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Control of interfacial reaction and defect formation in Gd/Bi_(2)Te_(2.7)Se_(0.3) composites with excellent thermoelectric and magnetocaloric properties

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Chinese Physics B 2024年第8期33卷 474-481页

作者：薛天畅魏平刘承姗李龙舟朱婉婷聂晓蕾赵文俞 State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of TechnologyWuhan 430070China

The method to combine thermoelectric(TE)and magnetocaloric(MC)cooling techniques lies in developing a new material that simultaneously possesses a large TE and good MC cooling *** this work,using n-type Bi_(2)Te_(2.7)Se_(0.3)(BTS)as the TE base material and Gd as the second-phase MC material,Gd/BTS composites were prepared by the spark plasma sintering *** the composites,interfacial reaction between Gd and BTS was identified,resulting in the formation of Gd Te,which has a large impact on the electron concentration through the adjustment of defect *** MC/TE composite containing 2.5 wt%Gd exhibited a ZT value of 0.6 at 300 K,essentially retaining the original TE performance,while all the composites largely maintained the excellent MC performance of *** work provides a potential pathway to achieving high performance in MC/TE composites.

关键词： thermo-electro-magnetic energy conversion materials interfacial reaction thermoelectric performance magnetic entropy change

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interfacial reaction in squeeze cast SiC_w/AZ91 composites with different binders

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中国有色金属学会会刊：英文版 2001年第2期11卷 217-221页

作者：郑明毅吴昆姚忠凯 Tatsuo Sato Hiroyasu Tezuka Akihiko Kamio School of Materials Science and Engineering Harbin Institute of Technology Department of Metallurgical Engineering Tokyo Institute of Technology Tokyo 152 Japan

The whisker/matrix interfaces in squeeze cast SiC w/AZ91 composites with different binders (silica binder, acid aluminum phosphate binder and without binder), were studied by transmission electron microscopy (TEM) and high resolution electron microscopy (HREM). The SiC w/AZ91 interface is very clean in the composites with no binders. For the composites with acid aluminum phosphate binders or silica binders, there exists fine discrete interfacial reaction products MgO at the interface, and a definite orientation relationship between MgO and SiC w. The interfacial reaction products MgO is unevenly distributed at different parts of the composite ingot with silica binder, and mainly distributed to the interface at the side part of the composite cylinder. While in the SiC w/AZ91 composite with acid aluminum phosphate binder, MgO particles are distributed evenly at the interface in almost all the parts of the composite ingot. [

关键词： SiC whisker magnesium alloy composites binder interfacial reaction

interfacial reaction mechanism of TiBw/Ti6Al4V composites and Inconel 718 alloys by GTAW heat transmission

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Science China(Technological Sciences) 2019年第12期62卷 2293-2301页

作者： GAO YaNan HUANG LuJun SUN Yuan AN Qi ZHANG Jie GENG Lin State Key Laboratory of Advanced Welding and Joining Harbin Institute of TechnologyHarbin 150001China School of Materials Science and Engineering Harbin Institute of TechnologyHarbin 150001China Institute of Metal Research Chinese Academy of SciencesSheryang 110016China

A good joint of Ti Bw/Ti6Al4V composites and Inconel 718 alloys was obtained by Gas Tungsten Arc Welding(GTAW) heat transmission. The interfacial reaction mechanism of joint was investigated and analyzed in details. Owing to the heat input applied on the surface of Ti Bw/Ti6Al4V composites, a solid-state reaction layer appeared at the interface of Ti Bw/Ti6Al4 V composites to Inconel 718 alloys. The thickness of the reaction layer was obviously increased with increasing heat *** of reaction layer mainly depended on the diffusion of elements of Ti and Ni through the interface during welding to form solid solutions and intermetallic compounds(IMCs). The reaction layer can be divided into Ti-rich zone(layer 2) and Nirich zone(layer 1). In Ni-rich zone, relatively coarse dendrites were the predominant, however, more brittle IMCs like Ti2Ni were found in the Ti-rich zone. Micro hardness of reaction layer was much higher than that of base metal. While a slight decrease of hardness was found between Ti-rich zone and Ni-rich zone due to the formation of TiNi.

