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Scheduling semiconductor wafer fabrication Using a New Harmony Search Algorithm Based on Receipt Priority Interval

Chinese Journal of Electronics 2016年第5期25卷 866-872页

作者： ZHANG Long LIU Min HAO Jinghua WANG Xionghai DONG Jun College of Electrical Engineering Zhejiang University Department of Automation Tsinghua University

For the scheduling problem of semiconductor wafer fabrication(SWF), a new Dispatching rule based on the load balance(DRLB) is proposed. Further, a new Harmony search(HS) algorithm based receipt priority interval(HS rpi) is presented to minimize the mean cycle time. A kind of chaotic sequence is used as the harmony vector. Then, a conversion method is designed to convert the real number harmony vector to the mixed vector representing the priorities of all receipts and the algorithm parameters. In order to increase the algorithm robustness and decrease the scale of the scheduling problem, based on receipt priority interval and DRLB, we give a special conversion method used to convert the above mixed vector to the solution of the scheduling problem of SWF. Computational simulations based on the practical instances validate the proposed algorithm.

关键词： semiconductor wafer fabrication Harmony search algorithm Receipt priority interval Mean cycle time

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A Performance Driven Lot Merging Method with Closed Loop Optimization for semiconductor wafer fabrication

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Chinese Journal of Electronics 2017年第5期26卷 912-918页

作者： CAO Zhengcai HUANG Zhexiao LIU Min College of Information Science and Technology Beijing University of Chemical Technology Symbolic Computation and Knowledge Engineering of Ministry of Education Jilin University Department of Automation Tsinghua University

This paper deals with lot merging problem in semiconductor wafer fabrication *** is the possibility to merge two or more partial lots into single lot if their subsequent process routes are the same,an improved lot merging method is presented by grouping lots belonging to different *** on job information extracted from the buffers,several bin packing and knapsack solving algorithms are used to determine which lots should be *** iterative improvement procedure is introduced for optimizing merging strategy through a heuristic algorithm with resetting the ready time of critical *** closed loop structure with global revision factor is built for minimizing the impact of uncertain events while balancing the different orders processing *** to a simulation semiconductor manufacturing fab,the proposed algorithm can reduce cycle time and tardiness compared with other methods currently.

关键词： semiconductor wafer fabrication Lot merging Simulation Bin packing

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Modeling of photolithography process in semiconductor wafer fabrication systems using extended hybrid Petri nets

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Journal of Central South University of Technology 2007年第3期14卷 393-398页

作者：周炳海潘青枝王世进吴斌 School of Mechanical Engineering Shanghai Jiaotong University

To describe a semiconductor wafer fabrication flow availably, a new modeling method of extended hybrid Petri nets （EHPNs） was proposed. To model the discrete part and continuous part of a complex photolithography process, hybrid Petri nets （HPNs） were introduced. To cope with the complexity of a photolithography process, object-oriented methods such as encapsulation and classifications were integrated with HPN models. EHPN definitions were presented on the basis of HPN models and object-oriented methods. Object-oriented hybrid Petri subnet models were developed for each typical physical object and an EHPN modeling procedure steps were structured. To demonstrate the feasibility and validity of the proposed modeling method, a real wafer photolithography case was used to illustrate the modeling procedure. dynamic modeling of a complex photolithography process effectively The modeling results indicate that the EHPNs can deal with the dynamic modeling of a complex photolithography process effectively.

关键词： semiconductor wafer fabrication photolithography process hybrid Petri net object-oriented method

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A modeling method of semiconductor fabrication flows with extended knowledge hybrid Petri nets

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High Technology Letters 2008年第1期14卷 6-11页

作者：周炳海 School of Mechanical Engineering Shanghai Jiaotong UniversityShanghai 200240P.R.China

A modeling method of extended knowledge hybrid Petri nets （EKHPNs）, incorporating object-oriented methods into hybrid Petri nets （HPNs）, was presented and used for the representation ~d modeling of semiconductor wafer fabrication flows. To model the discrete and continuous parts of a complex semiconductor wafer fabrication flow, the HPNs were introduced into the EKHPNs. Object-oriented methods were combined into the EKHPNs for coping with the complexity of the fabrication flow. Knowledge anno- tations were introduced to solve input and output conflicts of the EKHPNs. Finally, to demonstrate the validity of the EKHPN method, a real semiconductor wafer fabrication case was used to illustrate the model- ing procedure. The modeling results indicate that the proposed method can be used to model a complex semiconductor wafer fabrication flow expediently.

关键词： semiconductor wafer fabrication knowledge Petri nets object-oriented methods

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