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Influence of the zigzag fins and inlet arrangements on the cooling proficiency of the mini-channel heat sink

Propulsion and Power Research 2024年第2期13卷 194-206页

作者： A.Torbatinezhad Y.Pahamli M.J.Hosseini R.Bahrampoury School of Mechanical Engineering Babol University of TechnologyBabolIran Department of Mechanical Engineering Semnan UniversitySemnanIran Department of Mechanical Engineering Faculty of EngineeringGolestan UniversityGorganIran Department of Mechanical Engineering K.N.Toosi University of TechnologyTehranIran

mini-channel heatsinks are one of the most effective thermal management methods for high heatflux devices due to the high performance of convective heat *** recent years,various techniques have been innovated to improve the thermal proficiency of the mini-channel *** of these are taking advantage offins’structural designs and ar-rangements of inlets and *** zigzagfins and channels were considered in the previous works in heatsinks,and researchers analyzed their cooling enhancement ***,in the present work,a combined cooling technique,considering new-type zigzagfins’geometrical parameters(arrangement,length,and height)causes turbulenceflow and higher convective heat transfer along with different positionings offlow inlet and outlets resulting in superior temper-ature uniformity,is proposed to evaluate their impacts on the cooling proficiency of the heat sink versus different Reynolds *** assess the thermal and hydraulic performance of the proposed heatsink,different parameters,including temperature contours,Nusselt numbers,thermal resistance,and entropy generation are *** a result,it is observed that in the case demonstrating the best thermal performance,the Nusselt number,pressure drop,thermal resistance,and entropy generation are respectively 37.13,4586.46 Pa,0.000078 m^(2)·K/W,and 0.1078 W/K in the best *** well,it is found that by changing the arrangements of inlets and outlets,the Nusselt number,and thermal resistance are improved by 12%and 13%,***,the proposed mini-channel heat sink could be used as a high-performance thermal management system for electronic devices in different industries,including energy,solar,and medical sectors.

关键词： Thermal management Heat transfer enhancement mini-channel heatsink Zigzagfin Entropy generation Electronic cooling

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