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Design and Optimization of Heat Dissipation and Cooling Device for the Open 3D printer

Design and Optimization of Heat Dissipation and Cooling Devi...

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第32届中国控制与决策会议

作者： Cui Qingquan Yin Xunhe Ning Jing School of Innovation and entrepreneurship Yunnan Land and Resources Vocational College School of Electronics and Information Engineering Beijing Jiaotong University School of Economics and Management Yunnan Agricultural University

ISBN: (数字)9781728158556

ISBN: (纸本)9781728158563

The 3D printer is a machine for cumulative manufacturing, which is a digital model file, and three-dimensional objects are made of printing layer adhesive material. At present, the items printed out by a 3D printer will have a higher amount of heat, and taking out the printed items directly will cause burns to their hands. In addition, in the moment of picking up the print, the sudden release of the heat will also cause damage to the print. In the process of printing, the main control board will increase the environment of the printing area because of the working heat and the temperature of the print head, which will seriously affect the printing quality and the service life of the printer. Therefore, the open 3D printer is designed in the paper. The heat dissipation and cooling device of the machine is optimized to reduce the temperature of the main control board, and the extrusion head temperature of the printer reaches the printing working temperature without affecting the surrounding structure. Through the experimental verification and analysis, the effectiveness of the heat dissipation and cooling device of 3D printer designed in this paper is proved, which provides an effective solution for the heat dissipation research of 3D printer.

关键词： 3D printer Heat Dissipation and Cooling Device Main control board printer extrusion head

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