive,Highly Selective,Integrated Multidimensional Sensor Based on a Rigid‑Flexible Synergistic Stretchable Substrate

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Advanced Fiber Materials 2023年第4期5卷 1392-1403页

作者： Chao Ma Meng Wang Kai Wang Pierre Claver Uzabakiriho Xi Chen Gang Zhao Department of Electronic Engineering and Information Sciences University of Science and Technology of ChinaHefei 230027People’s Republic of China Institute of Advanced Technology University of Science and Technology of ChinaHefei 230027People’s Republic of China College of Mathematics Physics and Information Science and EngineeringZhejiang Normal UniversityJinhua 321004Republic of China

High-performance wearable sensors that detect complex,multidimensional signals are indispensable in practical *** existing sensors can only detect axial deformations or single stimuli,dramatically limiting their application *** this study,anisotropic strain and deformation-insensitive pressure sensors were effectively constructed based on a rigid-flexible synergistic stretchable ***,we developed a three-dimensional integrated sensor with highly directional selective sensing through reasonable design and *** integrated sensor recognizes the amplitude and direction of strain in the plane with a maximum gauge factor of 635 and an unprecedented selectivity of ***,this device can also monitor the pressure outside the plane with a sensitivity of 0.277 kPa^(-1).We further investigated the working mechanism of sensor anisotropy and confirmed the application of the sensor in detecting complex multifreedom human joint *** research discovery provides new ideas and methods for developing multidimensional sensors,which is essential for broadening the application field of wearable electronic products.

关键词： Electrospinning stencil printing Direction-aware strain sensors Deformation-insensitive pressure sensors Complex motion detection

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FUNDAMENTAL STUDY ON A SECURE printing PROCESS USING NANOWORK stencilS FOR 01005 COMPONENTS

FUNDAMENTAL STUDY ON A SECURE PRINTING PROCESS USING NANOWOR...

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2016中国高端SMT学术会议

作者： Stefan Hrter Jrg Franke Carmina Lntzsch Institute for Factory Automation and Production Systems (FAPS) Friedrich-Alexander University Erlangen-Nürnberg (FAU)

The ongoing trend of miniaturization has induced many developments towards size reduction of electronic components for highly integrated electronic *** meet the increasing requirements on the surface mount technology each step of the process chain has to be considered as well as cross-process *** process of solder paste printing occupies a key position in electronics production and will be focused in this *** on literature,about 50%to80%of all process defects originate in the stencil printing process[1–5].Despite the exact percentage of failures the process of stencil printing needs to be characterized for miniaturized printed structures as the complexity of this process step increases using materials for high integration like fine-grained solder paste materials and stencils with small openings of the *** this study,a double-sided FR4 printed circuit board was developed that allows numerous variations within the entire process chain of assembly and interconnection *** previous investigations on the printing process,the solder paste types were identified as a major effect,therefore different solder paste materials will be *** stencil foil thicknesses and aperture geometries are employed and *** alloy of the solder paste is a lead-free tin/silver/copper（SAC305）of type 4 as well as type *** stencils for the study are laser-cutted,nano-coated and optimized for small aperture geometries and aspect *** of the experiments are findings on process windows for components of the size 01005 for a secure printing *** give an outlook the results will be adapted for even smaller passive components as the component size of 03015mm and 008004,respectively.

关键词： stencil printing nano-coating nanowork transfer efficiency area ratio 01005 03015mm solder paste inspection SPI

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Comparison of stencil and Screen Printed Solar Cells

Comparison of Stencil and Screen Printed Solar Cells

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第十五届国际光伏科学与工程大会

作者： Guoxiao Yao Stuart R.Wenham Jeffery E Cotter Centre of Excellence for Advanced Silicon Photovoltaics and Photonics University of New South Wales UNSW Sydney NSW 2052 Australia

Screen printing is a traditional solar cell technology and has the key advantages of simplicity of the production process, but it suffers from the larger cell front shading and from higher cell resistive losses. stencils printing have some advantages in addressing the limitations of screen printing technology due to their capability of making high quality fine line printed features with high aspect ratio. We have fabricated the double-level stainless steel stencils with finger aperture profile of 60 |im in width and 70 μm in height by the combination of laser cutting and chemical etching. Using this stencil, finger lines of 75 μm in width and 25 μm in height were printed on finished solar cells. In contrast, the profile of the fingers printed with a traditional mesh screen is 121 μm wide and 10 μm high. The stencil-printed finger is more uniform compared to the screen printed one and has a 0.33 height-to-width aspect ratio, which is 4 times more than that of the screen-printed finger. Also the stencil printed finger has a lower resistance per unit length due to the larger cross-section area. With these advantages, the best stencil-printed solar cell has a 0.77 mA/cm higher short circuit current and a 0.01 better fill factor, and as a result, a 4.2% relative efficiency improvement compared to the best screen printed solar cell.

关键词： Double-level Stainless Steel stencil stencil printing Screen printing

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