关键词： TiBw/Ti6Al4V composites Inconel 718 alloys interfacial reaction heat transmission microstructures

interfacial reaction between oxide inclusion and steel matrix deoxidized by Si and Mn at 1473 K

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Journal of Iron and Steel Research International 2018年第1期25卷 1-8页

作者： Xue-liang Zhang Shu-feng Yang Cheng-song Liu Jing-she Li Qing Liu Gang Liu School of Metallurgical and Ecological Engineering University of Science and Technology BeijingBeijing 100083 China Beijing Key Laboratory of Special Melting and Preparationof High-End Metals Beijing 100083 China The State Key Laboratory of Refractories and MetallurgyWuhan University of Science and Technology Wuhan 430081 Hubei China

An improved diffusion couple method was used to simulate the dynamic process of the solid-state reaction at the interface between oxide inclusions and a steel matrix deoxidized by Si and Mn during heat treatment at 1473 K. Experimental results indicated that good contact between the oxide and steel matrix was attained after pre-treatment at 1673 K. In addition, the reaction between the oxide and steel matrix at 1673 K was suppressed, and the effect of this reaction on the diffusion couple experiments at 1473 K was minimized. In the diffusion couple experiments, the diffusion of oxygen from the oxide to the steel matrix resulted in the precipitation of fine oxide particles and a decrease in the Mn content in the steel matrix near the interface after heat treatment at 1473 K. With increasing heat treatment time, the widths of the particle precipitation zone （PPZ） and Mn-depleted zone （MDZ） gradually increased. In addition, the solid-state reaction at the interface between the oxide and steel matrix was intense, and the widths of the PPZ and MDZ increased rapidly during the 0-20 h stage of heat treatment, especially during the 0-5 h stage. The interfacial reaction was retarded, and the rates of width expansion of PPZ and MDZ decreased with increasing heat treatment time.

关键词： Oxide inclusion Diffusion couple Heat treatment Solid-state reaction interfacial reaction

interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature

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China Welding 2023年第2期32卷 23-31页

作者：宋立志肖勇奚邦富李佳琪张建 School of Materials Science and Engineering Wuhan University of TechnologyWuhan 430070China State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of TechnologyWuhan 430070China

Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.

关键词： 5A06-Al alloy Sn-Ti-Ga solder low-temperature soldering interfacial reaction mechanical properties

Solid-State interfacial reaction between Eutectic Au-Ge Solder and Cu/Ni(P)/Au Metalized Ceramic Substrate and Its Suppression

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Journal of Materials Science & Technology 2015年第5期31卷 445-452页

作者： F.Q.Lang H.Yamaguchi H.Nakagawa H.Sato Advanced Power Electronics Research Center(ADPERC) National Institute of Advanced Industrial Science and Technology(AIST).Central 21-1-1UmezonoTsukubaIbaraki 305-8568.Japan

Eutectic Au-12 Ge solder was employed to bond the SiC power devices to a Si3N4/Cu/Ni（P）/Au multilayered *** high-temperature reliability of the bond was investigated in detail at 200,250,300 and 330 ℃,*** and Ni5Ge3intermetallic compounds（IMCs） were identified at the Au-12Ge/Ni（P） interface by micro X-ray diffraction（μXRD） and scanning electron microscopy（SEM）equipped with energy dispersive X-ray analysis（EDX）.The growth of the Ni-Ge IMCs was dominated by Ni5Ge3layer,which formed at the Ni5Ge3/NiGe interface by outward diffusion of Ni from the Ni（P） *** activation energy of the total Ni-Ge IMCs growth was 66 kJ/*** shear strength of the bond was tested at both 25 ℃ and the aging temperatures,*** shear strength decreased slightly after aging at 200 and 250 ℃.The shear strength tested at 250 ℃ was 46 MPa after aging at 250 ℃ for 3000 *** shear strength aged at 300 and 330 ℃ rapidly decreased with aging time due to the rapid growth of the *** slow down the interfacial reaction between the high temperature solder and the Ni（P）layer,an approximately 200 nm-thick Ta/TaN/Ta new diffusion barrier（DB） was deposited on the *** by transmission electron microscopy（TEM） equipped with EDX,reveals that the Ta/TaN/Ta DB was bonded well to the Ni（P） layer and the *** temperature storage test at 330 ℃ for1500 h reveals that the bond of the SiC devices maintained its high shear strength of approximately56 MPa without *** new DB effectively suppressed the interfacial reaction between the Au-12 Ge solder and the Ni（P） layer of the substrate.

