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On the Profiling of Air Leakage Infiltration Pattern across Chinese Vernacular Buildings

Journal of Smart Buildings and Construction Technology 2023年第1期5卷 29-51页

作者： Samuel I.Egwunatum Udubra E.Akpezi Osamudiamen K.Otasowie Imole A.Awodele Department of Quantity Surveying Federal University of TechnologyOwerri460114Nigeria Department of Civil Engineering Delta State University of Science and TechnologyOzoro334113Nigeria Department of Quantity Surveying Durban University of TechnologyDurban4000South Africa

The purpose of this paper is to provide understanding of the seasonal pattern of air leakage(infiltration)in Chinese vernacular buildings across China’s five climate *** achieving the set purpose,a grand extensive literature survey was conducted and supported with data drawn from established Meteonorm V6.1 on sensible heat and psychrometric *** computations for normalized and specific infiltration from stack effects followed the Gowri method in line with ASHRAE reference *** energy admittance into building followed Bouger’s model form Angstrom *** the distribution of vernacular buildings across five climate regions of China,evidence from computational and numerical values showed symmetries in terms of minimums and maximums times of ***,a reciprocal pattern exists between solar radiative admittance and region’s temperature *** that Chinese vernacular building heritage extended to further Asia,this research became limited to only the Chinese *** became difficult to report if the construction culture away from China has correlation with infiltration and energy admittance *** works on Chinese climate and vernacular dwellings reported a climate responsive dwelling designed by passive cooling strategy;a gap was closed by extending the previous work to specific infiltration pattern and energy admittance *** vernacular buildings by virtue of research outcomes are and should be adoptable to modern housing needs for cultural integration.

关键词： Infiltration Vernacular building Seasonal pattern psychrometric Solar radiation Admittance

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