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smart fibers for Self‑Powered Electronic Skins

Advanced Fiber Materials 2023年第2期5卷 401-428页

作者： Xiaoshuang Lv Yang Liu Jianyong Yu Zhaoling Li Bin Ding Shanghai Frontier Science Research Center for Modern Textiles College of TextilesDonghua UniversityShanghai 201620China College of Information Science and Technology Donghua UniversityShanghai 201620China Innovation Center for Textile Science and Technology Donghua UniversityShanghai 200051China

smart fibers are considered as promising materials for the fabrication of wearable electronic skins owing to their features such as superior flexibility,light weight,high specific area,and ease of modification.Besides,piezoelectric or triboelectric electronic skins can respond to mechanical stimulation and directly convert the mechanical energy into electrical power for self-use,thereby providing an attractive method for tactile sensing and motion perception.The incorporation of sensing capabilities into smart fibers could be a powerful approach to the development of self-powered electronic skins.Herein,we review several aspects of the recent advancements in the development of self-powered electronic skins constructed with smart fibers.The summarized aspects include functional material selection,structural design,pressure sensing mechanism,and proof-to-concept demonstration to practical application.In particular,various fabrication strategies and a wide range of practical applications have been systematically introduced.Finally,a critical assessment of the challenges and promising perspectives for the development of fiber-based electronic skins has been presented.

关键词： smart fibers Electronic skins Self-power Piezoelectric effect Triboelectric effect

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Predicting the Thermal Behavior in Functional Textile fibers Having Embedded Electronics

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Advanced Fiber Materials 2022年第6期4卷 1609-1619页

作者： Shaun Berry Shawn Redmond Tairan Wang Mordechai Rothschild MIT Lincoln Laboratory 244 Wood StreetLexingtonMA 02421USA

In this paper,both steady-state and transient thermal simulations were performed on functional fibers having an embedded electronic chip acting as a heat source.Simulations were conducted for a range of different fiber materials and arbitrary fiber cross-sectional shapes.We show that under steady-state heating conditions,the thermal response for any arbitrary fiber shape and fiber material system was convection dominated regardless of the effective thermal conductivity of the fiber,and that the corresponding temperature rise within the fiber can be predicted analytically allowing for the maximum temperature to be estimated for any known heat load and fiber geometry.In the case of transient heating,we show that for pulsed power operation of the embedded electronic device,the maximum temperature reached in the fiber is always greater than the maximum temperature of the equivalent steady-state average power.However,high peak powers can be safely achieved if the power-on pulse time and duty cycle are selected to limit the maximum temperature reached in the fiber.Based on the results from the transient simulations,a set of criteria was developed to determine whether the operating conditions would be:(1)allowable for the fiber system,thus requiring no transient simulations,(2)requiring a transient simulation to verify that the maximum temperature is acceptable,and(3)the operating conditions are too severe and device operation at these conditions are not practical.

关键词： Functional fibers smart fibers Thermal modeling Fabrics MOEMS

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