关键词： High-temperature solder interfacial reaction Activ

Wetting Behaviors and interfacial reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

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Journal of Materials Science & Technology 2010年第2期26卷 156-162页

作者： Qiulian Zeng Jianjun Guo Xiaolong Gu Xinbing Zhao Xiaogang Liu Zhejiang Province Key laboratory of Soldering &: Brazing Materials and Technology Zhejiang Metallurgical Research Institute Hangzhou 310011 China Department of Materials Science and Engineering Zhejiang University Hangzhou 310027 China

Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-SCu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400℃. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360℃. In static liquid-state interracial reaction, the types and thickness of the intermetallic compounds （IMCs） of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn/Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.

关键词： Wetting interfacial reaction High temperature lead-free solder Sn-10Sb-5Cu solder

Kinetics and Mechanism of interfacial reaction in a SiC_f/Ti Composite

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Journal of Materials Science & Technology 2003年第5期19卷 407-410页

作者： Guoxing ZHANG, Qiang KANG, Nanlin SHI, Geping LI and Dong LIInstitute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China Inst. of Metal Res. Chinese Acad. of Sci. Shenyang 110016 China

In order to evaluate the interfacial reaction, a SiCf/Ti (TA1) composite was fabricated by a vacuum hot pressing method and then heat-treated in vacuum at 800℃ for up to 100 h. The elemental distributions of C, Si and Ti at the interfacial reaction zone were investigated. It was found that the reaction zone occurs during the fabrication process and continuously grows at high temperature because the Si and C atoms diffuse from SiC fibers to the matrix and Ti atoms diffuse in the opposite direction. The growth of the reaction zone is diffusion controlled and the mechanism of the reaction can be described by a reactive diffusion model of solid-state growth of an AmBn layer between two elementary substances A and B.

关键词： SiCf/Ti (TA1) composite interfacial reaction Diffusion control

Effect of Si content on interfacial reaction and properties between solid steel and liquid aluminum

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Transactions of Nonferrous Metals Society of China 2021年第9期31卷 2570-2584页

作者： Tian-peng ZOU Gao-yang YU Shu-hai CHEN Ji-hua HUANG Jian YANG Zhi-yi ZHAO Ji-ping RONG Jin YANG School of Materials Science and Engineering University of Science and Technology BeijingBeijing 100083China School of Materials Engineering Shanghai University of Engineering ScienceShanghai 201620China

The effect of Si content on the microstructures and growth kinetics of intermetallic compounds(IMCs)formed during the initial interfacial reaction(<10 s)between solid steel and liquid aluminum was investigated by a th... 详细信息

The effect of Si content on the microstructures and growth kinetics of intermetallic compounds(IMCs)formed during the initial interfacial reaction(interfacial mechanical properties was revealed by a high-frequency induction *** results showed that IMCs layers mainly consisted ofη-Fe_(2)Al_(5)andθ-Fe_(4)Al_(13).The addition of Si reduced the thickness of the IMCs *** growth of theηphase was governed by the diffusion process when adding 2 wt.%Si to the aluminum *** 5 wt.%or 8 wt.%Si was added to aluminum,the growth was governed by both the diffusion process and interfacial reaction,and ternary phaseτ1/τ9-(Al,Si)_(5)Fe_(3)was formed in theη*** apparent activation energies of theηphase decreased gradually with increasing Si *** joint with pure aluminum metal had the highest tensile strength and impact energy.

关键词： intermetallic compounds Si content solid steel liquid aluminum interfacial reaction mechanical properties