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Sandwich-structured In-Ga alloy phase change thermal pad with low thermal resistance and leakage prevention

Rare Metals 2024年第12期43卷 6639-6648页

作者： Ping-Jun Luo Xu Huang Hao-Ran Yang Sheng Chu School of Materials Science and Engineering Sun Yat-Sen University

With the rapid increase in chip integration and power density,there is a growing need to develop advanced thermal interface materials for effective thermal *** metals with high thermal conductivity,excellent gap-filling capability and non-toxicity have received much ***,low-melting-point metals,such as galinstan and indium-bismuth-tin（EInBiSn） eutectic alloys,are prone to leaking,which limits their *** this study,In-Ga alloy composite thermal pads with a sandwich structure and a graphite film as an intermediate layer were *** In-Ga alloy composition was adjusted so that these pads underwent partial phase change in the operating temperature range of the laptop CPU（50-100℃）.This results in low thermal resistance and leakage *** thermal resistance of the InGa5,InGa15 and InGa25 alloy thermal pads decreases to 7.3,4.1 and 2.66 K·mm2·W-1,respectively,at a temperature and pressure of 100℃ and 50 *** a test measuring the actual cooling effect of the fabricated material on a CPU,the InGa 15 alloy thermal pad maintained the average CPU temperature at 90.1 0C,significantly better than the EInBiSn thermal pad with an average CPU temperature of 94.1 0C,and comparable to Galinstan,which had an average CPU temperature of 89.3 ℃.Due to their good heat dissipation and leak-proof properties,InGa alloy composite thermal pads are expected to become a new generation of thermal interface materials.

关键词： Composite thermal pad In–Ga alloy Leakage prevention low thermal resistance Phase change

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Enhanced thermal performance from liquid metal in copper/graphite filled elastomer

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Journal of Materials Science & Technology 2023年第21期152卷 247-255页

作者： Yisimayili Tuersun Xu Huang Mingdeng Huang Weiguang Lin Pingjun Luo Haoran Yang Sheng Chu School of Materials Science and Engineering Sun Yat-Sen UniversityGuangzhou 510006China

With the increasing integration level of modern electronics,thermal management becomes an urgent issue for guaranteeing the work efficiency and lifespan of *** the basis of intrinsic high thermal conductivity nature,highly ordered graphite and copper stripes are densely aligned in the silicone gel pads in vertical(VCuGr)and oblique(@15°CuGr)directions to couple the high thermal conductivity and mechanical *** wetting nature of liquid metal(LM)on the chemically treated Cu surface is utilized to form a LM layer on the two surfaces of thermal *** obtained LM-pad TIMs possessed ultrahigh through-plane thermal conductivity(VCuGr:71.4 W/(m K),@15°CuGr:62.5 W/(m K))under the normal packaging *** thermal resistance decreased from 0.69 cm^(2) K/W to 0.25 cm^(2) K/W with the surface modification with *** simulation and practical thermal dissipation test results further demonstrate the excellent thermal management capability of these composites in high-power electronics.

关键词： Vertical copper/graphite High thermal conductivity Liquid metal modification low thermal resistance Excellent thermal management

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