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Wetting of molten sn-3.5ag-0.5cu on Ni-P(-SiC) coatings deposited on high volume faction SiC/Al composite

Transactions of Nonferrous Metals Society of China 2018年第9期28卷 1784-1792页

作者： Xiang-zhao ZHANG Xiao-lang WU Gui-wu LIU Wen-qiang LUO Ya-jie GUO Hai-cheng SHAO Guan-jun QIAO School of Materials Science and Engineering Jiangsu UniversityZhenjiang 212013China School of Materials Science and Engineering Chang’an UniversityXi’an 710064China State Key Laboratory for Mechanical Behavior of Materials Xi’an Jiaotong UniversityXi’an 710049China

The wetting of molten sn-3.5ag-0.5cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting systems were *** SiC particles are evenly distributed in the coating and enveloped with *** reaction layer is observed at the coating/SiCp/Al composite *** contact angle increases from^19°with the Ni-P coating to 29°,43°and 113°with the corresponding Ni-P-3SiC,Ni-P-6SiC and Ni-P-9SiC coatings,*** interaction layer containing cu,Ni,sn and P forms at the sn-ag-cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces,and the cu-Ni-sn and Ni-sn-P phases are detected in the interaction ***,the molten sn-ag-cu can penetrate into the Ni-P(-SiC)coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate.

关键词： Ni coating sn-ag-cu alloy SiCp/Al composite wetting microstructures interface

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Effects of bismuth on growth of intermetallic compounds in sn-ag-cu Pb-free solder joints

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Transactions of Nonferrous Metals Society of China 2006年第S2期 739-743页

作者： LI Guo-yuan, SHI Xun-qing School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 Intel Technology Development Ltd, Shanghai 200131, China

The effects of Bi addition on the growth of intermetallic compound (IMC) formation in sn-3.8ag-0.7cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in sn-ag-cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.

关键词： sn-ag-cu alloy Pb-free solder intermetallics solder joint bismuth interconnects

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