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Advances in Molecular Electronics:A Brief Review

Engineering 2018年第6期4卷 760-771页

作者： Paven Thomas Mathew Fengzhou Fang Center of Micro/Nano Manufacturing Technology(MNMT-Dublin) University College DublinDublin D04 V1W8Ireland Center of Micro/Nano Manufacturing Technology(MNMT) Tianjin UniversityTianjin 300072China

The field of molecular electronics,also known as moletronics,deals with the assembly of molecular electronic components using molecules as the building *** is an interdisciplinary field that includes physics,chemistry,materials science,and *** mainly deals with the reduction of size of silicon *** research has been performed in developing electrical-equivalent molecular *** has established its influence in electronic and photonic applications,such as conducting polymers,photochromics,organic superconductors,electrochromics,and many *** there is a need to reduce the size of the silicon chip,attaining such technology at the molecular level is *** the experimental verification and modeling of molecular devices present a daunting task,vital breakthroughs have been achieved in this *** article combines an overview of various molecular components,such as molecular transistors,diodes,capacitors,wires,and insulators,with a discussion of the potential applications of different molecules suitable for such *** emphasize future developments and provide a brief review of different achievements that have been made regarding graphene-based molecular devices.

关键词： moletronics Molecular transistor Molecular diode Molecular capacitor Molecular wire Graphene

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Periodic energy decomposition analysis for electronic transport studies as a tool for atomic scale device manufacturing

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International Journal of Extreme Manufacturing 2020年第1期2卷 164-172页

作者： Paven Thomas Mathew Fengzhou Fang Centre of Micro/Nano Manufacturing Technology MNMT-DublinUniversity College DublinIreland State Key Laboratory of Precision Measuring Technology and Instruments Centre of Micro/Nano Manufacturing TechnologyMNMTTianjin UniversityPeople’s Republic of China

Atomic scale manufacturing is a necessity of the future to develop atomic scale devices with high precision.A different perspective of the quantum realm,which includes the tunnelling effect,leakage current at the atomic-scale,Coulomb blockade and Kondo effect,is inevitable for the fabrication and hence,the mass production of these *** these atomic-scale device development,molecular level devices must be *** theoretical studies could be an aid towards the experimental *** transport studies are the basis to realise and interpret the problems happening at this minute *** these in mind,we present a periodic energy decomposition analysis(pEDA)of two potential candidates for moletronics:phthalocyanines and porphyrins,by placing them over gold substrate cleaved at the(111)plane to study the adsorption and interaction at the interface and then,to study their application as a channel between two electrodes,thereby,providing a link between pEDA and electronic transport *** provides information regarding the bond strength and the contribution of electrostatic energy,Pauli’s energy,orbital energy and the orbital *** this analysis with electronic transport studies can provide novel directions for atomic/close-toatomic-scale manufacturing(ACSM).Literature survey shows that this is the first work which establishes a link between pEDA and electronic transport studies and a detailed pEDA study on the above stated *** results show that among the molecules studied,porphyrins are more adsorbable over gold substrate and conducting across a molecular junction than phthalocyanines,even though both molecules show a similarity in adsorption and conduction when a terminal thiol linker is attached.A further observation establishes the importance of attractive terms,which includes interaction,orbital and electrostatic energies,in correlating the pEDA study with the transport *** progressing this re

关键词： phthalocyanine porphyrin potential energy decomposition analysis potential energy surface scan moletronics ACSM Manufacturing III

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