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检索条件"主题词=Solid modeling"
22 条 记 录,以下是1-10 订阅
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Trimming self-intersections in swept volume solid modeling
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Journal of Zhejiang University-Science A(Applied Physics & Engineering) 2008年 第4期9卷 470-480页
作者: Zhi-qi XU Xiu-zi YE Zhi-yang CHEN Yin ZHANG San-yuan ZHANG State Key Laboratory of CAD & CG School of Computer Science and Technology Zhejiang University Hangzhou 310027 China College of Software Zhejiang University of Technology Hangzhou 310014 China
Swept volume solid modeling has been applied to many areas such as NC machining simulation and verification, robot workspace analysis, collision detection, and CAD. But self-intersections continue to be a challenging ... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
Flower solid modeling based on sketches
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Journal of Zhejiang University-Science A(Applied Physics & Engineering) 2008年 第4期9卷 481-488页
作者: Zhan DING Shu-chang XU Xiu-zi YE Yin ZHANG San-yuan ZHANG State Key Lab of CAD & CG School of Computer Science Zhejiang University Hangzhou 310027 China
In this paper we propose a method to model flowers of solid shape. Based on (Ijiri et al., 2005)’s method, we separate individual flower modeling and inflorescence modeling procedures into structure and geometry mode... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
Radial Supershapes for solid modeling
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Journal of Computer Science & Technology 2006年 第2期21卷 238-243页
作者: Yohan D. Fougerolle Andrei Gribok Sebti Foufou Frederic Truchetet Mongi A. Abidi Le2i Lab. UMR CNRS 5158 Universitd de Bourgogne 12 rue de la fonderie 71200 Le Creusot France IRIS Lab. The University of Tennessee Ferris Hall Knoxville 37996 TAT U.S.A.
In the previous work, an efficient method has been proposed to represent solid objects as multiple combinations of globally deformed supershapes. In this paper, this framework is applied with a new supershape implicit... 详细信息
来源: 维普期刊数据库 维普期刊数据库 评论
Constraint-Based Virtual solid modeling
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Journal of Computer Science & Technology 2000年 第1期15卷 56-63页
作者: 高曙明 万华根 彭群生 State Key Laboratory of CAD & CG Zhejiang University Hangzhou P.R. China
Constraint-based solid modeling is the kernel part of current CADsystems. It has been widely used in supporting detailed design and variational design. However, it cannot support early stage design and is not easy-to-... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
A Sufficient Condition for a Wire-Frame Representing a solid modeling Uniquely
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Journal of Computer Science & Technology 2001年 第6期16卷 595-598页
作者: 汪嘉业 陈辉 王文平 DepartmentofComputerScience ShandongUniversityJinan250100P.R.China
Generally speaking, it is impossible for a wire-frame to define a 3D object uniquely. But wire-frame as a graphics medium is still applied in some industrial areas. A sufficient condition is presented in this paper. I... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
Study on complicated solid modeling and Cartesian grid generation method
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Science China(Technological Sciences) 2014年 第3期57卷 630-636页
作者: QIN Qiang HU ChangZhen MA TianBao School of Computer Science and Technology Beijing Institute of Technology School of Software Beijing Institute of Technology State Key Laboratory of Explosion Science and Technology Beijing Institute of Technology
A Cartesian grid generation method is developed in this *** kinds of solid modeling methods,CSG and STL models,are used for complicated solid *** staircase boundary approximation is implemented to handle irregular geo... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
Virtual Reality Based solid modeling
Virtual Reality Based Solid Modeling
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第五届全球智能控制与自动化大会会议
作者: Yongmin Zhong and Xiaobu YuanSchool of Computer ScienceUniversity of Windsor Windsor Ontario N9B 3P4 Canada Weiyin Ma Dep. of Manufacturing Engineering & Engineering ManagementCity University of Hong Kong 83 Tat Chee Avenue Kowloon Hong Kong
<正> This paper presents an approach for intuitive and precise solid modeling in virtual reality environments. It develops a hierarchically structured and constraint-based data model to support object modeling, and ... 详细信息
来源: cnki会议 评论
Research on Three-Dimensional Simulation of the Internal Arc Gear Skiving
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Mechanical Engineering Science 2024年 第1期6卷 35-40页
作者: Xiaoqiang WU Rui XUE Erkuo GUO Dongzhou JIA Taiyan GONG Zengrong LI Haijun YANG Xiaoxue LI Xin JIANG Shuai DING Yong LIU Shitian LI School of Mechanical and Traffic Engineering Ordos Institute of TechnologyOrdosInner Mongolia017000China Tianjin TANHAS Technology Co. LTDTianjin301600China School of Mechanical Engineering Jiangsu UniversityZhenjiangJiangsu212002China College of Mechanical Engineering and Automation Liaoning University of TechnologyJinzhouLiaoning121001China Inner Mongolia Ruite Precision Mould Co. LTD.The First Machinery GroupBaotouInner Mongolia014030China Inner Mongolia University Of Technology College Of Energy And Power EngineeringHohhotInner Mongolia010051China
Aiming at the problems that the simulation accuracy which is reduced due to the simplification of the model,a three-dimensional simulation method based on solid modeling is being *** analyzing the motion relationship ... 详细信息
来源: 维普期刊数据库 维普期刊数据库 评论
An Algorithm for Constructing 3D Struts
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Journal of Computer Science & Technology 2009年 第1期24卷 56-64页
作者: George W.Hart Department of Computer Science Stony Brook UniversityStony BrookNY 11794U.S.A.
A simple robust "strut algorithm" is presented which, when given a graph embedded in 3D space, thickens its edges into solid struts. Various applications, crystallographic and sculptural, are shown in which smooth h... 详细信息
来源: 维普期刊数据库 维普期刊数据库 同方期刊数据库 同方期刊数据库 评论
modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias
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Chinese Journal of Electronics 2023年 第2期32卷 365-374页
作者: YIN Xiangkun WANG Fengjuan ZHU Zhangming Vasilis F.Pavlidis LIU Xiaoxian LU Qijun LIU Yang YANG Yintang Shaanxi Key Lab.of Integrated Circuits and Systems School of Microelectronics Xidian University School of Automation and Information Engineering Xi'an University of Technique Department of Computer Science University of Manchester
Through-silicon via(TSV) provides vertical interconnectivity among the stacked dies in three-dimensional integrated circuits(3D ICs) and is a promising option to minimize 3D solenoid inductors for on-chip radio-freque... 详细信息
来源: 同方期刊数据库 同方期刊数据库 评论