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Research and application of the angular rolling technology for plate mill

Advances in Manufacturing 2023年第3期11卷 462-476页

作者： Zhi-Jie Jiao Jun-Yi Luo Zhi-Qiang Wang Zhi-Peng Xu Chun-Yu He Zhong Zhao State Key Laboratory of Rolling and Automation Northeastern UniversityShenyang 110819People's Republic of China

Angular rolling technology can overcome the size limitation of plate mill equipment and product heavy steel plate with large unit weight or improve the production efficiency of small width spreading ratio *** the DEFORM software,the numerical simulation study of the angular rolling process was carried out,and the relation laws of the width,rolling force and strain of the rolled piece under different angular rolling process conditions were *** simulation results show that with the rotation angle increasing,the width of the rolled piece *** with the conventional rolling process,the rolling force changes gradually during the biting and throwing stage of the angular rolling *** the rotation angle increasing,both the equivalent strains in the thickness direction and in the width direction gradually *** to the pattern and dimension's changing formula in the double-pass angular rolling process,the prediction model of angle,reduction and width spreading is *** opening value of side guide is set for the rotation angle *** one 5000 mm heavy plate mill,the automation control system was modified,and the angular rolling technology was applied *** absolute deviation of target width does not exceed±20 mm and the relative deviation does not exceed 1%.The large unit weight plate that cannot be rolled with traditional process,can be produced now,and the annual output increases by 10000 t.

关键词： Plate mill Angular rolling Numerical simulation Width spreading Prediction model online application

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Elimination of Collector Current Impact in TSEP-based Junction Temperature Extraction Method for High-Power IGBT Modules

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Chinese Journal of Electrical Engineering 2016年第1期2卷 85-90页

作者： Xiang Wang Chongchong Zhu Haoze Luo Wuhua Li Xiangning He College of Electrical Engineering Zhejiang UniversityHangzhou430074China

Insulated gate bipolar transistor(IGBT)modules are widely employed in high-power conversion *** junction temperature ranks as one of the most important factors in the reliability of power semiconductor ***-sensitive electrical parameter(TSEP)is regarded as the promising solution to extract the junction temperature due to its non-invasion measurement,fast response and high ***,accurate collector current measurement is required if only the individual TSEP is adopted,which increases the complexity and *** this paper,the combined TSEP method is proposed to eliminate the influence of collector current(/c),where the turn-off delay time(tdoff)and maximum decrease rate of/c(max d/c/dt)are adopted and *** two TSEPs both have linear relationships withjunction temperature and/*** they are combined mathematically,the influence of/c is *** have been implemented to validate the effectiveness of the proposed *** comparison between combined TSEP and two individual TSEP methods are illustrated and analyzed.

关键词： Junction temperature thermo-sensitive electrical parameter non-invasiveness online application

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