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A comprehensive review of radiation effects on solder alloys and solder joints

Defence Technology（防务技术） 2024年第9期39卷 86-102页

作者： Norliza Ismail Wan Yusmawati Wan Yusoff Nor Azlian Abdul Manaf Azuraida Amat Nurazlin Ahmad Emee Marina Salleh Department of Physics Centre for Defence Foundation StudiesUniversiti Pertahanan Nasional MalaysiaKem Sungai BesiKuala Lumpur 57000Malaysia Department of Mineral and Geoscience Malaysia Mineral Research CentreJalan Sultan Azlan ShahIpoh 31400PerakMalaysia

In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

关键词： Defence technology Solder alloy Solder joints radiation-induced effect Microstructure Mechanical properties

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