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A comprehensive review of radiation effects on solder alloys and solder joints

Defence Technology（防务技术） 2024年第9期39卷 86-102页

作者： Norliza Ismail Wan Yusmawati Wan Yusoff Nor Azlian Abdul Manaf Azuraida Amat Nurazlin Ahmad Emee Marina Salleh Department of Physics Centre for Defence Foundation StudiesUniversiti Pertahanan Nasional MalaysiaKem Sungai BesiKuala Lumpur 57000Malaysia Department of Mineral and Geoscience Malaysia Mineral Research CentreJalan Sultan Azlan ShahIpoh 31400PerakMalaysia

In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

关键词： Defence technology solder alloy solder joints Radiation-induced effect Microstructure Mechanical properties

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Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys

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International Journal of Minerals,Metallurgy and Materials 2009年第6期16卷 691-695页

作者： Yan-fu Yan Yan-sheng Wang Li-fang Feng Ke-xing Song Jiu-ba Wen Henan Key Laboratory of Advanced Non-ferrous Metals Luoyang 471003 China Architecture and Civil Engineering Institute Henan University of Science and Technology Luoyang 471003 China

To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.

关键词： solder alloy Ag Ni melting point solderability

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