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Preparation of porous structures on copper microchannel surfaces by Laser writing

Science China(Technological Sciences) 2019年第12期62卷 2261-2270页

作者： DENG DaXiang CHEN XiaoLong CHEN Liang LIAN YunSong FU Ting School of Mechanical Engineering and Automation Harbin Institute of Technology(Shenzhen)Shenzhen 518055China Department of Mechanical&Electrical Engineering Xiamen UniversityXiamen 361005China Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering Wuhan University of Science and TechnologyWuhan 430081China

A Laser writing method is developed to fabricate porous structures on copper microchannel wall surfaces for enhanced microchannel heat sinks(MHSs). The formation feasibility together with its mechanism of such porous structures is explored by the comparison of dry and wet Laser writing process, i.e., in both air atmosphere and under de-ionized water. Rectangular microchannels with ripples-like porous structures on the wall surfaces, which consisted of numerous micro-holes and micro-cavities,have been successfully formed in the dry Laser writing process. Nevertheless, the microchannel wall surfaces were hardly altered in wet conditions. Besides, the effect of laser fluence on the formation of porous structures on the microchannels was also assessed in both dry and wet conditions. In dry Laser writing process, the microchannel depth and surface roughness of wall surface increased monotonically, whereas the microchannel bottom width decreased continuously with increasing the laser fluence. On the other hand, the microchannel wall kept almost unchanged with smooth surfaces with increasing laser fluence in wet conditions.

关键词： Laser writing porous surface microchannel heat sinks surface morphology

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laser Erasing and Rewriting of Flexible Copper Circuits

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Nano-Micro Letters 2021年第11期13卷 409-420页

作者： Xingwen Zhou Wei Guo Peng Peng School of Mechanical Engineering and Automation Beihang UniversityBeijing 100191People’s Republic of China Department of Mechanical and Mechatronics Engineering Centre for Advanced Materials JoiningUniversity of WaterlooWaterlooON N2L 3G1Canada

Integrating construction and reconstruction of highly conductive structures into one process is of great interest in developing and manufacturing of electronics,but it is quite challenging because these two involve contradictive additive and subtractive processes.In this work,we report an all-laser mask-less processing technology that integrates manufacturing,modifying,and restoring of highly conductive Cu structures.By traveling a focused laser,the Cu patterns can be fabricated on the flexible substrate,while these as-written patterns can be selectively erased by changing the laser to a defocused state.Subsequently,the fresh patterns with identical conductivity and stability can be rewritten by repeating the writing step.Further,this erasing–rewriting process is also capable of repairing failure patterns,such as oxidation and cracking.Owing to the high controllability of this writing–erasing–rewriting process and its excellent reproducibility for conductive structures,it opens a new avenue for rapid healing and prototyping of electronics.

关键词： Laser writing laser erasing Copper electrodes Electronic repairing Flexible electronics

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In-Situ Annealed Ti_(3)C_(2)T_(x) MXene Based All-Solid-State Flexible Zn-Ion Hybrid Micro Supercapacitor Array with Enhanced Stability

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Nano-Micro Letters 2021年第6期13卷 332-342页

作者： La Li Weijia Liu Kai Jiang Di Chen Fengyu Qu Guozhen Shen State Key Laboratory for Superlattices and Microstructures Institute of SemiconductorsChinese Academy of Sciences and Center of Materials Science and Optoelectronic EngineeringUniversity of Chinese Academy of SciencesBeijing 100083People’s Republic of China School of Mathematics and Physics University of Science and TechnologyBeijingBeijing 100083People’s Republic of China Falculty of Hepato-Pancreato-Biliary Surgery Chinese PLA General HospitalInstitute of Hepatobiliary Surgery of Chinese PLA and Key Laboratory of Digital Hepetobiliary SurgeryChinese PLABeijing 100853People’s Republic of China College of Chemical and Chemistry Harbin Normal UniversityHarbinPeople’s Republic of China

Zn-ion hybrid supercapacitors(SCs)are considered as promising energy storage owing to their high energy density compared to traditional SCs.How to realize the miniaturization,patterning,and flexibility of the Zn-ion SCs without affecting the electrochemical performances has special meanings for expanding their applications in wearable integrated electronics.Ti_(3)C_(2)T_(x) cathode with outstanding conductivity,unique lamellar structure and good mechanical flexibility has been demonstrated tremen-dous potential in the design of Zn-ion SCs,but achieving long cycling stability and high rate stability is still big challenges.Here,we proposed a facile Laser writing approach to fabricate patterned Ti_(3)C_(2)T_(x)-based Zn-ion micro-supercapacitors(MSCs),followed by the in-situ anneal treatment of the assembled MSCs to improve the long-term stability,which exhibits 80%of the capacitance retention even after 50,000 charge/discharge cycles and superior rate stability.The influence of the cathode thickness on the electrochemical performance of the MSCs is also studied.When the thickness reaches 0.851μm the maximum areal capacitance of 72.02 mF cm^(−2)at scan rate of 10 mV s^(−1),which is 1.77 times higher than that with a thickness of 0.329μm(35.6 mF cm^(−2)).Moreover,the fab-ricated Ti_(3)C_(2)T_(x) based Zn-ion MSCs have excellent flexibility,a digital timer can be driven by the single device even under bending state,a flexible LED displayer of“TiC”logo also can be easily lighted by the MSC arrays under twisting,crimping,and winding conditions,demonstrating the scalable fabrication and application of the fabricated MSCs in portable electronics.

关键词： Ti_(3)C_(2)T_(x) MXene Laser writing Zn-ion hybrid supercapacitor Flexible energy storage

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