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Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate

Rare Metals 2013年第6期32卷 537-543页

作者： Bing-Sheng Xu Li-Kun Zang Zhang-Fu Yuan Yan Wu Zhou Zhou Beijing Key Laboratory for Solid Waste Utilization and Management Department of Energy and Resources EngineeringCollege of Engineering Peking University Department of Chemistry School of Chemistry and Biology EngineeringUniversity of Science and Technology Beijing Beijing Key Laboratory for Solid Waste Utilization and Management Department of Energy and Resources Engineering College of Engineering Peking University Beijing Key Laboratory for Solid Waste Utilization and Management Department of Energy and Resources Engineering College of Engineering Peking University

The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 *** contact angles between the solder and Cu substrate at different times were recorded with high-resolution CCD digital *** smallest contact angle was observed at623 and 673 *** spreading radius does not increase monotonously with the temperature *** can be attributed to the strong dissolution of Cu substrate into the liquid solder,which hinders the solder from *** line area configuration of the Sn–17Bi–0.5Cu/Cu system was discussed by the description of the equilibrium *** calculated results based on experiments of the tension balances along each of the three interfaces show good agreement with theoretical *** compounds at the Sn–17Bi–0.5Cu/Cu interface are identified as Cu6Sn5adjacent to the solder and Cu3Sn adjacent to the Cu substrate,*** results are of practical interest for composite lead-free solders’preparations and joining of Sn–17Bi–0.5Cu to Cu substrate.

关键词： Lead-free solder Reactive wetting sessile drop method Interfaces

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Surface Tension of Molten Ni and Ni-Co Alloys

引用

Journal of Materials Science & Technology 2005年第2期21卷 201-206页

作者： FengXIAO LiangFANG KiyoshiNOGI CollegeofMaterialsScienceandEngineering ChongqingInstituteofTechnologyChongqing400050China DepaxtmentofAppliedPhysics ChongqingUniversityChongqing400044China JoiningandWeldingResearchInstitute OsakaUniversityOsaka567-0047Japan

Surface tension of molten Ni and Ni-Co (5 and 10 mass fraction) alloys was measured at the temperature range of 1773-1873 K using an improved sessile drop method with an alumina substrate in an Ar+3%H2 atmosphere. The error of the data obtained was analyzed. The surface tension of molten Ni and Ni-Co (5 and 10 mass fraction) alloys decreases with increasing temperature. The influence of Co on the surface tension of Ni-Co alloys is little in the studied Co concentration range.

关键词： Nickel Ni-Co alloys sessile drop method Surface tension

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INTERFACIAL TENSION BETWEEN SLAG AND COPPER MATTE

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Acta Metallurgica Sinica(English Letters) 1989年第12期2卷 386-391页

作者： LI Jing HUANG Kexiong CHEN Xinmin Central South University of Technology,Changsha,China

The interfacial tension between FeO-CaO-SiO_2-MgO system slag and Cu-Fe-S system matte was determinated by the X-ray radiograph sessile drop *** effects of FeO/SiO_2 ratio in the slag,contents of CaO,FeO,ZnO and CaF_2 in the slag on interracial tension and the relation of inter facial tension with the grade of matte and temperature have been *** floatation coefficient and film coefficient of slag-matte system has been calculated and the mechanism of the transition of iron and oxygen from slag to matte has also been discussed.

关键词： interfacial tension matte slag sessile drop method

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