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Ultra-high-aspect-ratio structures through silicon using infrared laser pulses focused with axicon-lens doublets

Light(Advanced Manufacturing) 2024年第3期5卷 1-15页

作者： Niladri Ganguly Pol Sopena David Grojo Aix-Marseille University CNRSLP3 UMR 7341F-13009 MarseilleFrance

We describe how a direct combination of an axicon and a lens can represent a simple and efficient beam-shaping solution for laser material processing *** produce high-angle pseudo-Bessel micro-beams at 1550 nm,which would be difficult to produce by other *** with appropriate stretching of femtosecond pulses,we access optimized conditions inside semiconductors allowing us to develop high-aspect-ratio refractive-index writing *** ultrafast microscopy techniques,we characterize the delivered local intensities and the triggered ionization dynamics inside silicon with 200-fs and 50-ps *** similar plasma densities are produced in both cases,we show that repeated picosecond irradiation induces permanent modifications spontaneously growing shot-after-shot in the direction of the laser beam from front-surface damage to the back side of irradiated silicon *** conditions for direct microexplosion and microchannel drilling similar to those today demonstrated for dielectrics still remain ***,this work evidences higher energy densities than those previously achieved in semiconductors and a novel percussion writing modality to create structures in silicon with aspect ratios exceeding~700 without any motion of the *** estimated transient change of conductivity and measured ionization fronts at near luminal speed along the observed microplasma channels support the vision of vertical electrical connections optically controllable at GHz repetition *** permanent silicon modifications obtained by percussion writing are light-guiding structures according to a measured positive refractive index change exceeding *** findings open the door to unique monolithic solutions for electrical and optical through-silicon-vias which are key elements for vertical interconnections in 3D chip stacks.

关键词： Beam-shaping Infrared ultrafast laser silicon processing Through-silicon-via

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