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THERMAL FRACTURE OF FUNCTIONALLY GRADED PLATE WITH parallel SURFACE cracks

Acta Mechanica Solida Sinica 2009年第5期22卷 453-464页

作者： Yuezhong Feng Zhihe Jin Department of Mechanical Engineering University of Maine Orono ME 04469 USA

This work examines the fracture behavior of a functionally graded material （FGM） plate containing parallel surface cracks with alternating lengths subjected to a thermal shock. The thermal stress intensity factors （TSIFs） at the tips of long and short cracks are calculated using a singular integral equation technique. The critical thermal shock △Tc that causes crack initiation is calculated using a stress intensity factor criterion. Numerical examples of TSIFs and △Tc for an Al2O3/Si3N4 FGM plate are presented to illustrate the effects of thermal property gradation, crack spacing and crack length ratio on the TSIFs and △Tc. It is found that for a given crack length ratio, the TSIFs at the tips of both long and short cracks can be reduced significantly and △Tc can be enhanced by introducing appropriate material gradation. The TSIFs also decrease dramatically with a decrease in crack spacing. The TSIF at the tips of short cracks may be higher than that for the long cracks under certain crack geometry conditions. Hence, the short cracks instead of long cracks may first start to grow under the thermal shock loading.

关键词： functionally graded material thermal fracture parallel cracks alternating lengths stress intensity factor

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Thermal fracture of a functionally graded plate with parallel surface cracks

Thermal fracture of a functionally graded plate with paralle...

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损伤、断裂与微纳米力学学术研讨会

作者： Yuezhong Feng,Zhi-He Jin Department of Mechanical Engineering,University of Maine,Orono,ME 04469,USA

This work examines the fracture behavior of a functionally graded plate containing parallel surface cracks with alternating lengths subjected to a thermal *** thermal stress intensity factors(TSIFs) at the tips of long and short cracks are calculated using a singular integral equation *** critical thermal shock△Tc that causes crack initiation is calculated using a stress intensity factor *** examples of TSIFs and△Tc for an Al2O3/Si3N4 FGM plate are presented to illustrate the effects of thermal property gradation,crack spacing and crack length ratio on the TSIFs and△*** is found that for a given crack length ratio,the TSIFs at the tips of both long and short cracks can be reduced significantly and△Tc can be enhanced by introducing appropriate material *** TSIFs also decrease dramatically with a decrease in crack spacing. The TSIF at the tips of short cracks may be higher than that for the long cracks under certain crack geometry ***,the short cracks instead of long cracks may first start to grow under the thermal shock loading.

关键词： Functionally graded material Thermal fracture parallel cracks Stress intensity factor

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Behavior of two parallel symmetry permeable cracks in functionally graded piezoelectric materials subjected to an anti-plane shear loading

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Journal of Harbin Institute of Technology(New Series) 2007年第5期14卷 680-685页

作者：惠军峰周振功吴林志 Center for Composite Materials Harbin Institute of Technology

The behavior of two parallel symmetry permeable cracks in functionally graded piezoelectric materials subjected to an anti-plane shear loading was investigated. To make the analysis tractable, it was assumed that the material properties varied exponentially with coordinate vertical to the crack. By using the Fourier transform, the problem could be solved with the help of two pairs of dual integral equations, in which the unknown variables were the jumps of the displacements across the crack surfaces. To solve the dual integral equations, the displacement on the crack surfaces was expanded in a series of Jacobi polynomials. The normalized stress and electrical displacement intensity factors were determined for different geometric and property parameters for permeable electric boundary conditions. Numerical examples were provided to show the effect of the geometry of the interacting cracks and the functionally graded material parameter upon the stress intensity factors of cracks.

关键词： functionally graded piezoelectric materials Sehmidt method dual integral equations parallel cracks

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