检索结果-南通市图书馆

Optimized Mid-bond Order for 3D-Stacked ICs Considering Failed Bonding

Chinese Journal of Electronics 2015年第2期24卷 223-228页

作者： LIANG Huaguo CHANG Hao LI Yang WANG Wei CHEN Tian XU Hui School of Electronic Science & Applied Physics Hefei University of Technology School of Computer and Information Hefei University of Technology Department of Computer Science & Technology Anhui University of Finance & Economics

One notable difference between 3D test flow and 2D test flow mainly lies in the mid-bond test, in which the stacking yield can be further enhanced through optimized bonding arrangement. In contrast to the existing sequential stacking, this paper proposes a novel rearranged stacking scheme which estimates the probability and cost of failed bonding in each stacking step and optimizes the mid-bond order to screen out the failed component as early as possible. The effect of the rearranged stacking has been extensively analyzed using the yield model and cost model of 3D-SICs considering different process parameters such as die yield, stacking size, failure rate and redundancy degree of TSVs. Experimental results demonstrate that the proposed rearranged stacking method is only a half of the sequential stacking in terms of Failed area ratio(FAR).

关键词： 3D-Stacked ICs Through silicon via(TSV) 3D-SICs test sequential stacking Rearranged stacking Abort on fail

来源：

同方期刊数据库评论

在线全文

同方期刊数据库

学校读者我要写书评

暂无评论

An optimal stacking order for mid-bond testing cost reduction of 3D IC

引用

Journal of Southeast University(English Edition) 2018年第2期34卷 166-172页

作者： Ni Tianming Liang Huaguo Nie Mu Bian Jingchang Huang Zhengfeng Xu Xiumin Fang Xiangsheng School of Electronic Science and Applied Physics Hefei University of TechnologyHefei 230009China Department of Electronic Information and Electrical Engineering Hefei UniversityHefei 230601China School of Computer and Information Hefei University of TechnologyHefei 230009China

In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is built with the general consideration of both the test time for automatic test equipment(ATE)and manufacturing failure *** algorithm for testing cost and testing order optimization is proposed,and the minimum testing cost and optimized stacking order can be carried out by taking testing bandwidth and testing power as *** prove the influence of the optimal stacking order on testing costs,two baselines stacked in sequential either in pyramid type or in inverted pyramid type are *** on the benchmarks from ITC 02,experimental results show that for a 5-layer 3D IC,under different constraints,the optimal stacking order can reduce the test costs on average by 13%and 62%,respectively,compared to the pyramid type and inverted pyramid ***,with the increase of the stack size,the test costs of the optimized stack order can be decreased.

关键词： three-dimensional integrated circuit(3D IC) mid-bond test cost stacking order sequential stacking failed bonding

来源：

维普期刊数据库

同方期刊数据库评论

在线全文

学校读者我要写书评

暂无评论

欢迎您,

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

在线全文

在线全文

请选择保存的检索档案：

请选择收藏分类：

通借通还

欢迎您,

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

在线全文

在线全文

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：